公开(公告)号：US20090057919A1

公开(公告)日：2009-03-05

申请号：US12269053

申请日：2008-11-12

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H01L23/52

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first chip and the second chip. The second bumps connect the first chip and the second region of the substrate, wherein the second chip is over the first region of the substrate. The second bumps have a height greater than that of the first bumps plus the second chip. The substrate does not have an opening accommodating the second chip. The first bumps may be gold bumps or solder bumps. The second bumps may be solder bumps.

公开(公告)号：US07045901B2

公开(公告)日：2006-05-16

申请号：US10371505

申请日：2003-02-21

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.

摘要翻译： 通过形成芯片封装的方法提供用于半导体芯片的芯片封装，包括以下步骤：形成具有窗口的印刷电路板; 通过焊接连接将一个或多个覆盖在窗口上的初级芯片的半导体芯片连接到印刷电路板上，将悬挂的半导体芯片定位在窗口内，以及将悬挂的半导体芯片连接到芯片上的一个或多个覆盖窗口的主要芯片 - 芯片连接。 在印刷电路板上形成旁路电容器。

公开(公告)号：US06768208B2

公开(公告)日：2004-07-27

申请号：US10437355

申请日：2003-05-13

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H01L2334

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.

公开(公告)号：US08148806B2

公开(公告)日：2012-04-03

申请号：US12269053

申请日：2008-11-12

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H01L23/48 ,  H01L25/065 ,  H05K1/02 ,  H05K1/14 ,  H05K1/00

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first chip and the second chip. The second bumps connect the first chip and the second region of the substrate, wherein the second chip is over the first region of the substrate. The second bumps have a height greater than that of the first bumps plus the second chip. The substrate does not have an opening accommodating the second chip. The first bumps may be gold bumps or solder bumps. The second bumps may be solder bumps.

摘要翻译： 封装包括基板，第一芯片，第二芯片，多个第一凸块和多个第二凸块。 衬底具有第一区域和第二区域。 第一区域与第二区域基本共面。 第一个凸块连接第一个芯片和第二个芯片。 第二凸块连接基板的第一芯片和第二区域，其中第二芯片位于基板的第一区域之上。 第二凸块的高度大于第一凸块加上第二芯片的高度。 基板不具有容纳第二芯片的开口。 第一凸起可以是金凸块或焊料凸块。 第二凸起可以是焊料凸块。

公开(公告)号：US07247932B1

公开(公告)日：2007-07-24

申请号：US09573955

申请日：2000-05-19

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H01L23/48 ,  H01L25/065 ,  H05K1/02 ,  H05K1/14 ,  H05K1/00

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.

摘要翻译： 通过形成芯片封装的方法提供用于半导体芯片的芯片封装，包括以下步骤：形成具有窗口的印刷电路板; 通过焊接连接将一个或多个覆盖在窗口上的初级芯片的半导体芯片连接到印刷电路板上，将悬挂的半导体芯片定位在窗口内，以及将悬挂的半导体芯片连接到芯片上的一个或多个覆盖窗口的主要芯片 - 芯片连接。 在印刷电路板上形成旁路电容器。

公开(公告)号：US07205646B2

公开(公告)日：2007-04-17

申请号：US10420595

申请日：2003-04-22

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H01L25/065 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first chip and the second chip. The second bumps connect the first chip and the second region of the substrate, wherein the second chip is over the first region of the substrate. The second bumps have a height greater than that of the first bumps plus the second chip. The substrate does not have an opening accommodating the second chip. The first bumps may be gold bumps or solder bumps. The second bumps may be solder bumps.

摘要翻译： 封装包括基板，第一芯片，第二芯片，多个第一凸块和多个第二凸块。 衬底具有第一区域和第二区域。 第一区域与第二区域基本共面。 第一个凸块连接第一个芯片和第二个芯片。 第二凸块连接基板的第一芯片和第二区域，其中第二芯片位于基板的第一区域之上。 第二凸块的高度大于第一凸块加上第二芯片的高度。 基板不具有容纳第二芯片的开口。 第一凸起可以是金凸块或焊料凸块。 第二凸起可以是焊料凸块。

公开(公告)号：US06791192B2

公开(公告)日：2004-09-14

申请号：US10371506

申请日：2003-02-21

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H01L2324

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.

摘要翻译： 通过形成芯片封装的方法提供用于半导体芯片的芯片封装，包括以下步骤：形成具有窗口的印刷电路板; 通过焊接连接将一个或多个覆盖在窗口上的初级芯片的半导体芯片连接到印刷电路板上，将悬挂的半导体芯片定位在窗口内，以及将悬挂的半导体芯片连接到芯片上的一个或多个覆盖窗口的主要芯片 - 芯片连接。 在印刷电路板上形成旁路电容器。

公开(公告)号：US20090056988A1

公开(公告)日：2009-03-05

申请号：US12269054

申请日：2008-11-12

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H05K1/03

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first chip and the second chip. The second bumps connect the first chip and the second region of the substrate, wherein the second chip is over the first region of the substrate. The second bumps have a height greater than that of the first bumps plus the second chip. The substrate does not have an opening accommodating the second chip. The first bumps may be gold bumps or solder bumps. The second bumps may be solder bumps.

摘要翻译： 封装包括基板，第一芯片，第二芯片，多个第一凸块和多个第二凸块。 衬底具有第一区域和第二区域。 第一区域与第二区域基本共面。 第一个凸块连接第一个芯片和第二个芯片。 第二凸块连接基板的第一芯片和第二区域，其中第二芯片位于基板的第一区域之上。 第二凸块的高度大于第一凸块加上第二芯片的高度。 基板不具有容纳第二芯片的开口。 第一凸起可以是金凸块或焊料凸块。 第二凸起可以是焊料凸块。

公开(公告)号：US07468551B2

公开(公告)日：2008-12-23

申请号：US10437333

申请日：2003-05-13

申请人： Mou-Shiung Lin ,  Bryan Peng

发明人： Mou-Shiung Lin ,  Bryan Peng

IPC分类号： H01L25/065 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14

CPC分类号： H05K1/0231 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.

摘要翻译： 通过形成芯片封装的方法提供用于半导体芯片的芯片封装，包括以下步骤：形成具有窗口的印刷电路板; 通过焊接连接将一个或多个覆盖在窗口上的初级芯片的半导体芯片连接到印刷电路板上，将悬挂的半导体芯片定位在窗口内，以及将悬挂的半导体芯片连接到芯片上的一个或多个覆盖窗口的主要芯片 - 芯片连接。 在印刷电路板上形成旁路电容器。

公开(公告)号：US09391021B2

公开(公告)日：2016-07-12

申请号：US12506278

申请日：2009-07-21

申请人： Mou-Shiung Lin

发明人： Mou-Shiung Lin

IPC分类号： H01L23/525 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00

CPC分类号： H01L23/293 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/525 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/11 ,  H01L24/19 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/0231 ,  H01L2224/0347 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/12105 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2224/13099 ,  H01L2924/00

摘要： A method for fabricating chip package includes providing a semiconductor chip with a metal bump, next adhering the semiconductor chip to a substrate using a glue material, next forming a polymer material on the substrate, on the semiconductor chip, and on the metal bump, next polishing the polymer material, next forming a patterned circuit layer over the polymer material and connected to the metal bump, and then forming a tin-containing ball over the patterned circuit layer and connected to the patterned circuit layer.