公开(公告)号：US20110114983A1

公开(公告)日：2011-05-19

申请号：US13015590

申请日：2011-01-28

申请人： PO-MIN TU ,  SHIH-CHENG HUANG ,  WEN-YU LIN ,  CHIH-PENG HSU ,  SHIH-HSIUNG CHAN

发明人： PO-MIN TU ,  SHIH-CHENG HUANG ,  WEN-YU LIN ,  CHIH-PENG HSU ,  SHIH-HSIUNG CHAN

IPC分类号： H01L33/10

CPC分类号： H01L33/007 ,  H01L21/0237 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02639 ,  H01L21/0265

摘要： A photoelectric device having Group III nitride semiconductor includes a conductive layer, a metallic mirror layer located on the conductive layer, and a Group III nitride semiconductor layer located on the metallic mirror layer. The Group III nitride semiconductor layer defines a number of microstructures thereon. Each microstructure includes at least one angled face, and the angled face of each microstructure is a crystal face of the Group III nitride semiconductor layer.

摘要翻译： 具有III族氮化物半导体的光电器件包括导电层，位于导电层上的金属镜层和位于金属镜面层上的III族氮化物半导体层。 III族氮化物半导体层在其上限定了许多微结构。 每个微结构包括至少一个成角度的面，并且每个微结构的倾斜面是III族氮化物半导体层的晶体面。

公开(公告)号：US20120092861A1

公开(公告)日：2012-04-19

申请号：US13332379

申请日：2011-12-21

申请人： CHIH-PENG HSU ,  CHUNG-MIN CHANG

发明人： CHIH-PENG HSU ,  CHUNG-MIN CHANG

IPC分类号： F21S4/00

CPC分类号： F21V7/05 ,  F21S8/00 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A planar light source apparatus includes a plurality of elongated lighting elements disposed in a common plane, and a plurality of mirror reflectors arranged perpendicular to the common plane and facing the lighting elements. The lighting elements are equidistantly spaced from each other. The lighting elements face a same direction. The mirror reflectors frame the lighting elements. The mirror reflectors each have a reflecting surface facing the lighting elements. The reflecting surfaces are perpendicular to the common plane. A distance between one of the reflectors and its nearest lighting element is maximum of half the distance between two adjacent lighting elements.

摘要翻译： 平面光源装置包括设置在公共平面中的多个细长的照明元件，以及垂直于公共平面布置并面向照明元件的多个反射镜。 照明元件彼此间隔开。 照明元件面向相同的方向。 镜面反光镜框架照明元件。 镜面反射器各自具有面向照明元件的反射表面。 反射面垂直于公共平面。 反射器之一和其最近的照明元件之间的距离最大为两个相邻照明元件之间的距离的一半。

公开(公告)号：US20090252655A1

公开(公告)日：2009-10-08

申请号：US12251719

申请日：2008-10-15

申请人： CHIH-PENG HSU ,  CHUNG-MIN CHANG ,  TSE-AN LEE

发明人： CHIH-PENG HSU ,  CHUNG-MIN CHANG ,  TSE-AN LEE

IPC分类号： A61L9/00

CPC分类号： A61L9/205 ,  B01D53/885 ,  B01D2255/802

摘要： A photo-catalyst air cleaner includes at least one light source, a photo-catalyst filter and a first water supply. The photo-catalyst filter includes a hydrophilic substrate with a layer formed on a surface of the substrate exposed to light from the at least one light source. The water supply is configured for supplying water for absorption by the substrate, thereby humidifying surfaces of the photo-catalyst filter.

摘要翻译： 光催化剂空气净化器包括至少一个光源，光催化剂过滤器和第一供水源。 光催化剂过滤器包括亲水基材，其具有在暴露于来自至少一个光源的光的基板的表面上形成的层。 供水构造为供给水以供基材吸收，从而加湿光催化剂过滤器的表面。

公开(公告)号：US20090225556A1

公开(公告)日：2009-09-10

申请号：US12233005

申请日：2008-09-18

申请人： CHIH-PENG HSU ,  CHIH-MING LAI

发明人： CHIH-PENG HSU ,  CHIH-MING LAI

IPC分类号： B60Q1/06 ,  F25B21/02

CPC分类号： H01L35/32 ,  F21V29/54 ,  F21Y2115/10

摘要： A thermoelectric cooler includes a plurality of P-type semiconductor elements, a plurality of N-type semiconductor elements, a plurality of connection circuits, a cold end and a hot end. The P-type semiconductor elements are electrically connected to the N-type semiconductor elements by the connection circuits. The P-type semiconductor elements, the N-type semiconductor elements and the connection circuits are sandwiched between the cold end and the hot end providing thermal connection therebetween. The cold end includes a first metal base and a first insulated metal oxide film formed on a side of the first metal base adjacent to the P-type semiconductor elements, the N-type semiconductor elements and the connection circuits.

