摘要:
Disclosed herein is a Printed Circuit Board (PCB) having embedded resistors and a method of manufacturing the same, in which contact pads are formed by filling via holes formed on electrode pads with oxidation-resistant conductive material, and resistors are formed on the contact pads. Accordingly, erosion that occurs between the electrode pads and the resistors can be prevented using the contact pads made of oxidation-resistant conductive material, and connections between circuits also can be realized. Furthermore, resistors are formed on a flat plane without any difference in height, attributable to the electrode pads, and thus differences between the resistance values of the built-in resistors can be greatly reduced.
摘要:
A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.
摘要:
A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.
摘要:
Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.
摘要:
A fabrication method of an epilayer structure for InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency. It relates to a P-p-n-N InGaAsP/InP ridge waveguide phase modulator fabricated to be that the phase change of the TE-mode is linearly proportional to the reverse bias voltage at 1.55 μm wavelength. A method for fabricating an epilayer structure for achieving the optical confinement in the vertical direction of an InGaAsP/InP waveguide phase modulator, characterized by comprising the steps of: forming a first cladding layer of N-InP on an N+-InP substrate; forming a first waveguide layer of n-InGaAsP and a second waveguide layer of p-InGaAsP in sequence on the first cladding layer; forming a second cladding layer of P-InP and a third cladding layer of P-InP in sequence on the second waveguide layer; and forming an electrode layer of p+InGaAs on the third cladding layer.
摘要:
A substrate for a semiconductor device is provided. The substrate includes a first metal line, a second metal line, a metal support part, a first insulating part, and a second insulating part. The first metal line is electrically connected to a first electrode of the semiconductor device. The second metal line is electrically connected to a second electrode of the semiconductor device and spaced apart from the first metal line. The metal support part is disposed between the first metal line and the second metal line. The first insulating part is disposed between the first metal line and the metal support part and configured to electrically insulate the first metal line from the metal support part. The second insulating part is disposed between the second metal line and the metal support part and configured to electrically insulate the second metal line from the metal support part.
摘要:
A substrate for a semiconductor device is provided. The substrate includes a first metal line, a second metal line, a metal support part, a first insulating part, and a second insulating part. The first metal line is electrically connected to a first electrode of the semiconductor device. The second metal line is electrically connected to a second electrode of the semiconductor device and spaced apart from the first metal line. The metal support part is disposed between the first metal line and the second metal line. The first insulating part is disposed between the first metal line and the metal support part and configured to electrically insulate the first metal line from the metal support part. The second insulating part is disposed between the second metal line and the metal support part and configured to electrically insulate the second metal line from the metal support part.
摘要:
Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member (S120), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S130), step for forming copper cladding coated with an adhesive on the insulating member (S140), step for applying heat and/or pressure to the copper cladding (S150), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S160). The step (S150) can comprise a step (S240) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S250) for applying copper cladding on respective surfaces of the inter-adhesive.