公开(公告)号：US20240250497A1

公开(公告)日：2024-07-25

申请号：US18417032

申请日：2024-01-19

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA

IPC: H01S5/0225 ,  H01S5/0232 ,  H01S5/40

CPC classification number: H01S5/0225 ,  H01S5/40 ,  H01S5/0232

Abstract: A light emitting device includes: a base having a recess and a flat upper surface; a light emitting element disposed on the upper surface of the base and configured to emit light laterally from an emission end surface; and a reflective member disposed on the upper surface of the base to face the light emitting element with the recess located between part of the reflective member and the light emitting element in a top view, the reflective member having a reflective surface configured to reflect the light upward. At least a portion of the reflective surface overlaps with the recess in the top view. A lower end of the reflective surface is located lower than the upper surface of the base and higher than a bottom surface of the recess in a direction normal to the upper surface of the base.

公开(公告)号：US20150340577A1

公开(公告)日：2015-11-26

申请号：US14815742

申请日：2015-07-31

Applicant: NICHIA CORPORATION

Inventor： Masashi ISHIDA ,  Daisuke SATO ,  Tadayuki KITAJIMA

IPC: H01L33/60 ,  H01L33/54 ,  H01L33/50

CPC classification number: H01L23/31 ,  H01L23/28 ,  H01L23/3135 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/483 ,  H01L33/502 ,  H01L33/505 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.

Abstract translation: 发光器件的制造方法包括设置在基板上的发光元件和沿着发光元件的侧表面设置的反射树脂。 该方法包括将矩阵中的发光元件设置在聚集衬底上，并且在矩阵中的发光元件的列和行方向的一个方向上在相邻的发光元件之间设置半导体元件。 反射树脂设置成沿着发光元件的侧表面和荧光体层的侧表面覆盖半导体元件。 设置在相邻的发光元件之间的反射树脂和基板在列或行方向上以及在另一方向上在发光元件和相邻的半导体元件之间被切割以包括发光元件或半导体元件。

公开(公告)号：US20230253756A1

公开(公告)日：2023-08-10

申请号：US18302570

申请日：2023-04-18

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA ,  Tomokazu TAJI

IPC: H01S5/02375 ,  H01S5/00

CPC classification number: H01S5/02375 ,  H01S5/0071

Abstract: A light emitting device includes a semiconductor laser element, a base member, and a cover. The base member includes a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark. The base member has a disposition surface on which the semiconductor laser element is disposed. The cover is bonded to the base member to define a closed space in which the semiconductor laser element is arranged. The first alignment mark and the second alignment mark are arranged outside the closed space. The third alignment mark and the fourth alignment mark are arranged inside the closed space. A straight line connecting the first alignment mark and the second alignment mark is parallel to a straight line connecting the third alignment mark and the fourth alignment mark.

公开(公告)号：US20210131619A1

公开(公告)日：2021-05-06

申请号：US17148843

申请日：2021-01-14

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA ,  Soichiro MIURA

IPC: F21K9/64 ,  F21V7/10 ,  F21V13/10 ,  F21V11/16 ,  H01S5/00 ,  H01S5/02255 ,  H01S5/02257

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base, the first light reflecting member having a first light reflecting face including a plane configured to reflect the first light; a second semiconductor laser element disposed on an upper surface of the base and configured to emit second light; a second light reflecting member disposed on the upper surface of the base, the second light reflecting member having a second light reflecting face including a plane configured to reflect the second light; and a phosphor member onto which the first light reflected from the first light reflecting member and the second light reflected from the second light reflecting member are irradiated.

公开(公告)号：US20240088336A1

公开(公告)日：2024-03-14

申请号：US18457787

申请日：2023-08-29

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA ,  Kazuma KOZURU

IPC: H01L33/60 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L27/156 ,  H01L33/62 ,  H01L33/483

Abstract: A light emitting device includes: an insulating base; a first upper metal part located on an upper surface of the base; a first light emitting element that is disposed on the upper surface of the base with the first upper metal part being interposed between the first light emitting element and the base, and is configured to emit light laterally from a first emission end surface of the first light emitting element; a first reflective member that is disposed on the upper surface of the base without the first upper metal part being interposed between the first reflective member and the base, faces the first light emitting element, and has a first reflective surface configured to reflect the light upward; and one or more lower metal parts located on the lower surface of the base.