摘要翻译： 热电冷却器包括多个P型半导体元件，多个N型半导体元件，多个连接电路，冷端和热端。 P型半导体元件通过连接电路与N型半导体元件电连接。 P型半导体元件，N型半导体元件和连接电路夹在冷端和提供热连接的热端之间。 冷端包括形成在与P型半导体元件相邻的第一金属基底的一侧上的第一金属基底和第一绝缘金属氧化物膜，N型半导体元件和连接电路。

公开(公告)号：US20090152582A1

公开(公告)日：2009-06-18

申请号：US12242591

申请日：2008-09-30

申请人： CHUNG-MIN CHANG ,  CHIH-PENG HSU ,  CHUN-WEI WANG

发明人： CHUNG-MIN CHANG ,  CHIH-PENG HSU ,  CHUN-WEI WANG

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting diode includes a reflective cup, an LED chip, and many electrodes, a first light scattering layer, and a phosphor layer. The reflective cup includes a bottom and a sidewall extending from the bottom. The LED chip is received in the reflective cup and mounted on the bottom thereof for emitting first light of a first wavelength. The electrodes each has a first end electrically connected to the LED chip and an opposite second end exposed at an outer surface of the reflective cup. The first light scattering layer formed in the reflective cup on the bottom thereof and covering the LED chip, which has a concave surface at an opposite side thereof to the LED chip. The phosphor layer formed on the concave surface of the light scattering layer for converting part of the first light into second light of a second wavelength.

摘要翻译： 发光二极管包括反射杯，LED芯片和许多电极，第一光散射层和磷光体层。 反射杯包括底部和从底部延伸的侧壁。 LED芯片被容纳在反射杯中并安装在其底部以发射第一波长的第一光。 电极各自具有电连接到LED芯片的第一端和暴露在反射杯的外表面的相对的第二端。 第一光散射层形成在其底部的反射杯中并且覆盖LED芯片，该LED芯片在其与LED芯片的相对侧具有凹面。 形成在光散射层的凹面上的荧光体层，用于将第一光的一部分转换为第二波长的第二光。

公开(公告)号：US20100001299A1

公开(公告)日：2010-01-07

申请号：US12488715

申请日：2009-06-22

申请人： CHUNG-MIN CHANG ,  CHIH-PENG HSU ,  CHUN-WEI WANG

发明人： CHUNG-MIN CHANG ,  CHIH-PENG HSU ,  CHUN-WEI WANG

IPC分类号： H01L33/00

CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting diode illuminating apparatus for emitting colorful light includes a substrate, a first lighting element, a second lighting element, a third lighting element. The first, second and third lighting elements are juxtaposed at the substrate. The first lighting element includes a first LED chip, and a first filling layer encapsulating it. The first filling layer includes red phosphor generally evenly doped therein. The second lighting element includes a second LED chip and a second filling layer encapsulating it. The third lighting element includes a third LED chip and a third filling layer encapsulating it. All of the first, the second and the third LED chips are the same kind of LED chip selected from the group consisting of GaN LED chips, AlGaN LED chips and InGaN LED chips. Light emitting from the filling layers are capable of mixing to produce light of a uniform color.

摘要翻译： 用于发射彩色光的发光二极管照明装置包括基板，第一照明元件，第二照明元件，第三照明元件。 第一，第二和第三照明元件并置在基板上。 第一照明元件包括第一LED芯片和封装其的第一填充层。 第一填充层包括其中通常均匀掺杂的红色荧光体。 第二照明元件包括第二LED芯片和封装其的第二填​​充层。 第三照明元件包括第三LED芯片和封装其的第三填充层。 所有第一，第二和第三LED芯片是从由GaN LED芯片，AlGaN LED芯片和InGaN LED芯片组成的组中选择的相同种类的LED芯片。 从填充层发射的光能够混合以产生均匀颜色的光。

公开(公告)号：US20090321778A1

公开(公告)日：2009-12-31

申请号：US12487821

申请日：2009-06-19

申请人： TUNG-AN CHEN ,  CHIH-PENG HSU ,  CHUNG-MIN CHANG ,  TSE-AN LEE

发明人： TUNG-AN CHEN ,  CHIH-PENG HSU ,  CHUNG-MIN CHANG ,  TSE-AN LEE

IPC分类号： H01L33/00 ,  H01L21/768

CPC分类号： H01L33/62 ,  H01L24/17 ,  H01L24/81 ,  H01L33/44 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/1703 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/00

摘要： A flip-chip light emitting diode includes a substrate, an LED chip and a plurality of conductive bumps. The substrate has at least one recess defined in the surface of the substrate, and at least a part of the conductive bumps is embedded the at least one recess. The LED chip is mounted on a surface of the substrate by a flip-chip mounting process. The conductive bumps are sandwiched between the substrate and the LED chip to bond and electrically connect the LED chip to the substrate.

