公开(公告)号：US20170301632A1

公开(公告)日：2017-10-19

申请号：US15637220

申请日：2017-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae YOO ,  Kyu Hwan OH ,  Jong In RYU ,  Jae Hyun LIM

IPC: H01L23/552 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/48 ,  H01L23/31 ,  H01L21/78

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: The method of manufacturing a package comprising: preparing a strip substrate having a plurality of separate package regions which are partitioned by a dicing region and via pads which are connected to one ends of plated tails which are divided to be disconnected in the dicing region; mounting at least one electronic component on at least one surface of each package region of the substrate; forming a connection pattern having conductivity in disconnected portions of the plated tails to form electrical connections therebetween; forming a molded part on the surface of the substrate to enclose the electronic component; forming at least one via penetrating through the molded part by applying current through the plated tails; and dicing the substrate in the dicing region to divide the substrate into separate packages, each having the connection pattern exposed to the exterior of the substrate.

公开(公告)号：US20150223361A1

公开(公告)日：2015-08-06

申请号：US14260007

申请日：2014-04-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun LIM ,  Jong In RYU ,  Sun Ho KIM ,  Eun Jung JO ,  Kyu Hwan OH ,  Do Jae YOO

IPC: H05K7/02 ,  H05K13/04 ,  H05K3/34

CPC classification number: H05K3/3478 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/111 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/09409 ,  H05K2201/09436 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10787 ,  H05K2203/0228 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Abstract translation: 提供一种能够通过将电子部件安装在基板的两个表面上而提高集成度的电子部件模块及其制造方法。 根据本公开的示例性实施例的电子部件模块包括：基板; 安装在所述基板的两个表面上的多个电子部件; 连接导体各自具有使用导电粘合剂结合到基板的一个表面的一端; 以及模制部分，其具有嵌入其中并且形成在基板的一个表面上的连接导体，其中连接导体可以具有防止导电粘合剂扩散的至少一个阻挡构件。

公开(公告)号：US20150137339A1

公开(公告)日：2015-05-21

申请号：US14296061

申请日：2014-06-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyu Hwan OH ,  Do Jae YOO

IPC: H01L23/48 ,  H01L21/768 ,  H01L21/56

CPC classification number: H01L23/481 ,  H01L21/565 ,  H01L21/76816 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/19 ,  H01L25/03 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00

Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate including a mounting electrode formed on both sides and a wiring; a plurality of first electronic devices mounted on the substrate; a second electronic devices mounted on the substrate; and a via through which the wiring of the substrate and the second electronic devices are connected.

Abstract translation: 这里公开了一种半导体封装及其制造方法。 半导体封装包括：基板，包括形成在两侧的安装电极和布线; 安装在所述基板上的多个第一电子装置; 安装在基板上的第二电子装置; 以及基板和第二电子设备的布线连接的通孔。

公开(公告)号：US20150131235A1

公开(公告)日：2015-05-14

申请号：US14260994

申请日：2014-04-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae YOO ,  Eun Jung JO ,  Jae Hyun LIM

IPC: H05K5/06 ,  H05K1/18

CPC classification number: H05K5/065 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/115 ,  H05K3/0047 ,  H05K2201/09827 ,  H05K2203/107 ,  H01L2924/00014

Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

Abstract translation: 提供了一种电子部件模块，其中外部端子通过电镀工艺从模具部件向外设置及其制造方法。 电子部件模块包括基板，安装在基板上的至少一个电子元件，密封电子部件的模具部分，以及至少一个连接导体，该连接导体的一端与基板的一个表面结合并形成在模具部分中，以便 穿透模具部件。 连接导体形成为具有连接导体的水平截面积朝向基板逐渐减小的形式，并且包括至少一个台阶。

公开(公告)号：US20240074065A1

公开(公告)日：2024-02-29

申请号：US18111154

申请日：2023-02-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae YOO ,  Yong Gil NAMGUNG ,  Jong Hoon SHIN ,  Sang Soon CHOI ,  Young Chul AN

IPC: H05K3/22 ,  B23K1/00 ,  B23K1/005 ,  B23K1/19

CPC classification number: H05K3/225 ,  B23K1/0016 ,  B23K1/005 ,  B23K1/19 ,  B23K2101/42 ,  H05K2203/16

Abstract: A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.