公开(公告)号：US20190234565A1

公开(公告)日：2019-08-01

申请号：US16259989

申请日：2019-01-28

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA ,  Soichiro MIURA

IPC: F21K9/64 ,  F21V7/10 ,  F21V11/16 ,  F21V13/10

CPC classification number: F21K9/64 ,  F21V7/10 ,  F21V11/16 ,  F21V13/10 ,  F21Y2115/30 ,  H01S5/005 ,  H01S5/0071

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base and configured to reflect the first light upwards; a phosphor member having a lower surface onto which the first light is irradiated and an upper surface serving as a light extraction surface; and a light shielding member surrounding lateral surfaces of the phosphor member. First and second regions of the first light reflecting member are formed such that a portion of the light reflected by the first region that is reflected on a side close to the second region and a portion of the light reflected by the second region that is reflected on a side close to the first region intersect before reaching the lower surface of the phosphor member.

公开(公告)号：US20250096523A1

公开(公告)日：2025-03-20

申请号：US18884086

申请日：2024-09-12

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA

IPC: H01S5/02345 ,  H01S5/0225 ,  H01S5/02315

Abstract: A light-emitting device includes a base, a first metal member, a second metal member, a semiconductor laser element, and a lid body. The base has an upper surface and a lower surface. The first metal member is disposed on the upper surface of the base and has a thickness in a vertical direction in a range from 50 μm to 150 μm. The second metal member is disposed on the upper surface of the base and has a thickness in the vertical direction identical to the thickness of the first metal member. The second metal member is spaced apart from the first metal member in a top view and surrounds the first metal member. The semiconductor laser element is disposed on the first metal member. The lid body is bonded to the base via the second metal member.

公开(公告)号：US20250096521A1

公开(公告)日：2025-03-20

申请号：US18884080

申请日：2024-09-12

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA

IPC: H01S5/02315 ,  H01S5/02255

Abstract: A light-emitting device includes a package and a semiconductor laser element. The package includes a frame portion, a lid portion, a base having a thickness in a range from 100 μm to 500 μm, and a first metal member arranged on upper or lower surface of the base, the first metal member having a thickness in a range from 10 μm to 150 μm. The base includes an insulating member having upper and lower surfaces respectively defining the upper and lower surfaces of the base. The insulating member defines a first through hole extending from the upper surface to the lower surface of the insulating member. A first conductive member is arranged in the first through hole. The first metal member covers the first through hole. The semiconductor laser element is electrically connected to the first conductive member and the first metal member.

公开(公告)号：US20230344192A1

公开(公告)日：2023-10-26

申请号：US18008502

申请日：2021-06-02

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA

IPC: H01S5/02255 ,  H01S5/40

CPC classification number: H01S5/02255 ,  H01S5/4025

Abstract: A light emitting device includes: a base having a mounting surface; one or more light reflective members arranged on the mounting surface and providing one or more light reflective surfaces on one virtual plane; a first light-emitting element having a first light-exiting surface facing toward the one or more light reflective surfaces, arranged on the mounting surface such that the first light-exiting surface is oblique relative to the one or more light reflective surfaces, and wherein light emitted from the first light-exiting surface is irradiated on the one or more light reflective surfaces; and a second light-emitting element having a second light-exiting surface facing toward the one or more light reflective surfaces, arranged on the mounting surface such that the second light-exiting surface is oblique relative to the first light-exiting surface, and wherein light emitted from the second light-exiting surface is irradiated on the one or more light reflective surfaces.

公开(公告)号：US20220190553A1

公开(公告)日：2022-06-16

申请号：US17688678

申请日：2022-03-07

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA ,  Tomokazu TAJI

IPC: H01S5/02375 ,  H01S5/00

Abstract: A light emitting device includes one or more electrical components and a base member. The electrical components include a first semiconductor laser element, which has a light emission end surface. The base member has a first surface on which the first semiconductor laser element is disposed. The base member includes a plurality of metal films including a first metal film and a second metal film. The first metal film is electrically connected to at least one of the electrical components, and defines a first alignment mark for aligning the first semiconductor laser element. The second metal film is electrically connected to at least one of the electrical components, and defines a second alignment mark for aligning the first semiconductor laser element. A straight line connecting the first alignment mark and the second alignment mark extends parallel to the light emission end surface of the first semiconductor laser element.