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    Methods, apparatus, and systems to facilitate multi-channel isolation
    1.
    发明授权
    Methods, apparatus, and systems to facilitate multi-channel isolation 有权

    公开(公告)号：US11669069B2

    公开(公告)日：2023-06-06

    申请号：US17339213

    申请日：2021-06-04

    Applicant: Texas Instruments Incorporated

    Inventor： Matthew David Romig ,  Mayank Garg

    IPC: G05B19/414

    CPC classification number: G05B19/4144 ,  G05B2219/34236

    Abstract: Methods, systems, and apparatus to facilitate multi-channel isolation is disclosed. An example apparatus includes a multiplexer including a first input terminal, a second input terminal, and an output terminal; a modulator including an input terminal and an output terminal, the input terminal of the modulator coupled to the output terminal of the multiplexer; an isolation capacitor including a first terminal and a second terminal, the first terminal of the isolation capacitor coupled to the output terminal of the modulator; a first receiver die coupled to the second terminal of the isolation capacitor; and a second receiver die coupled to the second terminal of the isolation capacitor.

    MULTI-CHIP MODULE LEADLESS PACKAGE
    2.
    发明申请
    MULTI-CHIP MODULE LEADLESS PACKAGE 有权

    公开(公告)号：US20230129232A1

    公开(公告)日：2023-04-27

    申请号：US18086981

    申请日：2022-12-22

    Applicant: Texas Instruments Incorporated

    Inventor： Matthew David Romig ,  Wei Zhang ,  Mohammad Waseem Hussain ,  Peter Anthony Fundaro

    IPC: H01L23/495 ,  H01L21/50 ,  H01L25/065 ,  H01L25/16 ,  H02M3/158

    Abstract: A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.

    MULTI-CHIP MODULE LEADLESS PACKAGE
    3.
    发明申请
    MULTI-CHIP MODULE LEADLESS PACKAGE 有权

    公开(公告)号：US20210257282A1

    公开(公告)日：2021-08-19

    申请号：US17177910

    申请日：2021-02-17

    Applicant: Texas Instruments Incorporated

    Inventor： Matthew David Romig ,  Wei Zhang ,  Mohammad Waseem Hussain ,  Peter Anthony Fundaro

    IPC: H01L23/495 ,  H02M3/158 ,  H01L25/065 ,  H01L21/50

    Abstract: A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.

    METHODS, APPARATUS, AND SYSTEMS TO FACILITATE MULTI-CHANNEL ISOLATION
    8.
    发明申请
    METHODS, APPARATUS, AND SYSTEMS TO FACILITATE MULTI-CHANNEL ISOLATION 有权

    公开(公告)号：US20210294302A1

    公开(公告)日：2021-09-23

    申请号：US17339213

    申请日：2021-06-04

    Applicant: Texas Instruments Incorporated

    Inventor： Matthew David Romig ,  Mayank Garg

    IPC: G05B19/414

    Abstract: Methods, systems, and apparatus to facilitate multi-channel isolation is disclosed. An example apparatus includes a multiplexer including a first input terminal, a second input terminal, and an output terminal; a modulator including an input terminal and an output terminal, the input terminal of the modulator coupled to the output terminal of the multiplexer; an isolation capacitor including a first terminal and a second terminal, the first terminal of the isolation capacitor coupled to the output terminal of the modulator; a first receiver die coupled to the second terminal of the isolation capacitor; and a second receiver die coupled to the second terminal of the isolation capacitor.

    METHODS, APPARATUS, AND SYSTEMS TO FACILITATE MULTI-CHANNEL ISOLATION
    10.
    发明申请
    METHODS, APPARATUS, AND SYSTEMS TO FACILITATE MULTI-CHANNEL ISOLATION 有权

    公开(公告)号：US20210157299A1

    公开(公告)日：2021-05-27

    申请号：US16692674

    申请日：2019-11-22

    Applicant: Texas Instruments Incorporated

    Inventor： Matthew David Romig ,  Mayank Garg

    IPC: G05B19/414

    Abstract: Methods, systems, and apparatus to facilitate multi-channel isolation is disclosed. An example apparatus includes a multiplexer including a first input terminal, a second input terminal, and an output terminal; a modulator including an input terminal and an output terminal, the input terminal of the modulator coupled to the output terminal of the multiplexer; an isolation capacitor including a first terminal and a second terminal, the first terminal of the isolation capacitor coupled to the output terminal of the modulator; a first receiver die coupled to the second terminal of the isolation capacitor; and a second receiver die coupled to the second terminal of the isolation capacitor.

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