DISPLAY DEVICE INCLUDING SEMICONDUCTOR LIGHT EMITTING DEVICE

    公开(公告)号:US20230130868A1

    公开(公告)日:2023-04-27

    申请号:US17971422

    申请日:2022-10-21

    Abstract: A display device can include first and second assembly electrodes spaced apart from each other on the substrate, an insulating layer disposed between the first assembly electrode and the second assembly electrode, an assembly barrier wall disposed on the first assembly electrode, the second assembly electrode, the insulating layer and having an assembly hole, an annealed light-transmitting electrode layer disposed on the first assembly electrode and a semiconductor light emitting device disposed in contact with the annealed light-transmitting electrode layer.

    DISPLAY DEVICE
    8.
    发明申请

    公开(公告)号:US20240421264A1

    公开(公告)日:2024-12-19

    申请号:US18706161

    申请日:2021-11-01

    Abstract: A display device includes a substrate, a first assembly wiring and second assembly wiring on the substrate, a first insulating layer on the first and second assembly wirings, a barrier wall comprising a hole on the first insulating layer, a semiconductor light emitting device in the hole, and a connection part is configured to electrically connect a side of the semiconductor light emitting device and at least one assembly wiring of the first and second assembly wirings. A gap between an inner surface of the hole and an outer surface of the semiconductor light emitting device is 50% to 200% of a thickness of the semiconductor light emitting device.

    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20240387490A1

    公开(公告)日:2024-11-21

    申请号:US18443406

    申请日:2024-02-16

    Abstract: The present disclosure is applicable to a display device-related technology field, for example, relates to a display device using a micro light emitting diode (LED) and a method for manufacturing the same. The display device using the semiconductor light emitting device includes a wiring substrate with a first electrode disposed thereon, a light emitting device disposed on the wiring substrate to constitute a unit sub-pixel, a seating layer located between the wiring substrate and the light emitting device, wherein the seating layer includes a first portion in contact with the light emitting device and a second portion located under the first portion and having an area size greater than an area size of the first portion, a first connection electrode electrically connecting the first electrode to one side of the light emitting device corresponding to a shape of the seating layer, a planarization layer covering the light emitting device and the first connection electrode, and a second connection electrode located on the planarization layer and electrically connected to the other side of the light emitting device.

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