公开(公告)号：US09748199B2

公开(公告)日：2017-08-29

申请号：US15062298

申请日：2016-03-07

Applicant: Intel Corporation

Inventor： Hemanth Dhavaleswarapu ,  Zhihua Li ,  Joseph Petrini ,  Steven B. Roach ,  Shankar Devasenathipathy ,  George Kostiew ,  Amram Eitan

IPC: B23K31/02 ,  H01L23/00 ,  H05K3/34 ,  B23K1/00 ,  B23K3/04 ,  B23K37/00 ,  B23K3/08 ,  B23K20/02 ,  B23K20/00 ,  B23K20/26 ,  B23K35/02 ,  B23K101/42 ,  B33Y80/00

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K3/085 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/26 ,  B23K35/0244 ,  B23K37/003 ,  B23K2101/42 ,  B33Y80/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/7555 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81948 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/1121 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

公开(公告)号：US20250006691A1

公开(公告)日：2025-01-02

申请号：US18345695

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： George Robinson ,  Mohamed Elhebeary ,  Divya Jain ,  Viet Chau ,  Zewei Wang ,  Mukund Ayalasomayajula ,  Suraj Maganty ,  Tingting Gao ,  Andrew Wayne Carlson ,  Khalid Mohammad Abdelaziz ,  Craig Jerome Madison ,  Edvin Cetegen ,  Joseph Petrini

IPC: H01L23/00

Abstract: Compliant inserts for pin dipping processes are disclosed herein. An example apparatus disclosed herein includes a pin array to transfer material to a package substrate of an integrated circuit package, a cover plate, an elastic insert to be disposed between the cover plate and the pin array.

公开(公告)号：US20160211238A1

公开(公告)日：2016-07-21

申请号：US15062298

申请日：2016-03-07

Applicant: Intel Corporation

Inventor： Hemanth Dhavaleswarapu ,  Zhihua Li ,  Joseph Petrini ,  Steven B. Roach ,  Shankar Devasenathipathy ,  George S. Kostiew ,  Amram Eitan

IPC: H01L23/00 ,  B23K20/00 ,  B23K35/02 ,  B23K20/02 ,  B23K20/26

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K3/085 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/26 ,  B23K35/0244 ,  B23K37/003 ,  B23K2101/42 ,  B33Y80/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/7555 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81948 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/1121 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

公开(公告)号：US11551994B2

公开(公告)日：2023-01-10

申请号：US16139401

申请日：2018-09-24

Applicant: Intel Corporation

Inventor： Kelly Lofgreen ,  Chia-Pin Chiu ,  Joseph Petrini ,  Edvin Cetegen ,  Betsegaw Gebrehiwot ,  Feras Eid

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/00

Abstract: Embodiments include an electronic system and methods of forming an electronic system. In an embodiment, the electronic system may include a package substrate and a die coupled to the package substrate. In an embodiment, the electronic system may also include an integrated heat spreader (IHS) that is coupled to the package substrate. In an embodiment the electronic system may further comprise a thermal interface pad between the IHS and the die. In an embodiment the die is thermally coupled to the IHS by a liquid metal thermal interface material (TIM) that contacts the thermal interface pad.

公开(公告)号：US11464139B2

公开(公告)日：2022-10-04

申请号：US16180499

申请日：2018-11-05

Applicant: Intel Corporation

Inventor： Kelly Lofgreen ,  Joseph Petrini ,  Todd Coons ,  Christopher Wade Ackerman ,  Edvin Cetegen ,  Yang Jiao ,  Michael Rutigliano ,  Kuang Liu

IPC: H05K7/20

Abstract: A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

公开(公告)号：US09282650B2

公开(公告)日：2016-03-08

申请号：US14132883

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Hemanth Dhavaleswarapu ,  Zhihua Li ,  Joseph Petrini ,  Steven B. Roach ,  Shankar Devasenathipathy ,  George Kostiew ,  Amram Eitan

IPC: B23K37/00 ,  H05K3/34 ,  B23K1/00 ,  B23K3/04 ,  H01L23/00 ,  B23K3/08 ,  B23K20/02

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K3/085 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/26 ,  B23K35/0244 ,  B23K37/003 ,  B23K2101/42 ,  B33Y80/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/7555 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81948 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/1121 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

Abstract translation: 公开了热压接（TCB）工艺冷却歧管，TCB工艺系统和使用冷却歧管的TCB方法的实施例。 在一些实施例中，冷却歧管包括通过挡板与混合室分离的预混合室。 挡板可以包括通过挡板形成的至少一个同心图案，使得预混合室中的主要冷却流体基本均匀地分布到混合室。 预混合室可以连接到主冷却流体源。 混合室可以具有被配置为接受主冷却流体的输入和输出以输出主冷却流体的输入。