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公开(公告)号：US20210050336A1
公开(公告)日：2021-02-18
申请号：US16992004
申请日：2020-08-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jamyeong KOO , Sungyong MIN , Byunghoon LEE , Changjoon LEE , Changkyu CHUNG , Youngkyong JO
IPC: H01L25/16 , H01L23/00 , H01L25/075
Abstract: A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.
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公开(公告)号：US20230205078A1
公开(公告)日：2023-06-29
申请号：US17889472
申请日：2022-08-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byunghoon LEE , Jin Goo PARK , Tae-Gon KIM , Sanguk PARK , Changyoung JEONG , Jinho AHN
CPC classification number: G03F1/82 , G03F7/70925 , B08B7/0028 , B08B11/02 , B08B13/00
Abstract: A pellicle cleaning apparatus includes a stage to support a pellicle, a particle remover above the stage, the particle remover being configured to remove a particle from a first surface of a pellicle, and the particle remover including a cantilever, and an adhesive material on a bottom surface of the cantilever, and a pressure controller adjacent to the stage, the pressure controller being configured to control a pressure of a fluid on a second surface of the pellicle.
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公开(公告)号：US20210098911A1
公开(公告)日：2021-04-01
申请号：US17061461
申请日：2020-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minki KIM , Byunghoon LEE , Min PARK , Sungtae PARK , Jungmin PARK , Yongjae SONG , Hongshin SHIN , Woosung Jang , Chulwoo PARK , Chihyun CHO
Abstract: An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.
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公开(公告)号：US20220380643A1
公开(公告)日：2022-12-01
申请号：US17884077
申请日：2022-08-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byungchul YOO , Byunghoon LEE , Myungjun KIM , Jikang KIM , Jeonghwan MIN , Kyoungchae SEO , Changyoung JEONG
IPC: C09J163/00 , G03F1/82 , G03F1/22 , B08B3/04
Abstract: An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % based on a total weight of the adhesive, the epoxy resin composition including an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive, the inorganic filler including one or more of aluminum hydroxide or calcium carbonate.
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公开(公告)号：US20220350256A1
公开(公告)日：2022-11-03
申请号：US17672937
申请日：2022-02-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byunghoon LEE , Maenghyo CHO , Changyoung JEONG , Muyoung KIM , Junghwan MOON , Sungwoo PARK , Hyungwoo LEE
IPC: G03F7/20 , G03F7/40 , H01L21/027 , G05B19/4099 , G06F30/25
Abstract: A lithography method using a multiscale simulation includes estimating a shape of a virtual resist pattern for a selected resist based on a multiscale simulation; forming a test resist pattern by performing an exposure process on a layer formed of the selected resist; determining whether an error range between the test resist pattern and the virtual resist pattern is in an allowable range; and forming a resist pattern on a patterning object using the selected resist when the error range is in the allowable range. The multiscale simulation may use molecular scale simulation, quantum scale simulation, and a continuum scale simulation, and may model a unit lattice cell of the resist by mixing polymer chains, a photo-acid generator (PAG), and a quencher.
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Patent Agency Ranking
公开(公告)号：US20200321229A1
公开(公告)日：2020-10-08
申请号：US16761905
申请日：2018-12-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changjoon LEE , Byunghoon LEE , Min PARK , Kyungwoon JANG , Jeonggen YOON , Hyuntae JANG
IPC: H01L21/67 , H01L25/075 , B65G47/90
Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.
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7.发明公开公开(公告)号：US20240079365A1
公开(公告)日：2024-03-07
申请号：US18373048
申请日：2023-09-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seungryong HAN , Yeonghyeon SEO , Sangmoo PARK , Jinyoung KIM , Byunghoon LEE
CPC classification number: H01L24/29 , H01L24/27 , H01L24/30 , H01L24/32 , H01L24/83 , H01L25/167 , H01L2224/27005 , H01L2224/29028 , H01L2224/29116 , H01L2224/29144 , H01L2224/29155 , H01L2224/2919 , H01L2224/30131 , H01L2224/32145 , H01L2224/83203
Abstract: A display module is provided. The display module includes: a substrate partitioned into a plurality of pixel regions and including a plurality of electrode pads disposed in the pixel regions; a bonding member including an adhesive layer stacked on one surface of the substrate and a plurality of conductive balls disposed in the adhesive layer; and a plurality of light emitting diodes including electrodes connected to the plurality of electrode pads by the plurality of conductive balls, in which the plurality of conductive balls are patterned as a conductive region corresponding to the plurality of electrode pads.
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公开(公告)号：US20230387372A1
公开(公告)日：2023-11-30
申请号：US18205312
申请日：2023-06-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoonsuk LEE , Eunhye KIM , Sangmoo PARK , Jamyeong KOO , Sera KWON , Byunghoon LEE , Changkyu CHUNG
CPC classification number: H01L33/62 , H01L25/167 , H01L33/58 , H01L24/29 , H01L24/30 , H01L24/32 , H01L2224/30505 , H01L2224/30517 , H01L2224/3003 , H01L2224/3011 , H01L2224/32145 , H01L2924/12041 , H01L2224/2919 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29166 , H01L2924/0132
Abstract: Provided is a display assembly including a plurality of light emitting diodes, a plurality of electrodes provided on the plurality of light emitting diodes, a substrate, a plurality of electrode pads provided on the substrate, the plurality of electrode pads being connected to the electrodes provided on the plurality of light emitting diodes, and an adhesive layer fixing the plurality of light emitting diodes to the substrate, wherein the adhesive layer includes a non-conductive polymer resin, a flux agent mixed with the non-conductive polymer resin, and a plurality of conductive particles dispersed in the non-conductive polymer resin and connecting the electrodes of the light emitting diodes and the plurality of electrode pads.
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公开(公告)号：US20220085265A1
公开(公告)日：2022-03-17
申请号：US17456838
申请日：2021-11-29
Inventor： Byunghoon LEE , Taeil KIM , Jamyeong KOO , Juseung LEE
Abstract: Various embodiments of the disclosure disclose a method for manufacturing a micro Light Emitting Diode (LED) display. The disclosed manufacturing method may include coating a face of a substrate including a circuit portion with a first thickness of a polymer adhesive solution containing a plurality of metal particles, attaching an array of micro LED chips on the polymer adhesive solution, physically connecting a connection pad for each of the array of micro LED chips to the metal particles through heating and pressing the attached plurality of micro LED chips to descend through the polymer adhesive solution, and chemically bonding the metal particles to the connection pad and the circuit portion through heating and pressing so that the micro LED chips are electrically connected to the circuit portion. Various other embodiments are also possible.
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公开(公告)号：US20210265327A1
公开(公告)日：2021-08-26
申请号：US17253645
申请日：2019-06-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jamyeong KOO , Youngkyong JO , Byunghoon LEE
Abstract: A micro-LED display and a method for manufacturing same are disclosed. The disclosed micro-LED display may comprise: a circuit board; at least one first electrode formed on the circuit board; at least one micro-LED chip bonded onto the first electrode; a second electrode formed on the micro-LED chip; a bonding structure formed by heating the first electrode and the second electrode through laser irradiation; and at least one composite resin part supporting the bonding structure.
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