公开(公告)号：US20150171010A1

公开(公告)日：2015-06-18

申请号：US14133385

申请日：2013-12-18

Applicant: Robert L. Bristol ,  Kevin Lin ,  Kanwal Jit Singh ,  Alan M. Myers ,  Richard E. Schenker

Inventor： Robert L. Bristol ,  Kevin Lin ,  Kanwal Jit Singh ,  Alan M. Myers ,  Richard E. Schenker

IPC: H01L23/522 ,  H01L21/027 ,  H01L21/311 ,  H01L21/768

CPC classification number: H01L21/76897 ,  H01L21/0274 ,  H01L21/31111 ,  H01L21/31144 ,  H01L21/76802 ,  H01L21/76808 ,  H01L21/76816 ,  H01L21/76825 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects is described. In an example, an interconnect structure for an integrated circuit includes a first layer of the interconnect structure disposed above a substrate, the first layer having a first grating of alternating metal lines and dielectric lines in a first direction. The dielectric lines have an uppermost surface higher than an uppermost surface of the metal lines. The integrated circuit also includes a second layer of the interconnect structure disposed above the first layer of the interconnect structure. The second layer includes a second grating of alternating metal lines and dielectric lines in a second direction, perpendicular to the first direction. The dielectric lines have a lowermost surface lower than a lowermost surface of the metal lines of the second grating. The dielectric lines of the second grating overlap and contact, but are distinct from, the dielectric lines of the first grating. The integrated circuit also includes a region of dielectric material disposed between the metal lines of the first grating and the metal lines of the second grating, and in a same plane as upper portions of the dielectric lines of the first grating and lower portions of the dielectric lines of the second grating. The region of dielectric material is composed of a cross-linked photolyzable material.

Abstract translation: 描述了用于后端（BEOL）互连的带有光触点的自对准通孔和插头图案。 在一个示例中，用于集成电路的互连结构包括设置在衬底上方的互连结构的第一层，第一层具有在第一方向上交替的金属线和介质线的第一光栅。 介质线具有高于金属线的最上表面的最上表面。 集成电路还包括布置在互连结构的第一层之上的互连结构的第二层。 第二层包括垂直于第一方向的第二方向的交替金属线和介质线的第二光栅。 介质线具有比第二光栅的金属线的最下表面低的最低表面。 第二光栅的介质线与第一光栅的介质线重叠并接触，但不同。 集成电路还包括设置在第一光栅的金属线和第二光栅的金属线之间的电介质材料区域，并且在与第一光栅的介质线的上部和电介质的下部相同的平面中 第二光栅的线。 介电材料的区域由交联的可光致发光材料组成。

公开(公告)号：US20140083858A1

公开(公告)日：2014-03-27

申请号：US13624288

申请日：2012-09-21

Applicant: Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

Inventor： Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

IPC: B01D43/00 ,  H05K3/30

CPC classification number: H05K1/0272 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/1815 ,  H01L2924/18162 ,  H05K1/0212 ,  H05K1/185 ,  H05K3/0097 ,  H05K2201/097 ,  H05K2203/1536 ,  H05K2203/308 ,  Y10T29/4913

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法可以包括将微流体管芯附接到封装结构，其中微流体管芯包括可以与设置在封装结构内的信号焊盘耦合的多个不对称电极。

公开(公告)号：US20110295349A1

公开(公告)日：2011-12-01

申请号：US13121088

申请日：2008-09-26

Applicant: Kevin Lin

Inventor： Kevin Lin

IPC: A61B18/18

CPC classification number: A61N5/0619 ,  A61N5/0616 ,  A61N2005/0643 ,  A61N2005/066

Abstract: A portable far-infrared physiotherapy equipment for thermal moxibustion may comprise at least a heating unit and a power control device connected to the heating unit for supplying power to the latter. The power control device may comprise: a charging control circuit connected to a power supply port to receive power supply from an external power source; an electricity storage unit connected to the charging control circuit to be charged; a power output control unit connecting the charging control circuit and the electricity storage unit to the heating unit respectively to enable to transfer power to the heating unit; and a micro controller unit connected to the electricity storage unit, the charging control circuit and the power output control unit to enable to control them. The present far-infrared physiotherapy equipment for thermal moxibustion is portable and convenient for users.

