公开(公告)号：US5952709A

公开(公告)日：1999-09-14

申请号：US884223

申请日：1997-06-27

申请人： Kenji Kitazawa ,  Shinichi Koriyama ,  Mikio Fujii

发明人： Kenji Kitazawa ,  Shinichi Koriyama ,  Mikio Fujii

IPC分类号： H01L23/367 ,  H01L23/66 ,  H05K1/02 ,  H05K3/34 ,  H01L23/528

CPC分类号： H01L23/66 ,  H01L23/3677 ,  H05K1/0243 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K2201/10234 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K3/341 ,  H05K3/3442

摘要： A high-frequency semiconductor device contains a semiconductor element in a cavity formed by a dielectric board and a cap. A first high-frequency transmission line connected to the semiconductor element is formed on the surface of said dielectric board in said cavity and a second high-frequency transmission line is formed on the bottom surface of said dielectric board, so that said first high-frequency transmission line and said second high-frequency transmission line are electromagnetically coupled together. In this semiconductor devise in which the first transmission line and the second transmission line are electromagnetically coupled together, the transmission lines need not be passed over the side wall of the cap, and neigther reflection loss or radiation loss takes place on the side wall. Besides, transmission loss of high-frequency signals is caused by neigther through-holes or via-holes, and is effectively suppressed.

摘要翻译： 高频半导体器件在由电介质板和盖形成的空腔中包含半导体元件。 连接到半导体元件的第一高频传输线形成在所述空腔中的所述电介质板的表面上，并且在所述电介质板的底表面上形成第二高频传输线，使得所述第一高频 传输线和所述第二高频传输线电磁耦合在一起。 在第一传输线和第二传输线电磁耦合在一起的半导体装置中，传输线不需要通过盖的侧壁，并且在侧壁上发生相互反射损失或辐射损失。 此外，高频信号的传输损耗由相邻的通孔或通孔引起，并被有效地抑制。

公开(公告)号：US06239669B1

公开(公告)日：2001-05-29

申请号：US09067251

申请日：1998-04-27

申请人： Shinichi Koriyama ,  Mikio Fujii ,  Kenji Kitazawa

发明人： Shinichi Koriyama ,  Mikio Fujii ,  Kenji Kitazawa

IPC分类号： H01P5107

CPC分类号： H01P5/107 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A high-frequency package comprising a dielectric substrate, a high-frequency element that operates in a high-frequency region and is mounted in a cavity formed on said dielectric substrate, and a microstrip line formed on the surface or in an inner portion of said dielectric substrate and electrically connected to said high-frequency element, wherein a signal transmission passage of a waveguide is connected to a linear conducting passage or to a ground layer constituting the microstrip line. In the junction portion of the waveguide, for example, an end of the linear conducting passage is electromagnetically opened, so that the end portion works as a monopole antenna inside the waveguide that is connected. The high-frequency package makes it possible to connect the waveguide without adversely affecting the sealing of the high-frequency element and to transmit high-frequency signals with a low loss.

摘要翻译： 一种高频封装，包括电介质基板，在高频区域中工作并安装在形成在所述电介质基板上的空腔中的高频元件，以及形成在所述电介质基板的表面或内部的微带线 电连接到所述高频元件，其中波导的信号传输通道连接到构成微带线的线性导电通道或接地层。 在波导的接合部中，例如，线状导电通路的端部电磁开放，使得端部作为连接的波导内的单极天线工作。 高频封装使得可以连接波导而不会对高频元件的密封产生不利影响，并以低损耗传输高频信号。

公开(公告)号：US06188368B1

公开(公告)日：2001-02-13

申请号：US09258830

申请日：1999-02-26

申请人： Shinichi Koriyama ,  Kenji Kitazawa ,  Hidehiro Minamiue

发明人： Shinichi Koriyama ,  Kenji Kitazawa ,  Hidehiro Minamiue

IPC分类号： H01Q1300

CPC分类号： H01Q13/10 ,  H01L2223/6677 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15313 ,  H01Q13/18

摘要： A slot antenna comprising a dielectric substrate, a high-frequency signal transmission line formed on one surface of said dielectric substrate and having an open end, and a ground layer formed on the other surface of said dielectric substrate, said ground layer having a slot at a position opposed to the open end of said transmission line, wherein a dielectric plate for impedance matching is laminated on the surface of said ground layer on the side where said slot is formed so as to cover said slot. The slot antenna not only features a high antenna efficiency but also can be easily and cheaply produced by a layer-laminating method which is a generally employed technology for producing multi-layer wiring substrates. Besides, the slot antenna has a very simple structure which is small in size and is light in weight, and can be very well adapted to the systems that require these characteristics.

