公开(公告)号：US20240175917A1

公开(公告)日：2024-05-30

申请号：US18071399

申请日：2022-11-29

Applicant: Intel Corporation

Inventor： Ruben NUNEZ BLANCO ,  Christopher ACKERMAN ,  Paul DIGLIO ,  Varun NARAYAN ,  Craig YOST ,  Jensen STENBERG ,  Kelly LOFGREEN ,  Joseph PETRINI ,  Sami ALELYANI

IPC: G01R31/28 ,  H01L23/467

CPC classification number: G01R31/2877 ,  G01R31/2863 ,  H01L23/467

Abstract: This disclosure describes systems, methods, and devices related to preventing water leakage from jet impingement applied to an integrated circuit under test. An integrated circuit testing apparatus for applying jet impingement to an integrated circuit may include an impingement chamber in contact with an integrated circuit being tested, the impingement chamber comprising water associated with cooling the integrated circuit; and an actuator-driven thermal management block including an air inlet configured to direct a flow of air into an immediate test environment for the integrated circuit to generate a positive pressure differential with respect to the water in the impingement chamber to prevent leakage of the water from the impingement chamber.

公开(公告)号：US20220011529A1

公开(公告)日：2022-01-13

申请号：US17482485

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Sufi AHMED ,  Vineeth ABRAHAM ,  Eric MORET ,  Paul DIGLIO

IPC: G02B6/42

Abstract: The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die. A corresponding system is also disclosed herein.

公开(公告)号：US20240111098A1

公开(公告)日：2024-04-04

申请号：US18488074

申请日：2023-10-17

Applicant: Intel Corporation

Inventor： Vineeth ABRAHAM ,  Wesley MORGAN ,  Eric MORET ,  Paul DIGLIO ,  Srikant NEKKANTY

IPC: G02B6/30 ,  G02B6/42

CPC classification number: G02B6/30 ,  G02B6/4224

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

公开(公告)号：US20240068572A1

公开(公告)日：2024-02-29

申请号：US17895104

申请日：2022-08-25

Applicant: Intel Corporation

Inventor： Paul DIGLIO ,  Craig YOST ,  Christopher Wade ACKERMAN

IPC: F16J15/328

CPC classification number: F16J15/328

Abstract: The present disclosure is directed to a system having a first loading component and a second loading component for applying load to a device during a test of the device, the first loading component is configured to be moveable with respect to the second loading component. The system includes a seal member arranged between the first loading component and the second loading component, the seal member is adapted to engage the device diming testing so as to apply a load against the device during testing and provide sealing around a cavity positioned below the first loading component and above the device.

公开(公告)号：US20220011517A1

公开(公告)日：2022-01-13

申请号：US17482482

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Vineeth ABRAHAM ,  Wesley MORGAN ,  Eric MORET ,  Paul DIGLIO ,  Srikant NEKKANTY

IPC: G02B6/30

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

公开(公告)号：US20210351106A1

公开(公告)日：2021-11-11

申请号：US16871424

申请日：2020-05-11

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tewodros WONDIMU ,  Ying-Feng PANG ,  Muhammad AHMAD ,  Paul DIGLIO ,  David SHIA ,  Pooya TADAYON

IPC: H01L23/427 ,  G01R31/26 ,  B05B1/14

Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

公开(公告)号：US20230314733A1

公开(公告)日：2023-10-05

申请号：US17710669

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Eric MORET ,  Paul DIGLIO ,  Wesley MORGAN

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/4257

Abstract: Embodiments disclosed herein include an electronic system. In an embodiment, the electronic system comprises a board, and a package substrate coupled to the board. In an embodiment, a photonics integrated circuit (PIC) is coupled to the package substrate. In an embodiment, an optical lens is on the PIC, and an optical connector is on the board. In an embodiment, the optical connector passes through an opening through the package substrate and is optically coupled with the optical lens on the PIC.

公开(公告)号：US20230260870A1

公开(公告)日：2023-08-17

申请号：US18137987

申请日：2023-04-21

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tewodros WONDIMU ,  Ying-Feng PANG ,  Muhammad AHMAD ,  Paul DIGLIO ,  David SHIA ,  Pooya TADAYON

IPC: H01L23/427 ,  B05B1/14 ,  G01R31/26

CPC classification number: H01L23/427 ,  B05B1/14 ,  G01R31/2642

Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

公开(公告)号：US20210391244A1

公开(公告)日：2021-12-16

申请号：US16898196

申请日：2020-06-10

Applicant: Intel Corporation

Inventor： Chandra Mohan JHA ,  Pooya TADAYON ,  Aastha UPPAL ,  Weihua TANG ,  Paul DIGLIO ,  Xavier BRUN

IPC: H01L23/498 ,  H01L23/373 ,  H01L23/522 ,  H01L21/56 ,  H01L21/78

Abstract: Embodiments disclosed herein comprise a die and methods of forming a die. In an embodiment, a die comprises, a die substrate, wherein the die substrate has a first thermal conductivity, and a first layer over the die substrate, wherein the first layer has a second thermal conductivity that is greater than the first thermal conductivity. In an embodiment, the die further comprises a second layer over the first layer, wherein the second layer comprises transistors.

公开(公告)号：US20210348624A1

公开(公告)日：2021-11-11

申请号：US17030141

申请日：2020-09-23

Applicant: Intel Corporation

Inventor： Paul DIGLIO ,  Pooya TADAYON ,  David SHIA

IPC: F04D29/58

Abstract: Embodiments disclosed herein include temperature control systems. In an embodiment, a temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber, and where the fluid reservoir is between the vacuum source and the spray chamber.