Abstract translation: 用于热灸的便携式远红外物理治疗设备可以包括至少一个加热单元和连接到加热单元的功率控制装置，用于向后者供电。 功率控制装置可以包括：充电控制电路，连接到电源端口以从外部电源接收电力供应; 连接到要充电的充电控制电路的蓄电单元; 功率输出控制单元，分别将充电控制电路和蓄电单元连接到加热单元，以便能够将功率传递到加热单元; 以及连接到蓄电单元，充电控制电路和功率输出控制单元的微控制器单元，以便能够控制它们。 目前用于热灸的远红外理疗设备便于携带，方便用户使用。

公开(公告)号：US20110163083A1

公开(公告)日：2011-07-07

申请号：US13062856

申请日：2008-09-09

Applicant: Kevin Lin

Inventor： Kevin Lin

IPC: H05B1/02

CPC classification number: H05B1/02 ,  A47J27/21058 ,  F24H1/185 ,  F24H9/2014 ,  F24H9/2021 ,  G05D23/1931

Abstract: A heating control device for a heating apparatus comprises a power control unit connected between an external power source and a heating unit of the heating apparatus to transfer power therebetween; a first temperature sensor provided near the heating unit for detecting the temperature thereof; a second temperature sensor provided at a portion of the heating apparatus for containing an object to be heated and for detecting the temperature of the object; a storage unit for storing temperature reference values; a micro controller unit electrically connected to the first and second temperature sensors, the power control unit and the storage unit, which is used to receive temperature signals from the sensors, compare the detected temperatures to the temperature reference values, and command the power control unit to supply the heating unit with different powers. A heating control method therefore is also disclosed.

Abstract translation: 一种用于加热装置的加热控制装置包括连接在外部电源和加热装置的加热单元之间的功率控制单元，用于在其间传递动力; 第一温度传感器，设置在加热单元附近，用于检测其温度; 第二温度传感器，设置在加热装置的一部分，用于容纳待加热物体并检测物体的温度; 用于存储温度参考值的存储单元; 电连接到第一和第二温度传感器的微控制器单元，用于从传感器接收温度信号的功率控制单元和存储单元将检测到的温度与温度参考值进行比较，并且命令功率控制单元 为不同功率的加热单元供电。 因此，还公开了一种加热控制方法。

公开(公告)号：US20100136919A1

公开(公告)日：2010-06-03

申请号：US12452617

申请日：2008-07-28

Applicant: Satha Sathananthan ,  Kevin Lin ,  Thanh Bui ,  Dobrica Vasic

Inventor： Satha Sathananthan ,  Kevin Lin ,  Thanh Bui ,  Dobrica Vasic

IPC: H04B17/00 ,  H04L27/28

CPC classification number: H04L25/0232

Abstract: The present invention relates to methods that can be used in a wireless communication system, and systems adapted to use such methods. In a preferred form the methods are useful in channel estimation in a wireless communication system using orthogonal frequency division multiplexing (OFDM). The system is provided with a control block to optimise channel estimation.

Abstract translation: 本发明涉及可用于无线通信系统的方法，以及适用于使用这种方法的系统。 在优选形式中，该方法在使用正交频分复用（OFDM）的无线通信系统中的信道估计中是有用的。 该系统具有控制块以优化信道估计。

公开(公告)号：US20090238498A1

公开(公告)日：2009-09-24

申请号：US12050426

申请日：2008-03-18

Applicant: Kevin Lin

Inventor： Kevin Lin

IPC: B65D33/00

CPC classification number: B65D75/002 ,  B65D75/28

Abstract: Provided is a compaction package that includes a flexible film portion and a heat shrink film portion coupled to part of the flexible film portion. The compaction package has a bottom, a sidewall, and an open top that together define a hollow interior space adapted to receive and contain a granular material. In a first configuration prior to exposure to a heat source sufficient to raise the temperature of the compaction package to a certain critical heat shrink temperature, the interior space of the compaction package has a first volume. In a second configuration after exposure to the heat source, the interior space of the compaction package has a second volume that is less than the first volume.

