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公开(公告)号：US07399658B2
公开(公告)日：2008-07-15
申请号：US11459317
申请日：2006-07-21
IPC分类号： H01L21/00
CPC分类号： H01L23/49861 , H01L23/3675 , H01L25/16 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/19105 , H01L2924/3025 , H01L2924/00
摘要： A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of leads. A first molding material is formed in the leadframe to expose the upper surface of the die pad and the upper surfaces of the plurality of leads.
摘要翻译： 制造用于半导体封装的预成型引线框架的方法包括提供具有管芯焊盘和多个引线的引线框架。 在引线框架中形成第一模塑材料以暴露芯片焊盘的上表面和多个引线的上表面。
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公开(公告)号：US20070111379A1
公开(公告)日：2007-05-17
申请号：US11459317
申请日：2006-07-21
IPC分类号： H01L21/00
CPC分类号： H01L23/49861 , H01L23/3675 , H01L25/16 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/19105 , H01L2924/3025 , H01L2924/00
摘要： A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of leads. A first molding material is formed in the leadframe to expose the upper surface of the die pad and the upper surfaces of the plurality of leads.
摘要翻译： 制造用于半导体封装的预成型引线框架的方法包括提供具有管芯焊盘和多个引线的引线框架。 在引线框架中形成第一模塑材料以暴露芯片焊盘的上表面和多个引线的上表面。
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公开(公告)号：US07863730B2
公开(公告)日：2011-01-04
申请号：US10921377
申请日：2004-08-18
申请人： Il Kwon Shim , Kambhampati Ramakrishna , Diane Sahakian , Seng Guan Chow , Dario S. Filoteo, Jr. , Virgil Cotoco Ararao
发明人： Il Kwon Shim , Kambhampati Ramakrishna , Diane Sahakian , Seng Guan Chow , Dario S. Filoteo, Jr. , Virgil Cotoco Ararao
IPC分类号： H01L23/367 , H01L21/98
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3128 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01033 , H01L2924/01079 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/16251 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00012 , H01L2924/00
摘要： A method for forming a heat spreader, and the heat spreader formed thereby, are disclosed. An array heat spreader having a plurality of connected heat spreader panels is formed. Slots are formed in opposing sides of the heat spreader panels. Legs are formed on and extending downwardly from each of the heat spreader panels in at least an opposing pair of the slots on the heat spreader panels. The legs are integral with the respective heat spreader panels from which they depend.
摘要翻译： 公开了一种形成散热器的方法和由此形成的散热器。 形成具有多个连接的散热板的阵列散热器。 狭槽形成在散热板的相对侧。 在散热器面板上的至少一对相对的槽中，每个散热板上都形成有腿。 腿与它们依赖的相应散热器面板是一体的。
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公开(公告)号：US20070093000A1
公开(公告)日：2007-04-26
申请号：US11163547
申请日：2005-10-21
IPC分类号： H01L21/00
CPC分类号： H01L25/16 , H01L23/3675 , H01L23/49861 , H01L2224/16245 , H01L2224/32245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/19105 , H01L2924/3025 , H01L2924/00
摘要： A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of terminal leads. A first molding material is formed in the leadframe to expose the upper surface of the die pad and the upper surfaces of the plurality of terminal leads. A die is connected to die pad and the plurality of terminal leads.
