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    Solder contacts for socket assemblies
    4.
    发明授权
    Solder contacts for socket assemblies 有权

    公开(公告)号：US10321573B2

    公开(公告)日：2019-06-11

    申请号：US15855808

    申请日：2017-12-27

    Applicant: INTEL CORPORATION

    Inventor： Fay Hua ,  Hong Xie ,  Gregorio R. Murtagian ,  Amit Abraham ,  Alan C. McAllister ,  Ting Zhong

    IPC: H05K1/11 ,  H05K3/40 ,  H05K1/18 ,  H01R12/52 ,  H01L23/498 ,  H01R33/76 ,  H05K3/34

    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

    Interconnects including liquid metal
    7.
    发明授权
    Interconnects including liquid metal 有权
    互连件包括液态金属

    公开(公告)号：US09523713B2

    公开(公告)日：2016-12-20

    申请号：US13903874

    申请日：2013-05-28

    Applicant: INTEL CORPORATION

    Inventor： Youngseok Oh ,  Joe F. Walczyk ,  Jin Yang ,  Pooya Tadayon ,  Ting Zhong

    IPC: G01R1/067 ,  G01R1/073

    CPC classification number: G01R1/06783 ,  G01R1/07307 ,  Y10T29/49124

    Abstract: Embodiments of the present disclosure are directed to interconnects that include liquid metal, and associated techniques and configurations. The individual interconnects may electrically couple a contact of a printed circuit board (PCB) to a contact of a device under test (DUT). The interconnect may be disposed in or on the PCB. In various embodiments, the interconnect may include a carrier that defines a well (e.g., an opening in the carrier), and the liquid metal may be disposed in the well. In some embodiments, the contact of the DUT, or a contact of an intermediary device, may extend into the well and directly contact the liquid metal. In other embodiments, a flex circuit may be disposed over the well to seal the well. The flex circuit may include a conductive pad to electrically couple the liquid metal to the contact of the DUT. Other embodiments may be described and claimed.

    Abstract translation: 本公开的实施例涉及包括液态金属以及相关技术和配置的互连。 各个互连可以将印刷电路板（PCB）的触点电耦合到被测器件（DUT）的触点。 互连可以设置在PCB中或PCB上。 在各种实施例中，互连可以包括限定阱（例如，载体中的开口）的载体，并且液体金属可以设置在阱中。 在一些实施例中，DUT或中间装置的触点的接触可以延伸到井中并直接接触液态金属。 在其他实施例中，柔性电路可以设置在井上以密封井。 柔性电路可以包括用于将液体金属电耦合到DUT的触点的导电焊盘。 可以描述和要求保护其他实施例。

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