公开(公告)号：US07026054B2

公开(公告)日：2006-04-11

申请号：US09871896

申请日：2001-06-04

申请人： Naoto Ikegawa ,  Naoyuki Kondo ,  Kimiaki Nakata

发明人： Naoto Ikegawa ,  Naoyuki Kondo ,  Kimiaki Nakata

IPC分类号： B32B15/04

CPC分类号： H05K1/0366 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/095 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/29 ,  Y10T428/2913 ,  Y10T428/2916 ,  Y10T428/31678 ,  Y10T428/31681

摘要： A laminate includes a metal layer which is formed on and covers a surface of an insulating substrate activated by a plasma treatment by any method selected from a sputtering method, a vacuum depositing method and an ion plating method. The substrate is obtained by molding a resin composition containing 20 to 150 parts by mass of a fibrous filler having an average fiber diameter of 0.1 to 5 μm and an average fiber length of 10 to 50 μm relative to 100 parts by mass of a base resin comprising a thermoplastic resin and a thermosetting resin.

摘要翻译： 层压体包括通过溅射法，真空蒸镀法，离子镀法等任一种方法形成在绝缘基板的表面并覆盖由等离子体处理而起作用的金属层。 通过将相对于100质量份的基础树脂相对于100质量份的含有20〜150质量份平均纤维直径为0.1〜5μm，平均纤维长度为10〜50μm的纤维状填料， 包括热塑性树脂和热固性树脂。

公开(公告)号：US06916527B2

公开(公告)日：2005-07-12

申请号：US09986005

申请日：2001-11-07

申请人： Naoto Ikegawa ,  Masahiro Sato ,  Naoyuki Kondo

发明人： Naoto Ikegawa ,  Masahiro Sato ,  Naoyuki Kondo

IPC分类号： C08J7/06 ,  C08L51/06 ,  C08L55/02 ,  C23C14/02 ,  C23C14/20 ,  H05K1/03 ,  H05K3/38 ,  B32B5/06 ,  B32B5/16 ,  B32B15/08 ,  B32B27/06

CPC分类号： H05K1/0373 ,  C08L51/06 ,  C08L55/02 ,  C23C14/022 ,  C23C14/20 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K2203/095 ,  Y10S428/901 ,  Y10T428/249951 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31533 ,  Y10T428/31681 ,  Y10T428/31699 ,  C08L2666/14 ,  C08L2666/02 ,  H01L2924/00014 ,  H01L2924/00

摘要： A resin molded component, comprising metal coating treatment being provided on the surface by a physical deposition method chosen from among sputtering, vacuum deposition, and ion plating after the surface is activated by plasma treatment, and is produced by forming a resin composition combined a base resin comprising of a thermoplastic resin or a thermosetting resin with a rubber-like elastic material.

摘要翻译： 一种树脂成型部件，其特征在于，在表面被等离子体处理后，通过溅射，真空蒸镀，离子镀等选择的物理沉积方法，在表面上设置金属被膜成形体， 由具有橡胶状弹性材料的热塑性树脂或热固性树脂构成的树脂。

公开(公告)号：US20100263921A1

公开(公告)日：2010-10-21

申请号：US12741105

申请日：2008-11-04

申请人： Youichiro Nakahara ,  Naoto Ikegawa ,  Kyohei Uemura ,  Yoshiyuki Uchinono

发明人： Youichiro Nakahara ,  Naoto Ikegawa ,  Kyohei Uemura ,  Yoshiyuki Uchinono

IPC分类号： H05K1/09 ,  H05K3/46

CPC分类号： H05K3/027 ,  H05K3/108 ,  H05K3/244 ,  H05K2201/09363 ,  H05K2203/0723 ,  H05K2203/107

摘要： A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along an outer shape of the circuit so as to partly remove the metal thin film along the outer shape of the circuit; a Cu plating layer, a Ni plating layer and a Au plating layer formed by metal plating and sequentially provided on a surface of the undercoat layer. A first middle plating layer and a second middle plating layer are provided between the Ni plating layer and the Au plating layer. The first middle plating layer includes metal with a less noble standard electrode potential with respect to Au and is in contact with the Au plating layer. The second middle plating layer includes metal with a noble standard electrode potential with respect to the metal in the first middle plating layer and is in contact with the first middle plating layer.

摘要翻译： 电路板包括：绝缘基板; 以及形成在绝缘基板上的电路。 该电路包括：具有电路图案的底涂层，其通过沿电路的外形以激光照射覆盖绝缘基板的表面的金属薄膜而形成，以沿着外部形状部分去除金属薄膜 电路 Cu镀层，Ni镀层和通过金属电镀形成的Au镀层，并依次设置在底涂层的表面上。 在Ni镀层和Au镀层之间设置第一中间镀层和第二中间镀层。 第一中间镀层包括相对于Au具有较低贵族标准电极电位的金属，并与Au镀层接触。 第二中间镀层包括相对于第一中间镀层中的金属具有贵族标准电极电位并与第一中间镀层接触的金属。

