公开(公告)号：US20160345431A1

公开(公告)日：2016-11-24

申请号：US15228304

申请日：2016-08-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Dek Gin YANG

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/02 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/0026 ,  H05K3/0058 ,  H05K3/02 ,  H05K3/027 ,  H05K3/285 ,  H05K3/4644 ,  H05K3/4691 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

公开(公告)号：US20180302979A1

公开(公告)日：2018-10-18

申请号：US16018430

申请日：2018-06-26

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Ha Il KIM ,  Dek Gin YANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

Abstract: The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

公开(公告)号：US20140096383A1

公开(公告)日：2014-04-10

申请号：US14106013

申请日：2013-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je LEE ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

IPC: H05K3/42

CPC classification number: H05K3/429 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2203/054 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49171

Abstract: A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays.

Abstract translation: 一种刚性柔性印刷电路板的制造方法，其特征在于，在其两侧分别形成有内层电路图案和第一窗口的柔性铜箔层叠体的两面分别形成有覆盖层的基板， 在作为基底基板的刚性区域的覆盖层的部分上分层绝缘层和铜箔层; 在刚性区域中形成通孔，同时在柔性区域中形成与第一窗口对应的通孔; 形成包括与所述第一窗口相邻的区域的外部电路图案; 并在刚性区域中施加阻焊剂以暴露部分外部电路图案。 与柔性区域中的通孔相邻的区域包括用于覆盖覆盖层的附加电镀部分。

公开(公告)号：US20210376473A1

公开(公告)日：2021-12-02

申请号：US16938023

申请日：2020-07-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je LEE ,  Chang Gun OH ,  Hyun Kyung PARK ,  Jung Hoon JANG

IPC: H01Q9/04 ,  H01Q21/06 ,  H01Q1/22

Abstract: An antenna substrate includes a body including an insulating material, a plurality of wiring layers stacked with each other in a first vertical direction in the body, and a plurality of first antenna layers stacked with each other in a third horizontal direction in the body. Each of the plurality of first antenna layers includes a plurality of conductive structures, each having a length in a second horizontal direction greater than a length in the third horizontal direction perpendicular to the second horizontal direction, that are stacked in the first vertical direction.

公开(公告)号：US20190297730A1

公开(公告)日：2019-09-26

申请号：US16438755

申请日：2019-06-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je LEE ,  Dek Gin YANG ,  Dong Gi AN ,  Jae Ho SHIN

IPC: H05K3/06 ,  H05K1/09 ,  H05K1/02 ,  H05K3/38 ,  H05K3/46

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

公开(公告)号：US20160234939A1

公开(公告)日：2016-08-11

申请号：US15134055

申请日：2016-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gi Suk KIM ,  Yang Je LEE ,  Hee Ju PARK ,  Jong Hyung KIM ,  Chang Hyun KIM ,  Kyeong Seon CHAE

IPC: H05K1/14 ,  H05K3/46 ,  H04M1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K1/02 ,  H05K5/00

CPC classification number: H05K1/148 ,  H04M1/026 ,  H05K1/0277 ,  H05K1/0278 ,  H05K1/0298 ,  H05K1/0346 ,  H05K1/14 ,  H05K3/0017 ,  H05K3/4691 ,  H05K5/0026 ,  H05K2201/0154

Abstract: Disclosed herein is a portable terminal, including: a case; a first substrate disposed at one side of the case; a second substrate spaced from the first substrate to form a battery installing space; and a connection substrate electrically connecting between the first substrate and the second substrate and disposed in parallel with a side of the case.

公开(公告)号：US20130213695A1

公开(公告)日：2013-08-22

申请号：US13771830

申请日：2013-02-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Han II KIM ,  Dek Gin YANG

IPC: H05K1/02

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4691

Abstract: The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

Abstract translation: 本发明涉及一种制造飞尾型刚柔柔性印刷电路板的方法及其制造的飞尾型刚柔柔性印刷电路板，并实现具有改善填充性能的飞尾型刚挠性印刷电路板 通过提供一种制造飞尾型刚性 - 柔性印刷电路板的方法，包括：提供在两个表面上具有第一内部电路图案层的基底基板; 在基底基板的刚性区域R上层叠第一绝缘层; 将在基底衬底的整个区域上延伸的至少一个电路层层叠在第一绝缘层上; 并且去除对应于柔性域F的电路层的一部分，其中电路层包括第二绝缘层和由其制造的飞尾型刚柔柔性印刷电路板。

公开(公告)号：US20230198165A1

公开(公告)日：2023-06-22

申请号：US17747246

申请日：2022-05-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Sang PARK ,  Yang Je LEE ,  Hyun Kyung PARK ,  Chang Gun OH

IPC: H01Q21/06 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q13/18 ,  H01Q21/28 ,  H01L23/66 ,  H01L23/00

CPC classification number: H01Q21/065 ,  H01Q1/38 ,  H01Q1/422 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q13/18 ,  H01Q21/28 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L2924/2027 ,  H01L2924/1421 ,  H01L2224/16235

Abstract: An antenna substrate includes: a first insulating layer surrounding a cavity; a second insulating layer of which at least a portion is disposed in the cavity and containing an insulating material different from an insulating material of the first insulating layer; a first patch antenna having one surface facing the first insulating layer by an amount greater than half of an area of the first patch antenna; and a second patch antenna having one surface facing the cavity by an amount greater than half of an area of the second patch antenna.

公开(公告)号：US20180146553A1

公开(公告)日：2018-05-24

申请号：US15876702

申请日：2018-01-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Dek Gin YANG

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/02 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/0026 ,  H05K3/0058 ,  H05K3/02 ,  H05K3/027 ,  H05K3/285 ,  H05K3/4644 ,  H05K3/4691 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

公开(公告)号：US20170027055A1

公开(公告)日：2017-01-26

申请号：US15285390

申请日：2016-10-04

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Ha Il KIM ,  Dek Gin YANG

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4691

Abstract: The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

Abstract translation: 本发明涉及一种制造飞尾型刚柔柔性印刷电路板的方法及其制造的飞尾型刚柔柔性印刷电路板，并实现具有改善填充性能的飞尾型刚挠性印刷电路板 通过提供一种制造飞尾型刚性 - 柔性印刷电路板的方法，包括：提供在两个表面上具有第一内部电路图案层的基底基板; 在基底基板的刚性区域R上层叠第一绝缘层; 将在基底衬底的整个区域上延伸的至少一个电路层层叠在第一绝缘层上; 并且去除对应于柔性域F的电路层的一部分，其中电路层包括第二绝缘层和由其制造的飞尾型刚柔柔性印刷电路板。