公开(公告)号：US20250022980A1

公开(公告)日：2025-01-16

申请号：US18770345

申请日：2024-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghoon SONG ,  Kyungwook HWANG ,  Junsik HWANG ,  Dongho KIM ,  Joonyong PARK ,  Youngtek OH ,  Minchul YU

IPC: H01L33/00

Abstract: A chemical lift-off device includes a first chamber including a first bath containing a first chemical solution and configured to receive a semiconductor light-emitting device on a substrate, such that the semiconductor light-emitting device is partially separated from the substrate by being submerged in the first chemical solution, a cleaning bath containing deionized water and configured to receive the semiconductor light-emitting device that is partially separated from the substrate, and a second chamber including a separator including a chemical solution sprayer configured to spray a second chemical solution toward the semiconductor light-emitting device that is partially separated from the substrate, such that the semiconductor light-emitting device is completely separated from the substrate by being sprayed with the second chemical solution and a recovery assembly provided at a lower portion of the separator and configured to recover the semiconductor light-emitting device that is completely separated from the substrate.

公开(公告)号：US20240387503A1

公开(公告)日：2024-11-21

申请号：US18788803

申请日：2024-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/00 ,  H01L25/16 ,  H01L27/15

Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.

公开(公告)号：US20240234219A1

公开(公告)日：2024-07-11

申请号：US18409369

申请日：2024-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Joonyong PARK ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Sanghoon SONG ,  Minchul YU ,  Junsik HWANG

IPC: H01L21/66 ,  H01L21/683 ,  H01L25/16

CPC classification number: H01L22/22 ,  H01L21/6835 ,  H01L25/167 ,  H01L2221/68368

Abstract: A method of transferring a micro semiconductor chip and a transferring structure are provided. The method includes providing a plurality of base transferring substrates each including a plurality of grooves, aligning the plurality of base transferring substrates on a first substrate, aligning the plurality of base transferring substrates on a second substrate, providing a target transferring structure by transferring micro semiconductor chips to the base transferring substrates of the first substrate, and providing a preliminary transferring structure by transferring micro semiconductor chips to the base transferring substrates of the second substrate.

公开(公告)号：US20230395575A1

公开(公告)日：2023-12-07

申请号：US18236246

申请日：2023-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Sungwoo Hwang

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L24/08 ,  H01L24/80 ,  H01L33/0095 ,  H01L24/95 ,  H01L24/24 ,  H01L2224/8014 ,  H01L2224/08225 ,  H01L2924/12041 ,  H01L2224/80986 ,  H01L24/82 ,  H01L2224/245 ,  H01L2224/95102 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/9512 ,  H01L2224/95136 ,  H01L2924/10156 ,  H01L2933/0041

Abstract: A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED comprises an active layer comprising a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.

公开(公告)号：US20230170448A1

公开(公告)日：2023-06-01

申请号：US17984462

申请日：2022-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongho KIM ,  Kyungwook HWANG ,  Joonyong PARK ,  Junsik HWANG

IPC: H01L33/50 ,  H01L33/32 ,  H01L25/075 ,  H01L33/10 ,  H01L33/00

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/10 ,  H01L33/32 ,  H01L33/0075 ,  H01L2933/0041

Abstract: Provided is a micro light emitting semiconductor device including a first semiconductor layer, a light emitting layer provided on the first semiconductor layer, a second semiconductor layer provided on the light emitting layer, and a color conversion layer provided on the second semiconductor layer, the color conversion layer including a porous layer that includes quantum dots, wherein a doping type of the second semiconductor layer is different from a doping type of the color conversion layer.

公开(公告)号：US20220246801A1

公开(公告)日：2022-08-04

申请号：US17519754

申请日：2021-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo HONG ,  Hyunjoon KIM ,  Joonyong PARK ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L33/38 ,  H01L27/15

Abstract: Provided is a light-emitting device including a body including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode and a second electrode provided on a first surface of the body, the first electrode and the second electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively, and a third electrode and a fourth electrode provided on a second surface of the body, the third electrode and the fourth electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively.

