公开(公告)号：US20050078451A1

公开(公告)日：2005-04-14

申请号：US10683924

申请日：2003-10-10

申请人： Ioan Sauciuc ,  Gregory Chrysler ,  Ravi Mahajan

发明人： Ioan Sauciuc ,  Gregory Chrysler ,  Ravi Mahajan

IPC分类号： G06F1/20 ,  H03K17/955 ,  H05K7/20

CPC分类号： G06F1/20 ,  G06F1/206 ,  G06F2200/201

摘要： A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber and maintain proper functioning of the vapor chamber, thus keeping the microelectronic die cooled. A controller receives input from five temperature sensors, and utilizes the input to control current to the thermoelectric module and voltage/current to a motor that drives a fan and provides additional cooling. A current sensor allows the controller to monitor and limit power provided to the thermoelectric module.

摘要翻译： 提供了一种计算机系统及其冷却方法。 蒸气室用作来自微电子管芯的热量的散热器。 热电模块用于冷却蒸气室并保持蒸气室的适当功能，从而保持微电子模具的冷却。 控制器从五个温度传感器接收输入，并利用输入来控制热电模块的电流和驱动风扇的电机的电压/电流，并提供额外的冷却。 电流传感器允许控制器监测和限制提供给热电模块的功率。

公开(公告)号：US20070164427A1

公开(公告)日：2007-07-19

申请号：US11322495

申请日：2005-12-30

申请人： Ioan Sauciuc ,  Ravi Mahajan

发明人： Ioan Sauciuc ,  Ravi Mahajan

IPC分类号： H01L23/34

CPC分类号： H01L23/427 ,  F28D15/00 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a heat pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the heat pipe.

摘要翻译： 本发明公开了一种将液态金属合金限制在闭环系统内的方法; 将所述液态金属合金的第一部分分布在所述闭环系统内的空腔中; 打开电磁体以产生磁场以渗透空腔的柔性侧壁; 将空腔中的液态金属合金吸引到电磁体以膨胀柔性侧壁; 引起所述液态金属合金的第二部分从所述闭环系统内的热管的入口端进入所述空腔; 关闭电磁铁; 将空腔中的液态金属合金排斥离开电磁体以收缩柔性侧壁; 并且引起液态金属合金的第三部分将空腔排出到热管的出口端。

公开(公告)号：US07764499B2

公开(公告)日：2010-07-27

申请号：US12454413

申请日：2009-05-18

申请人： Ioan Sauciuc ,  Ravi Mahajan

发明人： Ioan Sauciuc ,  Ravi Mahajan

IPC分类号： H05K7/20 ,  F04B43/14

CPC分类号： H01L23/427 ,  F28D15/00 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the pipe.

摘要翻译： 本发明公开了一种将液态金属合金限制在闭环系统内的方法; 将所述液态金属合金的第一部分分布在所述闭环系统内的空腔中; 打开电磁体以产生磁场以渗透空腔的柔性侧壁; 将空腔中的液态金属合金吸引到电磁体以膨胀柔性侧壁; 引起所述液态金属合金的第二部分从所述闭环系统内的管的入口端进入所述空腔; 关闭电磁铁; 将空腔中的液态金属合金排斥离开电磁体以收缩柔性侧壁; 并且引起所述液态金属合金的第三部分离开所述腔到所述管的出口端。

公开(公告)号：US07539016B2

公开(公告)日：2009-05-26

申请号：US11322495

申请日：2005-12-30

申请人： Ioan Sauciuc ,  Ravi Mahajan

发明人： Ioan Sauciuc ,  Ravi Mahajan

IPC分类号： H05K7/20 ,  F04B43/14

CPC分类号： H01L23/427 ,  F28D15/00 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the pipe.

摘要翻译： 本发明公开了一种将液态金属合金限制在闭环系统内的方法; 将所述液态金属合金的第一部分分布在所述闭环系统内的空腔中; 打开电磁体以产生磁场以渗透空腔的柔性侧壁; 将空腔中的液态金属合金吸引到电磁体以膨胀柔性侧壁; 引起所述液态金属合金的第二部分从所述闭环系统内的管的入口端进入所述空腔; 关闭电磁铁; 将空腔中的液态金属合金排斥离开电磁体以收缩柔性侧壁; 并且引起所述液态金属合金的第三部分离开所述腔到所述管的出口端。

公开(公告)号：US20090084931A1

公开(公告)日：2009-04-02

申请号：US11862444

申请日：2007-09-27

申请人： Ioan Sauciuc ,  Gregory M. Chrysler ,  Ravi Mahajan

发明人： Ioan Sauciuc ,  Gregory M. Chrysler ,  Ravi Mahajan

IPC分类号： B22D27/04

CPC分类号： B22D27/04 ,  B22D17/2218

摘要： A liquid cooling device for a die including a support block supporting a plurality of substantially vertical channels transporting fluid to and from a bare die surface for heat removal. The device is mounted on top of a bare die using a frame or spring. In another embodiment, the device allows thermoelectric cooling of a dedicated fluid line.

