公开(公告)号：US20080211111A1

公开(公告)日：2008-09-04

申请号：US12037084

申请日：2008-02-25

申请人： SooMoon Park ,  Tae Keun Lee ,  YoRim Lee

发明人： SooMoon Park ,  Tae Keun Lee ,  YoRim Lee

IPC分类号： H01L23/12 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

摘要： An integrated circuit package system includes: providing a package carrier; forming a first channel in the package carrier; mounting a first integrated circuit device over the package carrier and adjacent to the first channel; mounting a second integrated circuit device over the package carrier and adjacent to the first channel; and forming a contiguous underfill fillet with the first channel and under both the first integrated circuit device and the second integrated circuit device.

摘要翻译： 集成电路封装系统包括：提供封装载体; 在包装载体中形成第一通道; 将第一集成电路器件安装在封装载体上并与第一通道相邻; 将第二集成电路装置安装在所述封装载体上并与所述第一通道相邻; 以及在所述第一通道和所述第一集成电路器件和所述第二集成电路器件之下形成连续的底部填充圆角。

公开(公告)号：US07682872B2

公开(公告)日：2010-03-23

申请号：US12037084

申请日：2008-02-25

申请人： SooMoon Park ,  Tae Keun Lee ,  YoRim Lee

发明人： SooMoon Park ,  Tae Keun Lee ,  YoRim Lee

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

摘要： An integrated circuit package system includes: providing a package carrier; forming a first channel in the package carrier; mounting a first integrated circuit device over the package carrier and adjacent to the first channel; mounting a second integrated circuit device over the package carrier and adjacent to the first channel; and forming a contiguous underfill fillet with the first channel and under both the first integrated circuit device and the second integrated circuit device.

摘要翻译： 集成电路封装系统包括：提供封装载体; 在包装载体中形成第一通道; 将第一集成电路器件安装在封装载体上并与第一通道相邻; 将第二集成电路装置安装在所述封装载体上并与所述第一通道相邻; 以及在所述第一通道和所述第一集成电路器件和所述第二集成电路器件之下形成连续的底部填充圆角。

公开(公告)号：US08193036B2

公开(公告)日：2012-06-05

申请号：US12882083

申请日：2010-09-14

申请人： SooMoon Park ,  ByoungWook Jang ,  DongSoo Moon

发明人： SooMoon Park ,  ByoungWook Jang ,  DongSoo Moon

IPC分类号： H01L21/00

CPC分类号： H01L21/54 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.

摘要翻译： 半导体器件具有安装在衬底的表面上的半导体管芯。 模具底部填充分配针的宽度基本上等于半导体管芯的宽度。 分配针与半导体管芯的一侧流体连通。 将分注针的出口从半导体管芯的宽度均匀地沉积到半导体管芯和衬底之间的区域中，而不会发生分配针的移动。 分配针具有柄和T形构件的出口。 分配针可以在柄和出口之间具有多个极部。 分配针具有在柄和出口之间的板。 出口具有长度基本上等于或大于出口下边缘长度的上边缘。

公开(公告)号：US20110133325A1

公开(公告)日：2011-06-09

申请号：US12633789

申请日：2009-12-08

申请人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

发明人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC分类号： H01L23/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/485

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供第一基板; 将部件安装在所述第一基板上; 将堆叠衬底安装在所述部件上，所述堆叠衬底具有内衬垫和连接到所述第一衬底的外衬垫; 将第一暴露的互连件安装在所述外垫上; 在所述堆叠衬底上形成第一封装，所述第一暴露的互连部分暴露，并且所述内衬垫部分地暴露在所述第一封装的凹部中; 以及将第二暴露的互连件安装在所述内垫上。

公开(公告)号：US20120061858A1

公开(公告)日：2012-03-15

申请号：US12882083

申请日：2010-09-14

申请人： SooMoon Park ,  ByoungWook Jang ,  DongSoo Moon

发明人： SooMoon Park ,  ByoungWook Jang ,  DongSoo Moon

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L21/54 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.