摘要翻译： 倒装芯片发光二极管包括基板，LED芯片和多个导电凸块。 衬底具有限定在衬底的表面中的至少一个凹部，并且至少一部分导电凸块嵌入至少一个凹部中。 LED芯片通过倒装芯片安装工艺安装在基板的表面上。 导电凸块夹在基板和LED芯片之间，以将LED芯片接合并电连接到基板。

公开(公告)号：US20090189167A1

公开(公告)日：2009-07-30

申请号：US12344647

申请日：2008-12-29

申请人： CHIH-PENG HSU ,  CHIH-PANG MA ,  WEN-JANG JIANG

发明人： CHIH-PENG HSU ,  CHIH-PANG MA ,  WEN-JANG JIANG

IPC分类号： H01L33/00

CPC分类号： H01L33/38 ,  H01L33/20 ,  H01L33/42

摘要： An exemplary solid-state light emitting device includes a substrate, a light emitting structure, a first electrode and a second electrode have opposite polarities with each other. The light emitting structure includes a first-type semiconductor layer, a second-type semiconductor layer and an active layer between the first-type semiconductor layer and the second-type semiconductor layer. The first electrode electrically is connected with the first-type semiconductor layer. The first electrode includes a first contact pad and a current induced electrode spaced apart and insulated from each other. The second electrode has an opposite polarity with respect to the first electrode. The second electrode includes a transparent conductive layer formed on and electrically connected with the second-type semiconductor layer and a metallic conductive layer formed on the transparent conductive layer and in electrical contact therewith.

摘要翻译： 示例性固态发光器件包括基板，发光结构，第一电极和第二电极彼此具有相反的极性。 发光结构包括第一类型半导体层，第二类型半导体层和在第一类型半导体层和第二类型半导体层之间的有源层。 第一电极与第一型半导体层连接。 第一电极包括彼此间隔开并绝缘的第一接触焊盘和电流感应电极。 第二电极相对于第一电极具有相反的极性。 第二电极包括形成在第二类型半导体层上并与第二类型半导体层电连接的透明导电层和形成在透明导电层上并与之电接触的金属导电层。

公开(公告)号：US20090160330A1

公开(公告)日：2009-06-25

申请号：US12242565

申请日：2008-09-30

申请人： CHIH-PENG HSU ,  CHUN-WEI WANG

发明人： CHIH-PENG HSU ,  CHUN-WEI WANG

IPC分类号： H01J1/62

CPC分类号： H01L25/0753 ,  F21K9/69 ,  H01L33/504 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A solid-state illuminating apparatus for emitting white light with high CRI includes a substrate, a first lighting element, a second lighting element, a third lighting element. The first, second and third lighting elements are respectively placed in a first, a second, and a third receiving groove. The first lighting element includes a first solid-state lighting chip and a first filling layer encapsulating the first solid-state lighting chip therein. Similar to the first lighting element, the second lighting element includes a second solid-state lighting chip and a second filling layer, and the third lighting element includes a third solid-state lighting chip and a third filling layer. The first, second and third solid-state lighting chip are solid-state lighting chip with the same color light. At least two of the first, second, and third filling layer include two different phosphor materials respectively doped therein.

摘要翻译： 用于发射具有高CRI的白光的固态照明装置包括基板，第一照明元件，第二照明元件，第三照明元件。 第一，第二和第三照明元件分别放置在第一，第二和第三接收槽中。 第一照明元件包括第一固态照明芯片和在其中封装第一固态照明芯片的第一填充层。 类似于第一照明元件，第二照明元件包括第二固态照明芯片和第二填充层，并且第三照明元件包括第三固态照明芯片和第三填充层。 第一，第二和第三固态照明芯片是具有相同颜色光的固态照明芯片。 第一，第二和第三填充层中的至少两个包括分别掺杂在其中的两种不同的荧光材料。

公开(公告)号：US20130033857A1

公开(公告)日：2013-02-07

申请号：US13477076

申请日：2012-05-22

申请人： YA-WEN LIN ,  CHIH-PENG HSU

发明人： YA-WEN LIN ,  CHIH-PENG HSU

IPC分类号： F21V7/00 ,  F21V15/01

CPC分类号： H05K1/0203 ,  F21S4/20 ,  F21V23/02 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H05K1/056 ,  H05K1/142 ,  H05K3/0064 ,  H05K2201/10106 ,  H01L2924/00014

摘要： An LED light bar comprises a housing, a circuit board with a plurality of separated portions located on the housing, a plurality of LED package devices disposed on the circuit board and electrically connecting to the circuit board, and a plurality of power dispensers respectively electrically connecting to the separated portions of the circuit board. The plurality of LED package devices is divided into a plurality of groups respectively on the plurality of separated portions of the circuit board, wherein the plurality of LED package devices of each of the groups forms a closed loop. Each separated portion of the circuit board includes a metal layer on the housing, an insulating layer on the metal layer and a circuit layer on the insulating layer. Each group of the LED package devices is on a corresponding circuit layer.

摘要翻译： LED灯条包括壳体，具有位于壳体上的多个分离部分的电路板，设置在电路板上并电连接到电路板的多个LED封装器件，以及分别电连接的多个功率分配器 到电路板的分离部分。 多个LED封装器件分别在电路板的多个分离部分上被分成多个组，其中每个组的多个LED封装器件形成闭环。 电路板的每个分离部分包括壳体上的金属层，金属层上的绝缘层和绝缘层上的电路层。 每组LED封装器件都在相应的电路层上。