公开(公告)号：US11888088B2

公开(公告)日：2024-01-30

申请号：US17830148

申请日：2022-06-01

Applicant: NICHIA CORPORATION

Inventor： Yoshiki Sato ,  Masaaki Katsumata ,  Shinichi Daikoku ,  Yoshikazu Matsuda ,  Ryuma Marume ,  Eiko Minato

IPC: H01L23/00 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/10 ,  H01L33/36 ,  H01L33/60 ,  H01L33/44 ,  H01L33/00 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L2933/0016 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively. The paired wirings are formed by irradiation of laser light on a metal paste layer continuously covering the paired electrodes and the first covering member to remove the metal paste layer between the paired electrodes, the metal paste layer comprising a mixture of a resin and metal powder.

公开(公告)号：US11611014B2

公开(公告)日：2023-03-21

申请号：US17580193

申请日：2022-01-20

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Koji Taguchi ,  Yumiko Kameshima ,  Masaaki Katsumata

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/24 ,  H01L33/62

Abstract: A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

公开(公告)号：US20130181236A1

公开(公告)日：2013-07-18

申请号：US13739802

申请日：2013-01-11

Applicant: Nichia Corporation

Inventor： Hiroto TAMAKI ,  Eiko Minato ,  Takahiro Tani

IPC: H01L33/56

CPC classification number: H01L33/56 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A light emitting device has a base comprising at least one pair of leads having a silver-containing layer on their surfaces and being secured by a resin molded body, a light emitting element mounted on said leads, a protective film made of an inorganic material that covers the upper surface of said base, and a sealing resin disposed on the base surface via said protective film. The sealing resin has a first resin that covers said light emitting element, and a second resin having a higher hardness than said first resin that covers the boundaries between said resin molded body and said leads.

Abstract translation: 一种发光器件具有包括在其表面上具有含银层的至少一对引线并由树脂成型体固定的基体，安装在所述引线上的发光元件，由无机材料制成的保护膜， 覆盖所述基座的上表面，以及通过所述保护膜设置在基底表面上的密封树脂。 密封树脂具有覆盖所述发光元件的第一树脂和具有比覆盖所述树脂成型体和所述引线之间的边界的所述第一树脂更高的硬度的第二树脂。

公开(公告)号：US12302494B2

公开(公告)日：2025-05-13

申请号：US17715033

申请日：2022-04-07

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Yumiko Kameshima ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/32

Abstract: A lighting device includes a light emitting element having element electrodes; a light guide member to receive incoming light from the light emitting element and to emit light spreading along a plane; and a substrate including a base substitute. Conductors are formed on a first surface of the base substrate. An adhesive member is formed on a second surface of the base substrate, and through-holes penetrating the substrate in a thickness direction of the substrate. The substrate is provided on the light emitting element via the adhesive member of the substrate such that a surface of the light emitting element is exposed through each of the through-holes to define a bottomed hole. Each of the element electrodes is connected to each of the conductors via a filler filling the bottomed hole. The filler has a lower surface than a surface carrying the conductors of the substrate in a cross-sectional view.

公开(公告)号：US09190585B2

公开(公告)日：2015-11-17

申请号：US13739802

申请日：2013-01-11

Applicant: Nichia Corporation

Inventor： Hiroto Tamaki ,  Eiko Minato ,  Takahiro Tani

IPC: H01L33/56 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A light emitting device has a base comprising at least one pair of leads having a silver-containing layer on their surfaces and being secured by a resin molded body, a light emitting element mounted on said leads, a protective film made of an inorganic material that covers the upper surface of said base, and a sealing resin disposed on the base surface via said protective film. The sealing resin has a first resin that covers said light emitting element, and a second resin having a higher hardness than said first resin that covers the boundaries between said resin molded body and said leads.

