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公开(公告)号：US20250132085A1
公开(公告)日：2025-04-24
申请号：US18885451
申请日：2024-09-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyun KIM , Byeong Cheol MOON
IPC: H01F27/29 , H01F27/255 , H01F27/30 , H01F27/32
Abstract: A coil component includes: a body having a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction; a support member disposed inside the body and having one surface and another surface opposing each other, and a side surface connecting the one surface and the other surface to each other; a coil disposed on the support member 10 and including coil portions respectively having at least one turn and lead portions extending from respective outermost turns of the coil portions and bent toward the first surface; and external electrodes disposed on the first surface and connected to the respective lead portions.
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公开(公告)号：US20250079060A1
公开(公告)日：2025-03-06
申请号：US18773966
申请日：2024-07-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyun KIM , Byeong Cheol MOON , Dong Jin LEE , Dong Hwan LEE , Dae Ki LIM , Boum Seock KIM
Abstract: A coil component according to an aspect of the present disclosure includes a coil component having a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connecting the first surface to the second surface and opposing each other in a second direction; a coil disposed in the body; an external electrode disposed on the body and connected to the coil; and a first heat dissipation portion disposed on the first surface, wherein the body includes a groove disposed in a region between the first heat dissipation portion and the external electrode.
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公开(公告)号：US20250029773A1
公开(公告)日：2025-01-23
申请号：US18588361
申请日：2024-02-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyun KIM , Donghwan LEE , Dong Jin LEE , Daeki LIM , Boumseock KIM
Abstract: A coil electronic component is provided that includes a first coil including at least one turn of a first conductive wire, a second coil including at least one turn of a second conductive wire, an intermediate layer disposed between the first coil and the second coil and having a first permeability, and a magnetic body surrounding the first coil, the second coil, and the intermediate layer, and having a second permeability different from the first magnetic permeability. A cross-sectional shape of the first conductive wire and a cross-sectional shape of the second conductive wire are different.
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公开(公告)号：US20240029941A1
公开(公告)日：2024-01-25
申请号：US18102911
申请日：2023-01-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Hwan LEE , Chan YOON , Dong Jin LEE , Tae Hyun KIM , Byeong Cheol MOON , Boum Seock KIM
CPC classification number: H01F27/2804 , H01F27/292
Abstract: A coil component includes a body, a first coil disposed in the body and including a first winding portion having a turns number less than one turn, a second coil disposed in the body and including a second winding portion having a turns number less than one turn, a first external electrode and a second external electrode, respectively connected to one end and the other end of the first coil, and a third external electrode and a fourth external electrode, respectively connected to one end and the other end of the second coil. A portion of the first winding portion is disposed on an internal side of the second winding portion, and a portion of the second winding portion is disposed on an internal side of the first winding portion.
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公开(公告)号：US20150136451A1
公开(公告)日：2015-05-21
申请号：US14268970
申请日：2014-05-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Woo PARK , Do Jae YOO , Tae Hyun KIM
CPC classification number: H05K3/4007 , H01L21/4853 , H01L21/568 , H01L23/3121 , H01L23/49811 , H01L2924/0002 , H05K3/284 , H05K2203/0338 , Y10T29/49146 , H01L2924/00
Abstract: There is provided an electronic component module including: a substrate on which an electronic component is mounted; at least one insulating member coupled to the substrate and having a surface on which a plating layer is formed; and a molded portion covering the electronic component and the at least one insulating member, wherein the insulating member is bonded to the substrate and a metal layer is formed on a bonding surface between the substrate and the insulating member.
Abstract translation: 提供了一种电子部件模块，包括：安装有电子部件的基板; 至少一个绝缘构件，其耦合到所述衬底并且具有其上形成有镀层的表面; 以及覆盖所述电子部件和所述至少一个绝缘部件的成型部，其中，所述绝缘部件与所述基板接合，并且在所述基板与所述绝缘部件的接合面上形成金属层。
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Patent Agency Ranking
公开(公告)号：US20140185242A1
公开(公告)日：2014-07-03
申请号：US13789030
申请日：2013-03-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Soo KIM , Tae Hyun KIM , Bum Seok SUH , In Wha JEONG , Young Ki LEE
IPC: H05K7/20
CPC classification number: H05K7/209 , H01L23/367 , H01L23/49833 , H01L23/49861 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/48229 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15159 , H01L2224/48227 , H01L2924/00012 , H01L2924/00
Abstract: There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween.
Abstract translation: 提供了功率半导体模块，其中由于加热而可能难以集成的功率半导体元件被模块化。 功率半导体模块包括：电连接到公共连接端子的散热基板; 以及设置在所述散热基板上的多个电子元件，其中，所述电子元件之间具有不同的间隔。
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公开(公告)号：US20250069789A1
公开(公告)日：2025-02-27
申请号：US18645805
申请日：2024-04-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin LEE , Soon KWANG KWON , Dong Hwan LEE , Tae Hyun KIM , Byeong Cheol MOON , Boum Seock KIM
Abstract: A coil component, may include: a body including a first surface and a second surface facing each other in a first direction, and a third surface connecting the first surface and the second surface; a support member disposed within the body; a coil disposed on the support member, and including a coil pattern having at least one turn and a lead-out portion extending from an outer end of the coil pattern to the first surface or the second surface; and an electrode 10 portion extending from the lead-out portion externally of the body and disposed on the body, and having an average thickness smaller than the average thickness of the lead-out portion.
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公开(公告)号：US20250037927A1
公开(公告)日：2025-01-30
申请号：US18634160
申请日：2024-04-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Hwan LEE , Dong Jin LEE , Tae Hyun KIM , Soon Kwang KWON
Abstract: According to an aspect of the present disclosure, a coil component includes a body including a first surface and a second surface opposing each other in a first direction; a coil disposed in the body and including a coil pattern and a lead-out portion extending from the coil pattern, wherein the coil pattern is divided into a first region in which the lead-out portion is disposed, and a second region in which the lead-out portion is not disposed with respect to a central line perpendicular to the first direction and passing through a center of the coil pattern, and wherein an outermost turn of the second region includes a plurality of corner portions, and a first connection portion connecting the plurality of corner portions, and a length of the first connection portion is shorter than a length of each of the corner portions.
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公开(公告)号：US20180053719A1
公开(公告)日：2018-02-22
申请号：US15600114
申请日：2017-05-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hyun KIM , Thomas A. KIM , Kyu Bum HAN , Tae Hoon KIM
IPC: H01L23/522 , H01L23/532
CPC classification number: H01L23/5226 , H01L23/13 , H01L23/49816 , H01L23/53209 , H01L23/53214 , H01L23/53219 , H01L23/53228 , H01L23/53233 , H01L23/53242 , H01L23/53247 , H01L23/5328 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/20 , H01L25/03 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2225/1035 , H01L2225/1058 , H01L2924/1434 , H01L2924/15311 , H01L2924/3025
Abstract: A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.
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公开(公告)号：US20150156575A1
公开(公告)日：2015-06-04
申请号：US14267575
申请日：2014-05-01
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hyun KIM , Heung Woo PARK
CPC classification number: H04R31/00 , H04R17/02 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: There is provided a microphone package including: a microphone element formed on a semiconductor element; a mold enclosing the semiconductor element and the microphone element; and a conductive pattern formed on one surface of the mold and having a hole formed therein, the hole being connected to the microphone element.
Abstract translation: 提供了一种麦克风包，包括：形成在半导体元件上的麦克风元件; 封闭半导体元件和麦克风元件的模具; 以及形成在所述模具的一个表面上并且具有形成在其中的孔的导电图案，所述孔连接到所述麦克风元件。
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