摘要翻译： 一种用于模具的液体冷却装置，其包括支撑块，所述支撑块支撑多个基本上垂直的通道，以将流体输送到裸露模具表面并从裸模表面传出流体以进行散热。 该装置使用框架或弹簧安装在裸露模具的顶部。 在另一个实施例中，该装置允许专用流体管线的热电冷却。

公开(公告)号：US20050029637A1

公开(公告)日：2005-02-10

申请号：US10638038

申请日：2003-08-08

申请人： Chuan Hu ,  Gregory Chrysler ,  Ravi Mahajan

发明人： Chuan Hu ,  Gregory Chrysler ,  Ravi Mahajan

IPC分类号： H01L23/38 ,  H01L23/495

CPC分类号： H01L23/38 ,  H01L2224/73253 ,  H01L2924/16195

摘要： A microelectronic die is provided having an integrated thermoelectric module. The microelectronic die has a die substrate, a microelectronic circuit formed on a front side of the die substrate, and the thermoelectric module on a backside of the die substrate. Vias in the substrate interconnect the thermoelectric module with power and ground planes on the front side of the die substrate.

摘要翻译： 提供具有集成热电模块的微电子管芯。 微电子管芯具有管芯基板，形成在管芯基板的前侧的微电子电路，以及位于管芯基板背面的热电模块。 衬底中的通孔将热电模块与模具衬底的前侧上的电源和接地平面互连。

公开(公告)号：US20060127672A1

公开(公告)日：2006-06-15

申请号：US11355698

申请日：2006-02-15

申请人： Gregory Chrysler ,  Abhay Watwe ,  Ravi Mahajan

发明人： Gregory Chrysler ,  Abhay Watwe ,  Ravi Mahajan

IPC分类号： B32B9/00

CPC分类号： B32B15/04 ,  C23C16/56 ,  H01L23/36 ,  H01L23/3732 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  Y10T428/30 ,  Y10T428/31678 ,  H01L2924/00

摘要： A method of preparing a diamond body, and a diamond body thus prepared. A covering layer is provided on at least one surface of the diamond body such that the covering layer adheres to the at least one surface. The covering layer is in turn provided with a predetermined configuration.

摘要翻译： 一种制备金刚石体的方法，以及如此制备的金刚石体。 覆盖层设置在金刚石主体的至少一个表面上，使得覆盖层粘附到至少一个表面。 覆盖层依次具有预定的构造。

公开(公告)号：US20090244874A1

公开(公告)日：2009-10-01

申请号：US12059133

申请日：2008-03-31

申请人： Ravi Mahajan ,  Sandeep Sane

发明人： Ravi Mahajan ,  Sandeep Sane

IPC分类号： H05K7/02 ,  H01L21/50

CPC分类号： H05K1/142 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15192 ,  H05K1/141 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/0187 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05647

摘要： A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location of the silicon patch and a second interconnect structure (132) at a second location of the silicon patch, and an electrically conductive line (150) in the silicon patch connecting the first interconnect structure and the second interconnect structure to each other.

摘要翻译： 微电子封装包括衬底（110），嵌入衬底中的硅贴片（120），在硅贴片的第一位置处的第一互连结构（131）和在第二位置处的第二互连结构（132） 硅贴片以及将第一互连结构和第二互连结构彼此连接的硅贴片中的导电线（150）。

公开(公告)号：US06903929B2

公开(公告)日：2005-06-07

申请号：US10404213

申请日：2003-03-31

申请人： Ravi Prasher ,  Ravi Mahajan

发明人： Ravi Prasher ,  Ravi Mahajan

IPC分类号： H01L23/40 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： Integrated circuit (IC) packages employing two-phase microchannel heat exchangers for cooling the packages' IC dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is thermally coupled to a pair of microchannel heat exchangers disposed on opposite sides of the die. Top-side microchannel heat exchangers include a thermal mass having a plurality of open microchannels having wall bases that are hermetically sealed with the top surface of the die, thus forming a plurality of closed microchannels. Alternatively, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. Bottom-side heat exchangers include substrates and chip carriers having microchannels formed therethrough that are thermally coupled to the IC die. The cooling systems employ a plurality of microchannel heat exchangers to cool selected electronic components.

摘要翻译： 公开了采用两相微通道热交换器来冷却封装IC芯片的集成电路（IC）封装以及采用其的冷却系统。 热交换器包括其中形成有多个微通道的热质量。 在一组配置中，IC管芯热耦合到设置在管芯的相对侧上的一对微通道热交换器。 顶侧微通道热交换器包括具有多个开口微通道的热质，其具有与模具顶表面气密密封的壁基，从而形成多个闭合微通道。 或者，单独的微通道热交换器热耦合到IC管芯，并且通过耦合到IC芯片上安装有IC管芯的基板而可操作地耦合到IC管芯。 底侧热交换器包括具有热连接到IC管芯的通过其形成的微通道的衬底和芯片载体。 冷却系统采用多个微通道热交换器来冷却选定的电子部件。

公开(公告)号：US20050093138A1

公开(公告)日：2005-05-05

申请号：US10698749

申请日：2003-10-31

申请人： Sarah Kim ,  R. List ,  James Maveety ,  Alan Myers ,  Quat Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

发明人： Sarah Kim ,  R. List ,  James Maveety ,  Alan Myers ,  Quat Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

IPC分类号： H01L23/473 ,  H01L23/34

CPC分类号： H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/82

摘要： An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.

摘要翻译： 要冷却的集成电路可以与冷却集成电路面对面邻接。 冷却集成电路可以包括电渗泵，以通过微通道将冷却流体泵送通过冷却集成电路，从而冷却发热集成电路。 电渗泵可以流体耦合到从包括集成电路的包装向上延伸的外部散热器。 特别地，外部散热器可以安装在使散热器远离封装的管上。