摘要翻译： 一种缝隙天线，包括电介质基片，形成在所述电介质基片的一个表面上并具有开口端的高频信号传输线，以及形成在所述电介质基底的另一个表面上的接地层，所述接地层在 与所述传输线的开口端相对的位置，其中用于阻抗匹配的电介质板层叠在所述接地层的形成所述槽的一侧的表面上以覆盖所述槽。 缝隙天线不仅具有高的天线效率，而且可以通过层叠方法容易且廉价地制造，层叠方法是通常用于制造多层布线基板的技术。 此外，缝隙天线具有体积小且重量轻的非常简单的结构，并且可以非常适合于需要这些特性的系统。

公开(公告)号：US06870438B1

公开(公告)日：2005-03-22

申请号：US09709098

申请日：2000-11-10

申请人： Naoyuki Shino ,  Shinichi Koriyama ,  Kenji Kitazawa ,  Hidehiro Minamiue

发明人： Naoyuki Shino ,  Shinichi Koriyama ,  Kenji Kitazawa ,  Hidehiro Minamiue

IPC分类号： H01P5/107 ,  H05K1/02

CPC分类号： H01L23/66 ,  H01L24/48 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19039 ,  H01P5/107 ,  H05K1/0237 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board includes a dielectric substrate, a signal transmission line formed on one surface of the dielectric substrate, a grounded layer formed on the other surface of the dielectric substrate, and a connection portion for connecting portion for connecting the signal transmission line to a waveguide, the connection portion being formed on the grounded layer. The grounded layer has a slot at a position opposed to an end of the signal transmission line. The connection portion includes a first dielectric portion disposed to cover the slot of the ground layer, a second dielectric portion laminated on the first dielectric portion, and a patch conductor provided at a position opposed to said slot on an interface between the first dielectric portion and the second dielectric portion. The wiring board enables the signals to be efficiently transmitted from the signal transmission line to the waveguide with a small loss and a small reflection.

摘要翻译： 布线基板包括电介质基板，形成在电介质基板的一个表面上的信号传输线，形成在电介质基板的另一个表面上的接地层，以及用于将信号传输线连接到波导的连接部分的连接部分 连接部分形成在接地层上。 接地层在与信号传输线的端部相对的位置处具有槽。 连接部分包括设置成覆盖接地层的槽的第一电介质部分，层压在第一电介质部分上的第二电介质部分，以及配置在第一电介质部分和第二电介质部分之间的界面上与所述槽相对的位置 第二电介质部分。 布线板使得信号能够以较小的损耗和小的反射从信号传输线有效地传输到波导。

公开(公告)号：US06642808B2

公开(公告)日：2003-11-04

申请号：US09871591

申请日：2001-05-30

申请人： Shinichi Koriyama ,  Kenji Kitazawa ,  Naoyuki Shino ,  Hidehiro Minamiue

发明人： Shinichi Koriyama ,  Kenji Kitazawa ,  Naoyuki Shino ,  Hidehiro Minamiue

IPC分类号： H01P500

CPC分类号： H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/321 ,  H05K2201/09781 ,  H05K2201/10522 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high frequency package is arranged such that it comprises a dielectric substrate provided with an input terminal and an output terminal, a high frequency element mounted on the surface of the dielectric substrate, and a high frequency line formed on the dielectric substrate for connecting the high frequency element with the input terminal and with the output terminal, wherein a transmission characteristic from the input terminal to the output terminal has the property of cyclically varying in relation to frequency. The length of the high frequency line is regulated such that the frequency of signals transmitted along the high frequency line is located at a part of the cyclic variation curve of the transmission characteristic where transmittance is large. By arranging the structure in such a manner, loss of high frequency signals having frequencies of 10 GHz or more can be reduced.

