SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20210159365A1

    公开(公告)日:2021-05-27

    申请号:US16935356

    申请日:2020-07-22

    Abstract: Semiconductor light emitting devices and methods of fabricating the same are provided. The semiconductor light emitting device includes a light emitting structure, a first electrode, a first dielectric layer, a second electrode, and a vertical conductive pattern. The light emitting structure includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked, and includes a first opening that penetrates the second semiconductor layer and the active layer, the first opening exposing the first semiconductor layer. The first electrode fills at least a portion of the first opening. The first dielectric layer is on the first electrode. The second electrode is on the light emitting structure and covers the first dielectric layer, the second electrode being electrically connected to the second semiconductor layer. The vertical conductive pattern surrounds outer lateral surfaces of the light emitting structure and is electrically connected to the first electrode.

    METHOD OF MANUFACTURING LIGHT EMITTING DEVICE
    2.
    发明申请
    METHOD OF MANUFACTURING LIGHT EMITTING DEVICE 有权
    制造发光装置的方法

    公开(公告)号:US20130244353A1

    公开(公告)日:2013-09-19

    申请号:US13844569

    申请日:2013-03-15

    CPC classification number: H01L33/005 H01L33/26

    Abstract: Provided a method of manufacturing a semiconductor light emitting device, the method includes forming a light emitting structure by growing a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer on a substrate. The forming of the light emitting structure includes: forming a protective layer after a portion of the light emitting structure is formed forming a sacrificial layer on the protective layer; and continuously forming a further portion of the light emitting structure on the sacrificial layer.

    Abstract translation: 提供一种制造半导体发光器件的方法,该方法包括通过在衬底上生长第一导电类型半导体层,有源层和第二导电类型半导体层来形成发光结构。 发光结构的形成包括:在形成发光结构的一部分之后形成保护层,在保护层上形成牺牲层; 并且在牺牲层上连续地形成发光结构的另一部分。

    LED LIGHTING DEVICE PACKAGE AND DISPLAY PANEL USING THE SAME

    公开(公告)号:US20210013236A1

    公开(公告)日:2021-01-14

    申请号:US16752187

    申请日:2020-01-24

    Abstract: A light emitting device package includes: a plurality of light emitting structures, each having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; a common first electrode extended in parallel with first and second surfaces of the plurality of light emitting structures at a level different from levels of the first and second surfaces while connecting respective first conductivity-type semiconductor layers of the plurality of light emitting structures; a plurality of second electrodes connected to respective second conductivity-type semiconductor layers of the plurality of light emitting structures; a plurality of wavelength converters; and a molded portion having a partition wall structure separating the plurality of wavelength converters from each other, and including a material having a modulus lower than a modulus of the plurality of light emitting structures.

    METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING DISPLAY PANEL USING THE SAME

    公开(公告)号:US20210005794A1

    公开(公告)日:2021-01-07

    申请号:US16716752

    申请日:2019-12-17

    Abstract: A method of manufacturing a light emitting device package and a method of manufacturing a display panel, the method of manufacturing a light emitting device package including forming a semiconductor laminate on a substrate such that the semiconductor laminate has a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; separating the semiconductor laminate into semiconductor light emitters, separated from each other, by forming a trench having a predetermined depth in the substrate by etching through the semiconductor laminate in a direction of the first surface of the substrate; forming a molding that fills the trench and insulates the semiconductor light emitters from each other by applying a flexible insulating material to cover the semiconductor light emitters; forming grooves separated from each other by the molding and overlying to the semiconductor light emitters, respectively, by removing the substrate; and forming wavelength converters in the grooves.

    LIGHT EMITTING DIODE DISPLAY DEVICE
    6.
    发明申请

    公开(公告)号:US20190312083A1

    公开(公告)日:2019-10-10

    申请号:US16205454

    申请日:2018-11-30

    Abstract: A light emitting diode display device is provided. The light emitting diode display device includes a first light emitting diode pixel including a first light emitting diode layer and a first color conversion material on the first light emitting diode layer, a second light emitting diode pixel including a second light emitting diode layer and a second color conversion material on the second light emitting diode layer, a separation film disposed between the first light emitting diode layer and the second light emitting diode layer and a partition disposed between the first color conversion material and the second color conversion material and including a partition material, wherein the first and second light emitting diode pixels are divided by the separation film and the partition, the partition is disposed on the separation film in alignment with the separation film such that the partition includes linear portions that extend in a first direction and the separation film includes linear portions that also extend in the first direction and vertically overlap the linear portions of the partition, and the partition material includes an insulating material different from silicon.

    LIGHT EMITTING DIODE DISPLAY DEVICE
    7.
    发明申请

    公开(公告)号:US20190305202A1

    公开(公告)日:2019-10-03

    申请号:US16356283

    申请日:2019-03-18

    Abstract: A light emitting diode display device includes a display board comprising a plurality of unit pixels, a drive circuit board including a plurality of drive circuit regions corresponding to the plurality of unit pixels, and a plurality of bumps interposed between the plurality of unit pixels and the plurality of drive circuit regions. The plurality of unit pixels comprises a first unit pixel including a first P electrode. The plurality of drive circuit regions comprises a first drive circuit region corresponding to the first unit pixel and a first pad connected to a first drive transistor, the plurality of bumps includes a first solder in contact with the first pad, and a first bump on the first solder and including a first filler in contact with the first P electrode, the first solder includes at least one of tin and silver, and the first filler includes copper or nickel.

    CHEMICAL VAPOR DEPOSITION APPARATUS HAVING SUSCEPTOR
    9.
    发明申请
    CHEMICAL VAPOR DEPOSITION APPARATUS HAVING SUSCEPTOR 审中-公开
    具有SUSCEPTOR的化学气相沉积装置

    公开(公告)号:US20130255578A1

    公开(公告)日:2013-10-03

    申请号:US13798772

    申请日:2013-03-13

    CPC classification number: H01L21/02104 C23C16/4584 C23C16/46

    Abstract: A chemical vapor deposition (CVD) apparatus including a chamber, a susceptor in the chamber, and a heating chamber may be provided. The susceptor includes a rotor, a rotational shaft coupled to a lower portion of the rotor, a driving device coupled to the rotational shaft, and at least one pocket defined at an upper surface of the rotor. The driving device rotatably drives the rotational shaft. The at least one pocket includes a mounting portion configured to receive a substrate thereon and a protruding portion, e.g., a convex portion, protruding from a bottom surface of the at least one pocket such that the protruding portion is positioned at a region corresponding to the rotational shaft. The heating unit surrounds the rotational shaft and heats the substrate.

    Abstract translation: 可以提供包括室,腔室中的基座和加热室的化学气相沉积(CVD)设备。 基座包括转子,联接到转子的下部的旋转轴,耦合到旋转轴的驱动装置和限定在转子的上表面的至少一个凹部。 驱动装置可旋转地驱动旋转轴。 所述至少一个口袋包括被配置为在其上容纳衬底的安装部分和从所述至少一个口袋的底表面突出的突出部分,例如凸起部分,使得所述突出部分位于对应于 旋转轴。 加热单元围绕旋转轴并加热基板。

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