摘要:
The present invention concerning the Optical Identification Card System is provided with an individual card which emits infrared light modulated by the individual code and a detector which receives this infrared modulated light and detects the individual code. When a request signal is radiated from this detector as infrared light from the above within the prescribed light-emitting area, the said infrared modulated light is radiated from the individual card within the light-emitting area and thus the individual code is detected by the detector. Then the detected individual code is identified by the identifier, and on the basis of this identification result, the terminal equipment related to the holder of the individual card is actuated, thereby automatically locking and unlocking the door.
摘要:
In a method of manufacturing a semiconductor laser which includes a window structure at the periphery of an active layer. The width of the optical waveguide is determined by an etching, and the window structure is formed by an interdiffusion of atoms between a carrier confining layer and the active layer.
摘要:
A liquid-discharging recording head includes first and second substrates each having an energy generating element and a supply port, and a support member on which the substrates are arranged. The first substrate is provided on one side in a longitudinal direction of the support member, and the second substrate is provided on an other side in the longitudinal direction of the support member. A driving circuit configured to drive the energy generating element is provided in a larger region between an end of a supply port in the first substrate on the other side in the longitudinal direction and an end of the first substrate on the other side and in a larger region between an end of a supply port in the second substrate on the one side in the longitudinal direction and an end of the second substrate on the one side.
摘要:
According to one embodiment, a light emitting device includes a light emitting chip, an external terminal made of a metal material, and a circuit board. The light emitting chip is mounted on the circuit board via the external terminal. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer. The circuit board includes an interconnection bonded to the first metal pillar and the second metal pillar via the external terminal, and a heat radiation material provided on an opposite side of the interconnection and connected to the interconnection.
摘要:
According to one embodiment, a light emitting device includes a stacked body, a p-side and n-side electrodes, an insulating film, a p-side extraction electrode, an n-side extraction electrode, a resin layer and a phosphor layer. The stacked body has a first and a second surface opposite to each other and includes a light emitting layer. A p-side and an n-side electrode are provided on the second surface. An insulating film has openings to which the p-side and n-side electrodes are exposed. A p-side extraction electrode includes a p-side seed metal and a p-side metal wiring layer. An n-side extraction electrode includes an n-side seed metal and an n-side metal wiring layer. A resin layer is filled around the p-side and n-side extraction electrodes, and a phosphor layer is provided on a side of the first surface. Emission light from the light emitting layer is emitted through the first surface.
摘要:
An inkjet printhead substrate includes: a heat generating element configured to generate energy for ejecting ink; an electric wire electrically connecting the heat generating element and an electrode lead provided on a flexible film wiring substrate; a protecting film configured to protect the electric wire; an electrode pad to which the electrode lead is connected, the electrode pad being formed by providing an opening in the protecting film at a position above the electric wire; a region to which a sealing resin configured to protect an electrically connected portion of the electrode pad and the electrode lead is to be applied; and an ink-detecting electrode composed of a metal wire and formed at the region to which the sealing resin is to be applied. The metal wire has a smaller width than an opening provided in the protecting film from which the metal wire is exposed.
摘要:
An inkjet recording head includes a connection-state output circuit provided on the recording element substrate of a recording head, where the connection-state output circuit externally transmits data of the connection state of each of input signal ends. An output from the connection-state output circuit is activated when the same logic as that used when signals are pulled up and/or pulled down is used.
摘要:
A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate; forming a dielectric film on a second surface side opposite to the first surface of the multilayer body, the dielectric film having a first and second openings on a p-side electrode and an n-side electrode provided on the second surface; forming a seed metal on the dielectric film and an exposed surface of the first and second openings; forming a p-side metal interconnect layer and an n-side metal interconnect layer on the seed metal; separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal, which is provided between the p-side metal interconnect layer and the n-side metal interconnect layer; and forming a resin in a space from which the seed metal is removed.
摘要:
A liquid discharge head includes a heat accumulation layer provided on a board, an energy generation element configured to generate energy to discharge liquid from a discharge port and including a heat generation resistor layer provided on the heat accumulation layer and formed of a material configured to generate heat through supply of electricity and a pair of electrodes connected to the heat generation resistor layer, and an insulation layer including a silicon compound and provided so as to cover the energy generation element, and a line formed of a metal material provided between the heat accumulation layer and the insulation layer, and in at least a portion at a position closer to a flow path than the energy generation element.
摘要:
An inkjet printhead substrate comprises: a pair of individual conductive layers configured to supply electrical power to a heat generation element; a first common conductive layer configured to be connected to one of the pair of individual conductive layers; a second common conductive layer configured to be connected to the other of the pair of individual conductive layers; and an isolation layer configured to be provided between the one of the pair of individual conductive layers and the first common conductive layer, and between the other of the pair of individual conductive layers and the second common conductive layer, wherein the isolation layer is formed from a conductive material which has a lower solubility in ink than a material used for the pairs of individual conductive layers, the first common conductive layer and the second common conductive layer.