摘要翻译： 高频封装被布置成使得其包括设置有输入端子和输出端子的介电基板，安装在电介质基板的表面上的高频元件，以及形成在电介质基板上的用于连接高电压的高频线 具有输入端子和输出端子的频率元件，其中从输入端子到输出端子的传输特性具有相对于频率周期性变化的特性。 调节高频线的长度，使得沿着高频线发送的信号的频率位于透射率大的透射特性的循环变化曲线的一部分。 通过以这种方式布置结构，可以减少具有10GHz或更高频率的高频信号的丢失。

公开(公告)号：US06501352B1

公开(公告)日：2002-12-31

申请号：US09636054

申请日：2000-08-10

申请人： Shinichi Koriyama ,  Kenji Kitazawa ,  Hidehiro Minamiue

发明人： Shinichi Koriyama ,  Kenji Kitazawa ,  Hidehiro Minamiue

IPC分类号： H01P100

CPC分类号： H01L23/66 ,  H01L24/48 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01P3/08 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09072 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A high frequency wiring board having a high frequency transmission line having a signal conductor line formed on the surface of a dielectric board and a grounding layer formed inside or on the reverse surface of the dielectric board parallel to the signal conductor line, and a connecting terminal portion provided at a terminal end of the high frequency transmission line and including connecting grounding conductors formed with spacing on both sides of the signal conductor line and through conductors for connecting the connecting grounding and the grounding layer. The distance between the through conductors and an end side surface of the dielectric board is not more than 0.3 times the signal wavelength, in the dielectric board, of a high frequency signal.

摘要翻译： 一种高频布线板，具有在电介质基板的表面上形成有信号导线的高频布线板和形成在与信号导线平行的电介质基板的内侧或外侧的接地层，以及连接端子 部分设置在高频传输线的终端，并且包括在信号导体线的两侧形成有间隔的连接接地导体，以及通过用于连接接地和接地层的导体。 导电体与电介质基板的端面之间的距离不超过高频信号的电介质基板的信号波长的0.3倍。

公开(公告)号：US06483406B1

公开(公告)日：2002-11-19

申请号：US09363619

申请日：1999-07-29

申请人： Yoshinobu Sawa ,  Shinichi Koriyama ,  Kenji Kitazawa ,  Hidehiro Minamiue

发明人： Yoshinobu Sawa ,  Shinichi Koriyama ,  Kenji Kitazawa ,  Hidehiro Minamiue

IPC分类号： H01L2312

CPC分类号： H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/047 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/09781 ,  H05K2201/10477 ,  H05K2201/1053 ,  H05K2201/10727 ,  H05K2203/1572 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A high-frequency module comprising a high-frequency device-mounting package and an external circuit board, wherein said high-frequency device-mounting package includes a dielectric substrate having a first grounding layer contained therein, said dielectric substrate mounting a high-frequency device on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines connected to said high-frequency device, and having, formed on the other surface thereof, second high-frequency signal transmission lines coupled to said first high-frequency signal transmission lines; said external circuit board is constituted by a dielectric board having third high-frequency signal transmission lines and a second grounding layer, said third high-frequency signal transmission lines being formed on one surface of said dielectric board, and said second grounding layer being formed on the other surface of said dielectric board or inside thereof; and said high-frequency device-mounting package and said external circuit board are arranged side by side, and the second high-frequency signal transmission lines of the high-frequency package are electrically connected to the third high-frequency signal transmission lines of the external circuit board through linear electrically conducting members. The patterns of the second high-frequency signal transmission lines on the side of the high-frequency device-mounting package can be easily aligned with the patterns of the third high-frequency signal transmission lines on the side of the external circuit board, effectively reducing the transmission loss at the junction portions of the lines.

摘要翻译： 一种包括高频器件安装封装和外部电路板的高频模块，其中所述高频器件安装封装包括其中包含第一接地层的电介质衬底，所述介质衬底安装高频器件 在其一个表面上，在其一个表面上形成有连接到所述高频装置的第一高频信号传输线，并且在其另一个表面上形成有与所述第一高频耦合的第二高频信号传输线 频率信号传输线路; 所述外部电路板由具有第三高频信号传输线和第二接地层的电介质板构成，所述第三高频信号传输线形成在所述电介质板的一个表面上，所述第二接地层形成在 所述电介质板的另一个表面或其内部; 并且所述高频器件安装封装和所述外部电路板并排布置，并且所述高频封装的第二高频信号传输线与外部的第三高频信号传输线电连接 电路板通过线性导电构件。 高频器件安装封装侧的第二高频信号传输线的图案可以容易地与外部电路板侧的第三高频信号传输线的图案对准，有效地减少 在线路的接合部分的传输损耗。

公开(公告)号：US6057600A

公开(公告)日：2000-05-02

申请号：US199716

申请日：1998-11-25

申请人： Kenji Kitazawa ,  Shinichi Koriyama ,  Shigeki Morioka ,  Satoru Tomie

发明人： Kenji Kitazawa ,  Shinichi Koriyama ,  Shigeki Morioka ,  Satoru Tomie

IPC分类号： H01L23/66 ,  H05K1/02 ,  H05K3/34 ,  H05K1/00 ,  H01L23/00 ,  H01L23/12

CPC分类号： H05K1/0243 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09781 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K3/341 ,  H05K3/3442

