公开(公告)号：US20220196507A1

公开(公告)日：2022-06-23

申请号：US17133554

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Victor POLYANKO ,  Mark BIANCO ,  Bijoyraj SAHU ,  Minh T.D. LE ,  Carlos ALVIZO FLORES ,  Javier AVALOS GARCIA ,  Adriana LOPEZ INIGUEZ ,  Luz Karine SANDOVAL GRANADOS ,  Michael BERKTOLD ,  Damion SEARLS ,  Jin YANG ,  David SHIA ,  Samer MELHEM ,  Jeffrey Ryan CONNER ,  Hemant DESAI ,  John RAATZ ,  Richard DISCHLER ,  Bergen ANDERSON ,  Eric W. BUDDRIUS ,  Kenan ARIK ,  Barrett M. FANEUF ,  Lianchang DU ,  Yuehong FAN ,  Shengzhen ZHANG ,  Yuyang XIA ,  Jun ZHANG ,  Yuan Li ,  Catharina BIBER ,  Kristin L. WELDON ,  Brendan T. PAVELEK

IPC: G01M3/04 ,  G01M3/16 ,  G01M3/20 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

公开(公告)号：US20220113773A1

公开(公告)日：2022-04-14

申请号：US17560630

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Lunyu MA ,  Shahin AMIRI ,  Casey CARTE ,  Mirui WANG ,  Damion SEARLS ,  Tamara J. LOW FOON

IPC: G06F1/18 ,  G06F13/42

Abstract: An apparatus is described. The apparatus includes an add-in card having multiple semiconductor chip packages mounted to a printed circuit board of the add-in card. The add-in card includes separate dedicated heat sinks respectively coupled to the semiconductor chip packages with spring loaded fixturing elements, a heat pipe coupled to a plurality of the heat sinks.

公开(公告)号：US20190182958A1

公开(公告)日：2019-06-13

申请号：US16281045

申请日：2019-02-20

Applicant: Intel Corporation

Inventor： Damion SEARLS ,  Weston C. ROTH ,  Margaret D. RAMIREZ ,  James D. JACKSON ,  Rainer E. THOMAS ,  Charles A. GEALER

IPC: H05K1/18 ,  H01L23/498 ,  H01L21/56 ,  H01L25/03

CPC classification number: H05K1/181 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.