公开(公告)号：US20170330989A1

公开(公告)日：2017-11-16

申请号：US15668138

申请日：2017-08-03

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En Luan

IPC: H01L31/173 ,  G01S17/02 ,  G01S7/481 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/0232 ,  G01S17/08

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/08 ,  H01L24/19 ,  H01L31/0203 ,  H01L31/02327 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.

公开(公告)号：US09313386B2

公开(公告)日：2016-04-12

申请号：US14336060

申请日：2014-07-21

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En Luan

IPC: G02B13/16 ,  H04N5/225 ,  G02B7/02 ,  H01L27/146

CPC classification number: H04N5/2254 ,  G02B7/025 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2924/0002 ,  Y10T156/1052 ,  H01L2924/00

Abstract: An electronic device may include a substrate, an image sensor IC over the substrate, and a lens assembly above the substrate. The lens assembly may include a spacer above the substrate, a first adhesive layer over the spacer, a lens aligned with the image sensor IC and over the first adhesive layer, a second adhesive layer surrounding a peripheral surface of the lens and the first adhesive layer, and a baffle over the lens and the second adhesive layer.

Abstract translation: 电子设备可以包括衬底，在衬底上的图像传感器IC，以及在衬底上方的透镜组件。 透镜组件可以包括衬底上方的间隔物，间隔物上方的第一粘合剂层，与图像传感器IC对准的透镜并且在第一粘合剂层上方，包围透镜的外周表面的第二粘合剂层和第一粘合剂层 ，以及透镜和第二粘合剂层上的挡板。

公开(公告)号：US09287227B2

公开(公告)日：2016-03-15

申请号：US14547459

申请日：2014-11-19

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En Luan

IPC: H01L23/495 ,  H01L21/00 ,  H01R9/00 ,  H01L23/00 ,  H01L23/48 ,  H01L23/433 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76885 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/482 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/16 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06177 ,  H01L2224/09151 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/81 ,  H01L2924/00012

Abstract: An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.

Abstract translation: 电子设备可以包括引线，具有第一和第二接合焊盘的IC以及与引线和IC相邻的封装材料，使得引线延伸到限定第一接触焊盘的封装材料的底表面。 电子器件可以包括在第一接合焊盘和相应的引线之间的接合线，以及从第二接合焊盘中的相应焊盘延伸到限定第二接触焊盘的封装材料的底表面的导体。

公开(公告)号：US10141471B2

公开(公告)日：2018-11-27

申请号：US15668138

申请日：2017-08-03

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En Luan

IPC: H01L31/173 ,  H01L31/0203 ,  H01L31/0232 ,  G01S7/481 ,  G01S17/02 ,  G01S17/08 ,  H01L23/00

Abstract: A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.

公开(公告)号：US09923020B2

公开(公告)日：2018-03-20

申请号：US14750859

申请日：2015-06-25

Applicant: STMicroelectronics (Shenzhen) R&D Co. Ltd

Inventor： Jing-En Luan

IPC: H01L27/146 ,  H04N5/369 ,  H01L23/00 ,  H04N5/225

CPC classification number: H01L27/14685 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H04N5/2257 ,  H04N5/369

Abstract: Embodiments of the present invention provide a camera module and a method of manufacturing the same, the camera module comprising a sensor assembly, at least one semiconductor substrate, and a molding compound; wherein the sensor assembly comprises a semiconductor die, a sensor circuit disposed on the top surface of the semiconductor die, and a transparent cover coupled to the semiconductor die over the top surface of the semiconductor die; wherein each semiconductor substrate is disposed around the sensor assembly in a horizontal direction; and wherein the molding compound is filled between each semiconductor substrate and the sensor assembly.

公开(公告)号：US09466557B2

公开(公告)日：2016-10-11

申请号：US14984082

申请日：2015-12-30

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En Luan

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/48 ,  H01L23/433 ,  H01L23/367 ,  H01L23/498 ,  H01L23/28 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76885 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/482 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/16 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06177 ,  H01L2224/09151 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/81 ,  H01L2924/00012

Abstract: An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.

公开(公告)号：US09419047B2

公开(公告)日：2016-08-16

申请号：US14135743

申请日：2013-12-20

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： Jing-En Luan

IPC: H04N5/33 ,  H01L27/146 ,  H04N5/225

CPC classification number: H01L27/14683 ,  H01L27/14618 ,  H01L2224/13 ,  H01L2224/73265 ,  H04N5/2254 ,  H04N5/2257

Abstract: An image sensor device may include an interconnect layer, an image sensor IC adjacent the interconnect layer and having an image sensing surface, and a dielectric layer adjacent the image sensor IC and having an opening therein aligned with the image sensing surface. The image sensor device may also include an IR filter adjacent and aligned with the image sensing surface, and an encapsulation material adjacent the dielectric layer and laterally surrounding the IR filter.

Abstract translation: 图像传感器装置可以包括互连层，邻近互连层并具有图像感测表面的图像传感器IC，以及邻近图像传感器IC的电介质层，并且具有与图像感测表面对准的开口。 图像传感器装置还可以包括与图像感测表面相邻并对齐的IR滤光器，以及邻近介电层并横向围绕IR滤光器的封装材料。

公开(公告)号：US10326039B2

公开(公告)日：2019-06-18

申请号：US16169522

申请日：2018-10-24

Applicant: STMicroelectronics (Shenzhen) R&D Co. Ltd.

Inventor： Jing-En Luan

IPC: G01S17/02 ,  H01L23/00 ,  H01L31/173 ,  G01S17/08 ,  G01S7/481 ,  H01L31/0203 ,  H01L31/0232

Abstract: A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.

公开(公告)号：US20190058076A1

公开(公告)日：2019-02-21

申请号：US16169522

申请日：2018-10-24

Applicant: STMicroelectronics (Shenzhen) R&D Co. Ltd.

Inventor： Jing-En Luan

IPC: H01L31/173 ,  H01L31/0232 ,  G01S17/02 ,  H01L31/0203 ,  G01S17/08 ,  H01L23/00 ,  G01S7/481

Abstract: A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.

公开(公告)号：US09859196B2

公开(公告)日：2018-01-02

申请号：US15251127

申请日：2016-08-30

Applicant: STMicroelectronics (Shenzhen) R&D Co. Ltd.

Inventor： Jing-En Luan

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/48 ,  H01L23/433 ,  H01L23/367 ,  H01L23/498 ,  H01L21/768 ,  H01L23/482 ,  H01L23/28 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76885 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/482 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/16 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06177 ,  H01L2224/09151 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/81 ,  H01L2924/00012

Abstract: An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.