Abstract translation: 一种发光器件具有包括在其表面上具有含银层的至少一对引线并由树脂成型体固定的基体，安装在所述引线上的发光元件，由无机材料制成的保护膜， 覆盖所述基座的上表面，以及通过所述保护膜设置在基底表面上的密封树脂。 密封树脂具有覆盖所述发光元件的第一树脂和具有比覆盖所述树脂成型体和所述引线之间的边界的所述第一树脂更高的硬度的第二树脂。

公开(公告)号：US11699688B2

公开(公告)日：2023-07-11

申请号：US17106630

申请日：2020-11-30

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Masaaki Katsumata

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/58

CPC classification number: H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0066

Abstract: A surface-emitting light source includes: light-emitting modules; a wiring substrate including a base member having a surface at a light-emitting modules side and a rear surface opposite to that, a wiring layer on the rear surface of the base member and including wiring pads being portions of the wiring layer, electrically-conductive members each supplied across corresponding two or more of a plurality of vias in each of the wiring pads, and a covering layer covering the wiring layer and defining openings in each of which a portion of a corresponding one of the wiring pads is exposed; and an adhesive layer between the light-emitting modules and the wiring substrate. Each light-emitting module has an array of light emitting devices. The covering layer defines the openings at locations corresponding to the wiring pads with an area dimension smaller than respective area dimensions of the wiring pads.

公开(公告)号：US11264533B2

公开(公告)日：2022-03-01

申请号：US16857959

申请日：2020-04-24

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Koji Taguchi ,  Yumiko Kameshima ,  Masaaki Katsumata

IPC: H01L33/24 ,  H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.

公开(公告)号：US12002907B2

公开(公告)日：2024-06-04

申请号：US17280047

申请日：2019-09-27

Applicant: NICHIA CORPORATION

Inventor： Yumiko Kameshima ,  Eiko Minato ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H01L33/54 ,  H01L23/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L33/54 ,  H01L24/96 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L33/56 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/96 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A light emitting module includes: a base board; and a plurality of divisional planar light emitters disposed adjacent to each other on one surface of the base board. The base board includes: a plurality of conductive parts, a flexible base part joined to the conductive parts, and an insulating base part joined to the flexible base part. Each of the plurality of divisional planar light emitters includes: a plurality of wiring parts electrically connected with corresponding ones of the conductive parts of the base board, a plurality of light emitting elements each disposed on corresponding ones of the wiring parts, and a sealing part sealing the plurality of light emitting elements and facing the insulating base part.

公开(公告)号：US11380817B2

公开(公告)日：2022-07-05

申请号：US16774614

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Yoshiki Sato ,  Masaaki Katsumata ,  Shinichi Daikoku ,  Yoshikazu Matsuda ,  Ryuma Marume ,  Eiko Minato

IPC: H01L33/00 ,  H01L25/075 ,  H01L23/00 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/10 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60

Abstract: A method for manufacturing a light-emitting device includes preparing an intermediate product; the product includes a light-emitting element provided with paired electrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed. A metal paste layer is formed, continuously covering the exposed portion of the paired electrodes and the first covering member. Paired wirings are formed for preventing the paired electrodes from being short-circuited. The metal paste layer on the paired electrodes and the metal paste layer on the first covering member are irradiated with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.

公开(公告)号：US11363715B2

公开(公告)日：2022-06-14

申请号：US16583270

申请日：2019-09-26

Applicant: NICHIA CORPORATION

Inventor： Eiko Minato ,  Yumiko Kameshima ,  Koji Taguchi ,  Masaaki Katsumata

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/02

Abstract: A lighting device including a light-emitter including light emitting elements, and a support having a first surface that carries a wiring line electrically connecting element electrodes of the light emitting elements and a light emitting surface, and a substrate including a base substrate, a conductor formed on a first surface of the base substrate, an adhesive member formed on a second surface of the base substrate, and a through-hole penetrating the substrate. A space is formed between the substrate and the light-emitter to communicate with a bottomed hole formed in a location of the through-hole as a result of adhering an adhesive surface of the adhesive member to a surface of the light-emitter having the wiring line formed thereon. The wiring line is connected to the conductor via a filler filling the bottomed hole, and the space is located outside an opening of the bottomed hole.