公开(公告)号：US20220246796A1

公开(公告)日：2022-08-04

申请号：US17477810

申请日：2021-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongho KIM ,  Kyungwook HWANG

IPC: H01L33/12 ,  H01L33/10 ,  H01L33/04 ,  H01L33/32 ,  H01L25/075 ,  H01L33/00

Abstract: Provided is a light emitting device including a buffer layer, a body provided on the buffer layer, the body including a first semiconductor layer, an active layer, and a second semiconductor layer, a reflective layer configured to reflect light incident from the active layer, and a scattering pattern provided between the first semiconductor layer and the buffer layer, the scattering pattern being configured to scatter the light incident from the active layer and light incident from the reflective layer.

公开(公告)号：US20210184070A1

公开(公告)日：2021-06-17

申请号：US16883363

申请日：2020-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Kyungwook HWANG ,  Jungel RYU ,  Sungjin KANG ,  Jongmyeong KIM ,  Jehong OH ,  Euijoon YOON ,  Seungmin LEE ,  Junsik HWANG

IPC: H01L33/00 ,  H01L27/15

Abstract: A method of aligning micro LEDs and a method of manufacturing a micro LED display using the same are provided. The method of aligning micro LEDs includes providing micro LEDs, each having a first surface that has a first maximum width and a second surface opposite to the first surface and has a second maximum width that is greater than the first maximum width, providing a transfer substrate including a transfer mold that has an array of openings, each of the openings being configured to accommodate the first surface of a corresponding micro LED and not accommodate the second surface of the corresponding micro LED and aligning the micro LEDs in one direction in the openings of the transfer mold by inserting the micro LEDs into the openings of the transfer mold so that the first surface of each of the micro LEDs is positioned within a corresponding opening.

公开(公告)号：US20210159361A1

公开(公告)日：2021-05-27

申请号：US16845457

申请日：2020-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Kyungwook HWANG ,  Sungjin KANG ,  Euijoon YOON ,  Junsik HWANG ,  Jongmyeong KIM ,  Jehong OH ,  Jungel RYU ,  Seungmin LEE

IPC: H01L33/24 ,  H01L33/44 ,  H01L33/38 ,  H01L33/00 ,  H01L33/22 ,  H01L25/075

Abstract: Provided are a light-emitting diode (LED) device, a method of manufacturing the LED device, and a display apparatus including the LED device. The LED device includes a light-emitting layer having a core-shell structure, a passivation layer provided to cover a portion of a top surface of the first semiconductor layer, a first electrode provided on the light-emitting layer, and a second electrode provided under the light-emitting layer. The light-emitting layer includes a first semiconductor layer, an active layer, and a second semiconductor layer. The first electrode is provided to contact the first semiconductor layer, and the second electrode is provided to contact the second semiconductor layer.

公开(公告)号：US20190140016A1

公开(公告)日：2019-05-09

申请号：US16183953

申请日：2018-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junhee CHOI ,  Junghun PARK ,  Joohun HAN

IPC: H01L27/15 ,  H01L27/12 ,  H01L33/32 ,  H01L33/06 ,  H01L33/50 ,  H01L33/42

CPC classification number: H01L27/156 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/06 ,  H01L33/145 ,  H01L33/20 ,  H01L33/32 ,  H01L33/382 ,  H01L33/387 ,  H01L33/42 ,  H01L33/46 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58

Abstract: A display device is provided. The display device includes a substrate, an emission layer configured to emit light, the emission layer including a first semiconductor layer provided on the substrate, an active layer provided on the first semiconductor layer, and a second semiconductor layer provided on the active layer, and a plurality of color converting layers provided on the emission layer and configured to emit light of certain colors from light emitted from the emission layer.