摘要： A structure for mounting a high-frequency device on an insulating board having a circuit on a top surface and transmitting signals to the high-frequency device. The high-frequency device is sealed within a cavity on a top surface of a dielectric board. The dielectric board has a first signal transmission line on its top surface and a second signal transmission line on its bottom surface, the first and second signal transmission lines overlapping each other over a portion where the signal is transmitted through coupling of the first and second signal transmission lines. A recess is formed at the top surface of the insulating board below the overlapping portion of the first and second signal transmission lines to suppress transmission loss of the high-frequency signal between the first and second signal transmission lines. The recess may be filled with air or a material having a dielectric constant low than that of the insulating board.

摘要翻译： 一种用于将高频器件安装在具有在顶表面上的电路的绝缘板上并将信号传输到高频器件的结构。 高频器件被密封在电介质板的顶表面上的空腔内。 电介质板在其顶表面上具有第一信号传输线，在其底表面上具有第二信号传输线，第一和第二信号传输线在信号通过第一和第二信号的耦合的一部分上彼此重叠 传输线。 在第一和第二信号传输线的重叠部分之下的绝缘板的顶表面处形成凹部，以抑制第一和第二信号传输线之间的高频信号的传输损耗。 凹部可以填充空气或介电常数低于绝缘板的介电常数的材料。

公开(公告)号：US06356173B1

公开(公告)日：2002-03-12

申请号：US09322739

申请日：1999-05-28

申请人： Koichi Nagata ,  Kenji Kitazawa ,  Shinichi Koriyama ,  Shigeki Morioka ,  Takanori Kubo ,  Hidehiro Minamiue ,  Masanobu Ishida ,  Akira Nakayama ,  Naoyuki Shino

发明人： Koichi Nagata ,  Kenji Kitazawa ,  Shinichi Koriyama ,  Shigeki Morioka ,  Takanori Kubo ,  Hidehiro Minamiue ,  Masanobu Ishida ,  Akira Nakayama ,  Naoyuki Shino

IPC分类号： H01P502

CPC分类号： H05K1/0239 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1903 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/0272 ,  H05K1/0298 ,  H05K3/0061 ,  H05K2201/09054 ,  H01L2924/00

摘要： A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to the external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

摘要翻译： 一种高频模块，其中在介质板的表面上形成多个空腔，内部高频信号传输线连接到空腔中的高频器件，并且位于空腔中，内部高频 信号传输线被电磁耦合到外部高频信号传输线，并且空腔中的高频器件通过外部线路依赖于电磁耦合而相互连接。 高频模块使高频信号能够以较小的损耗在高频器件之间传输。 该模块具有非常简单的结构，并且便宜地生产，并且具有可以容易地以小尺寸获得的优点。

公开(公告)号：US5563117A

公开(公告)日：1996-10-08

申请号：US357100

申请日：1994-12-15

申请人： Shinichi Koriyama ,  Takaaki Ikemachi ,  Hisao Yamauchi

发明人： Shinichi Koriyama ,  Takaaki Ikemachi ,  Hisao Yamauchi

IPC分类号： H01L39/12 ,  H01L39/24 ,  H01B12/00 ,  C04B35/505 ,  C04B35/624

CPC分类号： H01L39/2451 ,  H01L39/126 ,  Y10S505/727 ,  Y10S505/729 ,  Y10S505/78

摘要： In the production of a 124-type or 123-type superconductor by a sol-gel method using alkoxides of respective metals, the use of a compound wherein a secbutoxy group and a hydroxy group are coordinated with a copper atom gives a superconductor composed of flat particles having a broad C plane. The dimensional ratio defined by l/d is at least 6.7 in the case of the 124-type or is at least 8.4 in the case of the 123-type. It shows a superconducting property at a liquid nitrogen temperature. This superconductor shows a higher critical current density than one obtained by a sintering method.

摘要翻译： 在通过使用各种金属的醇盐的溶胶 - 凝胶法制备124型或123型超导体时，使用其中二丁氧基和羟基与铜原子配位的化合物，得到由平面构成的超导体 具有宽C平面的颗粒。 在124型的情况下，由l / d定义的尺寸比例至少为6.7，在123型的情况下为至少8.4。 它在液氮温度下显示超导特性。 该超导体显示比通过烧结方法获得的密度高的临界电流密度。