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    Semiconductor device
    3.
    发明授权
    Semiconductor device 有权

    公开(公告)号：US11735682B2

    公开(公告)日：2023-08-22

    申请号：US16754612

    申请日：2018-10-16

    Applicant: OSRAM OLED GmbH

    Inventor： Tilman Ruegheimer ,  Hubert Halbritter

    IPC: H01L31/173 ,  G01S17/04 ,  G01S7/481 ,  H01L25/16 ,  A61B5/024 ,  G06F3/01

    CPC classification number: H01L31/173 ,  G01S7/4815 ,  G01S17/04 ,  H01L25/167 ,  A61B5/02427 ,  G06F3/017

    Abstract: A semiconductor device includes a first semiconductor body including a substrate having a first thickness, wherein the first semiconductor body includes a first active zone that generates or receives radiation, and a second semiconductor body having a second thickness smaller than the first thickness and including a tear-off point is arranged on the substrate and connected in an electrically conducting manner to the first semiconductor body, wherein the second semiconductor body includes a second active zone that generates or receives radiation, and the second active zone generates radiation and the first active zone detects the radiation, and the first semiconductor body includes contacts on its underside for connection to the semiconductor device.

    Arrangement for a display and method
    4.
    发明授权
    Arrangement for a display and method 有权

    公开(公告)号：US11501681B2

    公开(公告)日：2022-11-15

    申请号：US17251072

    申请日：2019-05-24

    Applicant: OSRAM OLED GmbH

    Inventor： Tilman Rügheimer ,  Hubert Halbritter

    IPC: G09G3/20 ,  G09G3/32 ,  G09G3/34 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62

    Abstract: In an embodiment an arrangement includes a plurality of pixels, wherein each pixel includes at least two subpixels of each color, wherein each color is defined by a predefined target color location, wherein each subpixel comprises an optoelectronic component defined by a color location, wherein the color locations of the optoelectronic components of each color is chosen such that during operation of the optoelectronic components the predefined target color location is met for each color, wherein the optoelectronic components for each color are of identical design, and a controller configured to commonly control the optoelectronic components of a color.

    Method for producing a semiconductor device and semiconductor device
    5.
    发明授权
    Method for producing a semiconductor device and semiconductor device 有权

    公开(公告)号：US11361983B2

    公开(公告)日：2022-06-14

    申请号：US16977823

    申请日：2019-03-04

    Applicant: Osram Oled GmbH

    Inventor： Hubert Halbritter

    IPC: H01L21/683 ,  B41F16/00 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18

    Abstract: A method for producing a semiconductor device may include applying one or more semiconductor components onto a device body where the device body has a substrate and an integrated circuit. The semiconductor component(s) may include an active zone configured to receive radiation. The method may further include transferring a multitude of semiconductor components from a sacrificial wafer to a target wafer with the device bodies still coupled by using a stamp to place them onto said device bodies. The stamp may be pressed onto the semiconductor components to adhere to the semiconductor components to the stamp and transfer them. As soon as the stamp moves in the opposite direction, the semiconductor component(s) may be separated from holding structures by breaking away webs or their projections on the second semiconductor body and leaving a breaking point directly on an outside of the semiconductor component.

    Method for producing a plurality of transferable components and composite component of components
    9.
    发明授权
    Method for producing a plurality of transferable components and composite component of components 有权

    公开(公告)号：US11509113B2

    公开(公告)日：2022-11-22

    申请号：US16977165

    申请日：2019-02-05

    Applicant: OSRAM OLED GmbH

    Inventor： Hubert Halbritter ,  Martin Rudolf Behringer

    IPC: H01S5/183 ,  H01S5/02

    Abstract: A method for producing a composite component (100) and a composite component (100) comprising a plurality of components (10), a removable sacrificial layer (4), an anchoring structure (3) and a common intermediate carrier (90) are specified. The components each have a semiconductor body (2) comprising an active zone (23), are configured to generate coherent electromagnetic radiation and are arranged on the common intermediate carrier. The sacrificial layer is arranged in a vertical direction between the intermediate carrier and the components. The anchoring structure comprises a plurality of anchoring elements (3A, 3B), wherein the anchoring structure and the sacrificial layer provide a mechanical connection between the intermediate carrier and the components. Without the sacrificial layer, the components are mechanically connected to the intermediate carrier solely via the anchoring elements, wherein the anchoring elements are formed in such a way that under mechanical load they release the components so that the components are detachable from the intermediate carrier and are thus formed to be transferable.

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