公开(公告)号：US20200350351A1

公开(公告)日：2020-11-05

申请号：US16535123

申请日：2019-08-08

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Do Jae YOO ,  Byoung Heon KIM ,  Yong Gil NAMGUNG ,  Jong Cheol HONG ,  Si Joong YANG

IPC: H01L27/146 ,  H01L23/00

Abstract: An image sensor package includes a substrate, an image sensor mounted on the substrate, a bonding wire connecting the image sensor to the substrate, a reflector disposed on the image sensor, a sealing member sealing the bonding wire and a portion of the image sensor, and covering at least a portion of the reflector, the sealing member including a hole exposing an effective imaging plane of the image sensor, and a filter attached to the sealing member.

公开(公告)号：US20170018513A1

公开(公告)日：2017-01-19

申请号：US15277156

申请日：2016-09-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae YOO ,  Jung Ho YOON ,  Chul Gyun PARK ,  Myeong Woo HAN ,  Jung Aun LEE

IPC: H01L23/66 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/185 ,  H05K2203/061 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.

Abstract translation: 提供了包括与其一体形成的天线的半导体封装及其制造方法。 半导体封装包括：半导体芯片; 密封半导体芯片的密封部分; 形成在所述密封部的至少一个表面上的基板部; 以及形成在所述密封部或所述基板部上并与半导体芯片电连接的天线部。

公开(公告)号：US20160126200A1

公开(公告)日：2016-05-05

申请号：US14963821

申请日：2015-12-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myeong Woo HAN ,  Do Jae YOO ,  Jung Aun LEE ,  Jung Ho YOON ,  Chul Gyun PARK

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3121 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2924/01029 ,  H01L2924/15787 ,  H01L2924/181 ,  H01Q1/2283 ,  H01Q5/40 ,  H01Q23/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon: a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.

Abstract translation: 半导体器件封装设有用于无线应用的集成天线。 半导体器件封装包括其上安装有半导体芯片的衬底：覆盖半导体芯片的保护层; 安装在保护层上的金属图案; 以及连接半导体芯片和金属图案的第一连接构件。 根据该结构，半导体器件封装能够容易地制造，同时最小化用作天线的金属图案与半导体芯片之间的电距离。

公开(公告)号：US20180110147A1

公开(公告)日：2018-04-19

申请号：US15825606

申请日：2017-11-29

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Do Jae YOO ,  Eun Jung JO ,  Jae Hyun LIM

IPC: H05K5/06 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K5/065 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/115 ,  H05K3/0047 ,  H05K2201/09827 ,  H05K2203/107 ,  H01L2924/00014

Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

公开(公告)号：US20160315027A1

公开(公告)日：2016-10-27

申请号：US15003473

申请日：2016-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong In RYU ,  Ki Joo SIM ,  Do Jae YOO ,  Ki Ju LEE ,  Jin Su KIM

IPC: H01L23/31 ,  H01L23/29 ,  H01L21/56 ,  H01L21/768 ,  H01L23/538 ,  H01L21/268

CPC classification number: H01L23/3121 ,  H01L21/4846 ,  H01L21/565 ,  H01L23/16 ,  H01L23/293 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106

Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

Abstract translation: 半导体封装及其制造方法包括安装在基板的上表面，下表面或两者上的芯片构件。 半导体封装及其制造方法还包括堆叠嵌入芯片部件的模具部件，设置在模具部件的中心部分的连接部件和形成在连接部件的一部分上的焊接部件。