Abstract translation: 提供了一种压实包装，其包括柔性膜部分和耦合到柔性膜部分的一部分的热收缩膜部分。 压实包装具有底部，侧壁和开口顶部，其一起限定适于接收和容纳颗粒材料的中空内部空间。 在暴露于足以将压实包装的温度升高到某一临界热收缩温度的热源之前的第一配置中，压实包装的内部空间具有第一容积。 在暴露于热源之后的第二配置中，压缩包装的内部空间具有小于第一容积的第二容积。

公开(公告)号：USD545410S1

公开(公告)日：2007-06-26

申请号：US29248459

申请日：2006-08-17

Applicant: Kevin Lin ,  Lisa Zou

Designer： Kevin Lin ,  Lisa Zou

公开(公告)号：US06973712B2

公开(公告)日：2005-12-13

申请号：US10093106

申请日：2002-03-07

Applicant: Chao-Peng Chen ,  Kevin Lin ,  Jei-Wei Chang ,  Kochan Ju ,  Hui-Chuan Wang

Inventor： Chao-Peng Chen ,  Kevin Lin ,  Jei-Wei Chang ,  Kochan Ju ,  Hui-Chuan Wang

IPC: G11B5/31 ,  G11B5/39 ,  G11B5/127 ,  H04R31/00

CPC classification number: B82Y10/00 ,  G11B5/3116 ,  G11B5/3163 ,  G11B5/3903 ,  Y10T29/49021 ,  Y10T29/49032 ,  Y10T29/49041 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052 ,  Y10T29/49128

Abstract: A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.

Abstract translation: GMR结构的Lead Overlay设计中的一个主要问题是磁性读取磁道宽度比物理读取磁道宽度宽。 这是由于引线和GMR层之间的高界面电阻，这是现有技术方法的不可避免的副作用。 本发明使用在湿蚀刻之前的电镀来制造引线。 该方法仅需要在GMR层上的薄保护层，以确保接口电阻最小。 使用湿表面清洁可以避免溅射缺陷，电镀与此相容，因此清洁表面被保留只需要一个光刻步骤来定义轨道，因为没有重新沉积。

公开(公告)号：US06776891B2

公开(公告)日：2004-08-17

申请号：US09859363

申请日：2001-05-18

Applicant: Chaopeng Chen ,  Kevin Lin ,  Jei Wei Chang

Inventor： Chaopeng Chen ,  Kevin Lin ,  Jei Wei Chang

IPC: C25D356

CPC classification number: C25D5/18 ,  C25D3/562 ,  C25D5/006 ,  C25D7/001 ,  G11B5/3109 ,  G11B5/3163 ,  H01F10/16 ,  H01F41/26 ,  Y10T428/115 ,  Y10T428/12493

Abstract: A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co100−a−bFeaMb, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.

Abstract translation: 一种用于形成具有一般形式Co100-a-bFeaMb的高饱和磁化强度和低矫顽力的镀覆磁性薄膜的方法，其中M可以是Mo，Cr，W，Ni或Rh，其适用于磁记录头， 写在狭窄的轨道宽度，高矫顽力的媒体。 电镀方法包括四个当前应用过程：直流，脉冲电流，脉冲反向电流和调节脉冲反向电流。

公开(公告)号：US06749334B2

公开(公告)日：2004-06-15

申请号：US10215002

申请日：2002-08-09

Applicant: Kevin Lin

Inventor： Kevin Lin

IPC: G01J504

CPC classification number: G01J5/04 ,  G01J5/049 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0818

Abstract: An ear thermometer probe structure comprises a shell body. A hollow thermal absorption component is disposed in the shell body, and contacts several positioning points one the inner wall of the shell body. An air gap is formed at the part of the thermal absorption component not contacting the shell body. A wave guide is disposed in the thermal absorption component. The rear section of the wave guide tightly contacts the thermal absorption component, and the front section thereof is separated from the shell body by an air gap. A filter is disposed at the front end of the wave guide to let infrared rays be transmitted. An annular sealing pad is located between the filter and the top of the shell body. A sensor is disposed behind the wave guide and fixed on the thermal absorption component. The sensor is separated from the thermal absorption component and the wave guide by an annular air room.

Abstract translation: 耳温度计探针结构包括壳体。 中空热吸收部件设置在壳体中，并且与壳体的内壁一个接触多个定位点。 在不接触壳体的热吸收部件的部分形成气隙。 波导装置设置在热吸收部件中。 波导的后部与热吸收部件紧密接触，其前部通过气隙与壳体分离。 滤波器设置在波导的前端，以便传输红外线。 环形密封垫位于过滤器和壳体顶部之间。 传感器设置在波导的后面并固定在吸热部件上。 传感器由环形空气室与热吸收部件和波导分开。