摘要翻译： 半导体器件具有安装在衬底的表面上的半导体管芯。 模具底部填充分配针的宽度基本上等于半导体管芯的宽度。 分配针与半导体管芯的一侧流体连通。 将分注针的出口从半导体管芯的宽度均匀地沉积到半导体管芯和衬底之间的区域中，而不会发生分配针的移动。 分配针具有柄和T形构件的出口。 分配针可以在柄和出口之间具有多个极部。 分配针具有在柄和出口之间的板。 出口具有长度基本上等于或大于出口下边缘长度的上边缘。

公开(公告)号：US20100044882A1

公开(公告)日：2010-02-25

申请号：US12194507

申请日：2008-08-19

申请人： SooMoon Park ,  KyungHoon Lee

发明人： SooMoon Park ,  KyungHoon Lee

IPC分类号： H01L23/52

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： An integrated circuit package system includes: providing a substrate having a top side with a trace conductor connected to a bottom side with a system interconnect; forming a bump ring on the substrate, the bump ring having an inner cavity area over the trace conductor and an outer bump area; applying a substrate mask layer adjacent a perimeter of the outer bump area; connecting a device to the trace conductor below the bump ring; and applying a compound between the device and the substrate.

摘要翻译： 一种集成电路封装系统，包括：提供具有顶侧的基板，具有连接到底侧的导线与系统互连; 在所述基板上形成凸起环，所述凸块环具有位于所述迹线导体上的内腔区域和外部凸起区域; 施加邻近所述外部凸起区域的周边的衬底掩模层; 将器件连接到凸块下方的导线导体; 以及在所述器件和所述衬底之间施加化合物。

公开(公告)号：US20120211904A1

公开(公告)日：2012-08-23

申请号：US13458289

申请日：2012-04-27

申请人： SooMoon Park ,  ByoungWook Jang ,  DongSoo Moon

发明人： SooMoon Park ,  ByoungWook Jang ,  DongSoo Moon

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L21/54 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.

公开(公告)号：US20100244212A1

公开(公告)日：2010-09-30

申请号：US12412886

申请日：2009-03-27

申请人： Jong-Woo Ha ,  DongSoo Moon ,  SooMoon Park

发明人： Jong-Woo Ha ,  DongSoo Moon ,  SooMoon Park

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L23/49833 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/04941 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a bottom package including a first device over a first substrate and a second substrate over the first device; forming an encapsulation material over the bottom package with an opening over the second substrate; and forming a conductive post within the opening.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在第一器件上提供包括第一器件的第一器件和第二器件的底部封装; 在所述底部封装上形成具有在所述第二基板上的开口的封装材料; 并在开口内形成导电柱。

公开(公告)号：US08692365B2

公开(公告)日：2014-04-08

申请号：US13163611

申请日：2011-06-17

申请人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

发明人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/36 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a package stack assembly, having a contact pad, on the base substrate; applying an encapsulation having a cavity with a tapered side directly over the package stack assembly, the contact pad exposed in the cavity; attaching a recessed circuitry unit in the cavity and on the contact pad, a chamber of the cavity formed by the recessed circuitry unit and the tapered side of the cavity; and mounting a thermal structure over the recessed circuitry unit, the cavity, and the encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 将具有接触垫的包装堆叠组件附接在所述基底基板上; 将具有锥形侧的空腔的封装直接施加在封装堆叠组件上方，该接触垫暴露在空腔中; 将凹陷的电路单元附接在所述空腔和所述接触垫上，所述凹腔由所述凹陷电路单元和所述空腔的锥形侧形成; 并将热结构安装在凹进的电路单元，空腔和封装之上。

公开(公告)号：US08115293B2

公开(公告)日：2012-02-14

申请号：US12633789

申请日：2009-12-08

申请人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

发明人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC分类号： H01L21/60

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供第一基板; 将部件安装在所述第一基板上; 将堆叠衬底安装在所述部件上，所述堆叠衬底具有内衬垫和连接到所述第一衬底的外衬垫; 将第一暴露的互连件安装在所述外垫上; 在所述堆叠衬底上形成第一封装，所述第一暴露的互连部分暴露，并且所述内衬垫部分地暴露在所述第一封装的凹部中; 以及将第二暴露的互连件安装在所述内垫上。