公开(公告)号：US20070182059A1

公开(公告)日：2007-08-09

申请号：US10591865

申请日：2005-03-03

申请人： Naoto Ikegawa ,  Satoshi Okamoto ,  Shiro Katagiri

发明人： Naoto Ikegawa ,  Satoshi Okamoto ,  Shiro Katagiri

IPC分类号： B29C71/02 ,  C09K19/52 ,  C08K3/34 ,  C08J5/00 ,  H01B3/04

CPC分类号： C08L67/00 ,  C08G63/605 ,  C08G63/87 ,  C08J7/08 ,  C08J2323/00 ,  C08J2367/00 ,  C08L23/0846 ,  C08L23/0884 ,  C08L23/30 ,  C08L67/04 ,  H05K1/024 ,  H05K1/0313 ,  H05K3/0011 ,  H05K2201/0141 ,  H05K2201/09118 ,  H05K2203/1105 ,  C08L2666/14 ,  C08L2666/18 ,  C08L2666/06 ,  C08L23/00 ,  C08L2666/04

摘要： A resin molded article having a reduced dielectric loss tangent is provided. This resin molded article is obtained by performing a heat treatment to a resin composition comprising a liquid-crystalline polyester and an epoxy-group containing ethylene copolymer at a temperature lower than a flow-beginning temperature of the liquid-crystalline polyester, preferably at a temperature between a lower limit temperature calculated by subtracting 120° C. from the flow-beginning temperature and an upper limit temperature calculated by subtracting 20° C. from the flow-beginning temperature. This resin molded article has a smaller dielectric loss tangent than the resin molded article obtained from the resin composition without the heat treatment.

摘要翻译： 提供具有降低的介电损耗角正切的树脂模塑制品。 该树脂成形品是通过在低于液晶聚酯的流动开始温度的温度下对包含液晶聚酯和含环氧基的乙烯共聚物的树脂组合物进行热处理而获得的，优选温度 在从流动开始温度减去120℃计算的下限温度与从流动开始温度减去20℃计算出的上限温度之间。 该树脂成型品的热损失比由树脂组合物得到的树脂成形品的介电损耗角正切小。

公开(公告)号：US08062765B2

公开(公告)日：2011-11-22

申请号：US11773692

申请日：2007-07-05

申请人： Youichiro Nakahara ,  Naoto Ikegawa

发明人： Youichiro Nakahara ,  Naoto Ikegawa

IPC分类号： B32B15/01 ,  B32B15/20 ,  C25D3/46

CPC分类号： C25D5/02 ,  C25D3/46 ,  C25D5/10 ,  C25D5/50 ,  H01L33/60 ,  Y10T428/12882 ,  Y10T428/12896 ,  Y10T428/12993

摘要： The inventors have conducted vigorous studies, and discovered as a result that it is possible to form a silver layer having a high reflectance of about 90 to 99% in a visible light area by setting a grain size of an outermost surface of a silver plated layer within a range of 0.5 μm or more to 30 μm or less.

摘要翻译： 发明人进行了深入研究，结果发现通过设定银镀层的最外表面的粒径，可以在可见光区域形成具有约90〜99％的高反射率的银层 在0.5μm以上且30μm以下的范围内。

公开(公告)号：US08338716B2

公开(公告)日：2012-12-25

申请号：US12741105

申请日：2008-11-04

申请人： Youichiro Nakahara ,  Naoto Ikegawa ,  Kyohei Uemura ,  Yoshiyuki Uchinono

发明人： Youichiro Nakahara ,  Naoto Ikegawa ,  Kyohei Uemura ,  Yoshiyuki Uchinono

IPC分类号： H05K1/09

CPC分类号： H05K3/027 ,  H05K3/108 ,  H05K3/244 ,  H05K2201/09363 ,  H05K2203/0723 ,  H05K2203/107

摘要： A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along an outer shape of the circuit so as to partly remove the metal thin film along the outer shape of the circuit; a Cu plating layer, a Ni plating layer and a Au plating layer formed by metal plating and sequentially provided on a surface of the undercoat layer. A first middle plating layer and a second middle plating layer are provided between the Ni plating layer and the Au plating layer. The first middle plating layer includes metal with a less noble standard electrode potential with respect to Au and is in contact with the Au plating layer. The second middle plating layer includes metal with a noble standard electrode potential with respect to the metal in the first middle plating layer and is in contact with the first middle plating layer.

摘要翻译： 电路板包括：绝缘基板; 以及形成在绝缘基板上的电路。 该电路包括：具有电路图案的底涂层，其通过沿电路的外形以激光照射覆盖绝缘基板的表面的金属薄膜而形成，以沿着外部形状部分去除金属薄膜 电路 Cu镀层，Ni镀层和通过金属电镀形成的Au镀层，并依次设置在底涂层的表面上。 在Ni镀层和Au镀层之间设置第一中间镀层和第二中间镀层。 第一中间镀层包括相对于Au具有较低贵族标准电极电位的金属，并与Au镀层接触。 第二中间镀层包括相对于第一中间镀层中的金属具有贵族标准电极电位并与第一中间镀层接触的金属。