摘要翻译： 制造用于半导体封装的预成型引线框架的方法包括提供具有管芯焊盘和多个端子引线的引线框架。 第一成型材料形成在引线框架中以暴露管芯焊盘的上表面和多个端子引线的上表面。 芯片连接到管芯焊盘和多个端子引线。
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公开(公告)号：US08558399B2
公开(公告)日：2013-10-15
申请号：US13443067
申请日：2012-04-10
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3135 , H01L23/49861 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/96 , H01L24/97 , H01L25/0652 , H01L25/165 , H01L2224/12105 , H01L2224/24137 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A dual molded multi-chip package system is provided including forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto, mounting a semiconductor device over the first encapsulation and connected to the lead, and forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
摘要翻译： 提供了一种双模塑多芯片封装系统，包括形成嵌入式集成电路封装系统，其具有部分覆盖第一集成电路管芯的第一封装和与其连接的引线，将半导体器件安装在第一封装上并连接到引线上，以及 在半导体器件和嵌入式集成电路封装系统上形成第二封装。
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6.发明授权Integrated circuit package system with flexible substrate and recessed package 有权集成电路封装系统，具有柔性基板和凹槽封装公开(公告)号：US08050047B2
公开(公告)日：2011-11-01
申请号：US12136002
申请日：2008-06-09
CPC分类号： H01L25/105 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
摘要翻译： 集成电路封装系统包括：提供具有折叠的柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的凹入封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。
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7.发明申请INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND MOUNDED PACKAGE 有权集成电路封装系统，具有灵活的基板和密封的封装公开(公告)号：US20090016033A1
公开(公告)日：2009-01-15
申请号：US12136007
申请日：2008-06-09
IPC分类号： H05K1/18
CPC分类号： H05K1/189 , H01L23/49816 , H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/105 , H01L25/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/141 , H05K1/147 , H05K3/284 , H05K3/3436 , H05K2201/042 , H05K2201/056 , H05K2201/10515 , H05K2201/1053 , H05K2203/1316 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/45099
摘要： An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
摘要翻译： 集成电路封装系统包括：提供柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的堆叠封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。
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8.发明授权Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides 有权半导体堆叠封装组件，其在上侧和下侧具有暴露的衬底表面公开(公告)号：US07372141B2
公开(公告)日：2008-05-13
申请号：US11395529
申请日：2006-03-31
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/552 , H01L24/73 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/85013 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/19106 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other, that is, the die attach sides of the package substrates face one another, and the “land” sides of the substrates face away from one another. Z-interconnection of the packages is by wire bonds connecting the first and second package substrates. The assembly is encapsulated in such a way that both the second package substrate (one side of the assembly) and a portion of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made. One or more additional components may be stacked over the land side of the first package substrate.
摘要翻译： 堆叠的封装组件包括第一和第二堆叠封装，每个封装具有至少一个管芯，该裸管固定到封装衬底的管芯附着侧并与其电连接。 一个封装相对于另一个封装反转，即，封装基板的管芯附接面彼此面对，并且基板的“焊盘”侧面彼此背离。 封装的Z-互连是通过连接第一和第二封装衬底的引线键合。 组件以这样的方式封装，使得第二封装衬底（组件的一侧）和第一封装衬底的一部分（在组件的相对侧）被暴露，使得第二级互连和互连 可以制造组件。 一个或多个附加部件可以堆叠在第一封装基板的接地侧上。
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公开(公告)号：US06861288B2
公开(公告)日：2005-03-01
申请号：US10676736
申请日：2003-09-30
CPC分类号： H01L25/0657 , H01L24/73 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2225/06582 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A method for fabricating a stacked semiconductor package includes providing a substrate and mounting a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is then mounted on the interposer.
摘要翻译： 一种用于制造堆叠半导体封装的方法，包括提供衬底并将第一半导体器件安装在衬底上。 插入器被支撑在与衬底相对的第一半导体器件的上方。 插入器电连接到基板。 然后将第二半导体器件安装在插入器上。
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10.发明授权Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof 有权具有密封腔内的部件的集成电路封装系统及其制造方法公开(公告)号：US08309397B2
公开(公告)日：2012-11-13
申请号：US13235755
申请日：2011-09-19
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/3135 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L31/0203 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.
摘要翻译： 一种用于制造密封腔的集成电路封装系统的方法，包括：提供插入器; 形成第一集成电路封装，其具有具有封装腔的反向底部端子和所述插入件; 以及将组件附接到所述密封剂腔中的所述插入件上。
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