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    Electronic device
    2.
    发明授权
    Electronic device 有权

    公开(公告)号：US10818432B2

    公开(公告)日：2020-10-27

    申请号：US16121701

    申请日：2018-09-05

    Applicant: TDK CORPORATION

    Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

    IPC: H01G4/01 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K3/30 ,  H05K3/34 ,  H01F27/29

    Abstract: An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.

    Multilayer capacitor with an overcurrent protection device
    3.
    发明授权
    Multilayer capacitor with an overcurrent protection device 有权

    公开(公告)号：US10102971B2

    公开(公告)日：2018-10-16

    申请号：US15286122

    申请日：2016-10-05

    Applicant: TDK CORPORATION

    Inventor： Norihisa Ando ,  Masahiro Mori ,  Sunao Masuda ,  Kayou Kusano

    IPC: H01G4/30 ,  H01C7/00 ,  H01C7/02 ,  H01G4/12 ,  H01G4/002 ,  H01G4/242

    Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

    Electronic component
    4.
    发明授权
    Electronic component 有权

    公开(公告)号：US10032559B2

    公开(公告)日：2018-07-24

    申请号：US15389181

    申请日：2016-12-22

    Applicant: TDK CORPORATION

    Inventor： Norihisa Ando ,  Atsushi Takeda ,  Hideki Kaneko

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/12

    Abstract: An electronic component is provided with an element body and terminal electrodes. The terminal electrodes include sintered metal layers and conductive resin layers. A first length, which is a length of the sintered metal layers in a first direction at end portions of a side surface in a second direction, is shorter than a second length, which is a length of the sintered metal layers in the first direction at central portions of the side surface in the second direction. A third length, which is a length of the conductive resin layers in the first direction at the end portions, is shorter than a fourth length, which is a length of the conductive resin layers in the first direction at the central portions. A difference between the fourth length and the third length is larger than a difference between the second length and the first length.

    Electronic component
    5.
    发明授权
    Electronic component 有权

    公开(公告)号：US10026556B2

    公开(公告)日：2018-07-17

    申请号：US15276172

    申请日：2016-09-26

    Applicant: TDK CORPORATION

    Inventor： Norihisa Ando ,  Atsushi Takeda ,  Hideki Kaneko

    IPC: H01G4/30 ,  H01G4/005 ,  H01G4/228 ,  H01G4/232 ,  H01G4/12

    Abstract: An electronic component includes an element body having a pair of end surfaces opposing each other and a side surface adjacent to the pair of end surfaces, and an external electrode disposed on at least the end surface. The external electrode includes a conductive resin layer located on at least the end surface. A first thickness of the conductive resin layer located on a central region of the end surface is greater than a second thickness of the conductive resin layer located on a peripheral region of the end surface.

    Electronic component
    7.
    发明授权
    Electronic component 有权

    公开(公告)号：US09881742B2

    公开(公告)日：2018-01-30

    申请号：US15142530

    申请日：2016-04-29

    Applicant: TDK CORPORATION

    Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Kusano

    IPC: H01G2/16 ,  H01G4/30 ,  H01G4/228 ,  H01G4/40 ,  H01C7/18 ,  H01G2/14 ,  H01G4/232 ,  H01G4/258 ,  H01C7/02

    CPC classification number: H01G4/40 ,  H01C7/02 ,  H01C7/021 ,  H01C7/18 ,  H01G2/14 ,  H01G4/232 ,  H01G4/258

    Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.

    Electronic device
    8.
    发明授权
    Electronic device 有权

    公开(公告)号：US12062495B2

    公开(公告)日：2024-08-13

    申请号：US18331358

    申请日：2023-06-08

    Applicant: TDK CORPORATION

    Inventor： Akihiro Masuda ,  Takaaki Sato ,  Norihisa Ando ,  Shinya Ito ,  Kosuke Yazawa

    IPC: H01G4/38 ,  H01G4/224 ,  H01G4/236

    CPC classification number: H01G4/224 ,  H01G4/236 ,  H01G4/38

    Abstract: An electronic device includes a chip component including a terminal electrode, a case having an accommodation recess accommodating the chip component, a conductive terminal attached to the case and connected to the terminal electrode, and a case cover disposed on an opening-edge surface of the case so as to cover the accommodation recess. The opening-edge surface has an opening-edge recess at least partly covered by the case cover. The opening-edge recess and the case cover have a space therebetween. The space is filled with a resin.

    Electronic device
    9.
    发明授权
    Electronic device 有权

    公开(公告)号：US11961676B2

    公开(公告)日：2024-04-16

    申请号：US17847717

    申请日：2022-06-23

    Applicant: TDK CORPORATION

    Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi

    IPC: H01G4/224 ,  H01G4/30

    CPC classification number: H01G4/224 ,  H01G4/30

    Abstract: An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.

    Ceramic electronic component
    10.
    发明授权
    Ceramic electronic component 有权

    公开(公告)号：US11810723B2

    公开(公告)日：2023-11-07

    申请号：US17495274

    申请日：2021-10-06

    Applicant: TDK CORPORATION ,  TDK XIAMEN CO., LTD.

    Inventor： Masahiro Mori ,  Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando

    IPC: H01G4/232 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

    CPC classification number: H01G4/2325 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

    Abstract: A ceramic electronic component including: a ceramic element body including an end surface extending along a first axis, and a side surface extending along a second axis and intersecting the end surface; an end-face electrode formed on the end surface of the ceramic element body; and a lead terminal connected to the end-face electrode by soldering. The lead terminal includes: an adjacent part overlapping the end-face electrode in a side view from the second axis; and an extension part extending from an end of the adjacent part in a direction away from a plane including the side surface. A first recess is formed at the extension part and is recessed in a direction away from a plane including the end surface, and the first recess exists at a position close to the end of the adjacent part.

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