公开(公告)号：US07992445B2

公开(公告)日：2011-08-09

申请号：US12441620

申请日：2007-09-27

申请人： Mitsuru Kobayashi ,  Hiroshi Inoue ,  Hitoshi Makinaga ,  Junji Imai ,  Yasufumi Masaki ,  Naoto Ikegawa ,  Youichiro Nakahara

发明人： Mitsuru Kobayashi ,  Hiroshi Inoue ,  Hitoshi Makinaga ,  Junji Imai ,  Yasufumi Masaki ,  Naoto Ikegawa ,  Youichiro Nakahara

IPC分类号： G01L9/12

CPC分类号： G01L9/0075

摘要： In a pressure sensor including a pressure detecting element in an intermediate portion or at a deep side of a through hole formed in a protrusion, a body portion (a base portion and the protrusion) is made of ceramic or an insulative resin material and molded into a predetermined shape, and the pressure sensor is constituted as a molded interconnect device in which a conductive pattern is formed on a surface thereof. Accordingly, a smaller pressure sensor can be obtained.

摘要翻译： 在包括形成在突起中的通孔的中间部分或深侧的压力检测元件的压力传感器中，主体部（基部和突起）由陶瓷或绝缘树脂材料制成并成型为 预定形状，并且压力传感器构成为其表面上形成有导电图案的模制互连装置。 因此，可以获得较小的压力传感器。

公开(公告)号：US20090266173A1

公开(公告)日：2009-10-29

申请号：US12441620

申请日：2007-09-27

申请人： Mitsuru Kobayashi ,  Hiroshi Inoue ,  Hitoshi Makinaga ,  Junji Imai ,  Yasufumi Masaki ,  Naoto Ikegawa ,  Youichiro Nakahara

发明人： Mitsuru Kobayashi ,  Hiroshi Inoue ,  Hitoshi Makinaga ,  Junji Imai ,  Yasufumi Masaki ,  Naoto Ikegawa ,  Youichiro Nakahara

IPC分类号： G01L9/12

CPC分类号： G01L9/0075

摘要： In a pressure sensor including a pressure detecting element in an intermediate portion or at a deep side of a through hole formed in a protrusion, a body portion (a base portion and the protrusion) is made of ceramic or an insulative resin material and molded into a predetermined shape, and the pressure sensor is constituted as a molded interconnect device in which a conductive pattern is formed on a surface thereof. Accordingly, a smaller pressure sensor can be obtained.

摘要翻译： 在包括形成在突起中的通孔的中间部分或深侧的压力检测元件的压力传感器中，主体部（基部和突起）由陶瓷或绝缘树脂材料制成并成型为 预定形状，并且压力传感器构成为其表面上形成有导电图案的模制互连装置。 因此，可以获得较小的压力传感器。

公开(公告)号：US6060124A

公开(公告)日：2000-05-09

申请号：US906940

申请日：1997-08-06

申请人： Naoto Ikegawa ,  Hiroshi Harada ,  Ryuichi Hamabe

发明人： Naoto Ikegawa ,  Hiroshi Harada ,  Ryuichi Hamabe

IPC分类号： B29B11/16 ,  B29B15/12 ,  B29K105/08 ,  C08J5/24 ,  B05D3/02

CPC分类号： B29B15/122

摘要： There is provided a process of producing a prepreg in which a sheet-shaped fabric material as a reinforcing substrate is continuously provided, a thermosetting resin as a matrix resin in a molten state is supplied to the substrate, and the resin is heated, which process contains the steps of:(a) a first coating step in which the matrix resin is applied to one surface of the reinforcing substrate using a first die coater, and an amount of the matrix resin to be applied is equal to or larger than an amount of the matrix resin which the reinforcing substrate is able to contain in its total void as much as possible,(b) a first heating step in which the reinforcing substrate having the matrix resin is heated by a first non-contact type heating unit so that the matrix resin is impregnated into the inside of the reinforcing substrate, whereby a laminar composite made of the matrix resin and the reinforcing substrate is obtained,(c) a second coating step in which the matrix resin is further applied to at least one of surfaces of the laminar composite using a second die coater, and(d) a second heating step in which the laminar composite which has an amount of the matrix resin applied in the step (c) is heated by a second non-contact type heating unit so as to semi-harden the matrix resin.

摘要翻译： 提供一种制备预浸料坯的方法，其中连续提供作为增强基材的片状织物材料，将作为基体树脂的热固性树脂熔融状态供应到基材中，并且加热该树脂 包括以下步骤：（a）第一涂布步骤，其中使用第一模涂机将基质树脂施加到增强基材的一个表面，并且所施加的基体树脂的量等于或大于 （b）第一加热步骤，其中具有基质树脂的增强基材由第一非接触型加热单元加热，使得在第一加热步骤中，加强基材能够在其总空隙中尽可能多地容纳在基体树脂中， 将基质树脂浸渍到增强基材的内部，由此获得由基体树脂和增强基材制成的层状复合体，（c）第二涂布步骤，其中基体树脂进一步 使用第二模具涂布机施加到层状复合材料的至少一个表面，以及（d）第二加热步骤，其中将在步骤（c）中施加的基体树脂的量的层状复合材料加热到第二加热步骤 非接触型加热单元，以使基体树脂半硬化。