公开(公告)号：US20080046675A1

公开(公告)日：2008-02-21

申请号：US10585643

申请日：2005-01-06

申请人： Takanori Okada ,  Keiichi Ishida ,  Hiroshi Saitoh

发明人： Takanori Okada ,  Keiichi Ishida ,  Hiroshi Saitoh

IPC分类号： G06F12/02

CPC分类号： G06F12/0246 ,  G06F3/0616 ,  G06F3/0644 ,  G06F3/0679 ,  G06F2212/1036 ,  G06F2212/7211

摘要： It is possible to solve the problem that a memory block of a group containing information frequently updated quickly reaches the rewrite service life end when the number of spare blocks prepared in a non-volatile semiconductor recording medium cannot be modified or when the memory block is divided into a plurality of groups so as to be processed alternately. The non-volatile semiconductor recording medium includes a partition management information area and a partition area. Partition area start position information is recorded in the partition management information area. The start position information contains a value assuring a predetermined area between the end of the partition management information area and the head of the partition area. The area assured between the end of the partition management information area and the head of the partition area is set to a state where data is physically erased.

摘要翻译： 可以解决当在非易失性半导体记录介质中准备的备用块的数量不能被修改或者当存储块被分割时，包含频繁更新的信息的组的存储块快速到达重写使用寿命的问题 成为多个组，以便交替进行处理。 非易失性半导体记录介质包括分区管理信息区域和分区区域。 分区区域开始位置信息被记录在分区管理信息区域中。 起始位置信息包含确保分区管理信息区域的末端与分割区域的头部之间的预定区域的值。 将分区管理信息区域的结束与分割区域的头部之间保证的区域设定为物理地擦除数据的状态。

公开(公告)号：US08344489B2

公开(公告)日：2013-01-01

申请号：US12628127

申请日：2009-11-30

申请人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

发明人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

IPC分类号： H01L23/02

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C3/005 ,  B81C2203/0109 ,  B81C2203/054 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.

摘要翻译： 本发明的半导体器件包括：在顶表面上具有中空的中空部分的衬底; 安装在基板的中空部分中的半导体芯片; 以及盖，其具有与基板相对并覆盖中空部的基本上板状的顶板部，并且具有至少一对侧壁部，该侧壁部从顶板部的圆周朝向基板突出并且与一对 基板的侧表面。 基板和盖子可以精确定位。

公开(公告)号：US07639922B2

公开(公告)日：2009-12-29

申请号：US10511831

申请日：2003-04-14

申请人： Hiroshi Saitoh ,  Hideaki Mita

发明人： Hiroshi Saitoh ,  Hideaki Mita

IPC分类号： H04N5/93 ,  G11B27/00 ,  H04N5/76

CPC分类号： G11B27/034 ,  G11B27/3027 ,  G11B27/3054 ,  G11B2220/90 ,  H04N5/232 ,  H04N5/77 ,  H04N5/782 ,  H04N5/9201

摘要： An image pick-up apparatus includes an image pick-up device of recording a video to generate a video signal, a photographer indication device of indicating a start of a recording and/or a stop of the recording, an AutoREC signal generation device of generating an AutoREC signal in conjunction with the start of the recording and/or the stop of the recording based on the indication, and an AutoREC signal multiplex device of multiplexing a generated AutoREC signal to a generated video signal.

摘要翻译： 图像拾取装置包括：用于记录视频以生成视频信号的图像拾取装置，指示开始记录和/或停止记录的拍摄者指示装置;生成 一个AutoREC信号结合记录的开始和/或基于该指示停止记录;以及一个AutoREC信号多路复用装置，将所生成的AutoREC信号复用到所生成的视频信号。

公开(公告)号：US20090243060A1

公开(公告)日：2009-10-01

申请号：US12383915

申请日：2009-03-26

申请人： Hiroshi Saitoh

发明人： Hiroshi Saitoh

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49861 ,  G01D11/245 ,  G01L19/0069 ,  G01L19/141 ,  G01L19/147 ,  H01L23/055 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H03H9/0542 ,  H03H9/1014 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame including a stage and a plurality of terminals is embedded in a mold resin including a base portion for mounting a semiconductor chip (e.g. a microphone chip), a peripheral wall disposed in the periphery of the base portion, and an extension portion extended outside of the peripheral wall, thus forming a package base. A plurality of holes is formed in the peripheral wall so as to expose the internal connection surface of the stage and the internal connection surfaces of the terminals. An extension portion of the stage is exposed on the extension portion of the mold resin in which the surfaces of the terminals are embedded. An extension portion (e.g. a brim) of a cover composed of a conductive material is attached to the extension portion of the mold resin of the package base, thus completely producing a semiconductor device.

摘要翻译： 将包括台架和多个端子的引线框架嵌入到包括用于安装半导体芯片（例如麦克风芯片）的基座部分的设计树脂中，设置在基部周边的周壁和延伸部分延伸 在周壁外部，从而形成包装基底。 在周壁上形成多个孔，以露出台的内部连接表面和端子的内部连接表面。 台架的延伸部分露出在其中嵌入端子表面的模制树脂的延伸部分上。 由导电材料构成的盖的延伸部分（例如边缘）附接到封装基座的模制树脂的延伸部分，从而完全制造半导体器件。

公开(公告)号：US07494838B2

公开(公告)日：2009-02-24

申请号：US11593588

申请日：2006-11-07

申请人： Hiroshi Adachi ,  Hiroshi Saitoh ,  Kenichi Shirasaka ,  Hideki Sato ,  Masayoshi Omura

发明人： Hiroshi Adachi ,  Hiroshi Saitoh ,  Kenichi Shirasaka ,  Hideki Sato ,  Masayoshi Omura

IPC分类号： H01L23/00

CPC分类号： G01R33/0206 ,  G01C17/30 ,  H01L21/565 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T29/49169 ,  Y10T29/49174 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.

摘要翻译： 磁传感器由安装在由互连构件支撑的台架上的磁传感器芯片和在引线框架中具有引线的框架构成。 这里，阶段倾向于互连构件的塑性变形。 当框架保持在金属模具中并且阶段被按压时，互连构件弹性变形，使得磁性传感器芯片被接合到基本上位于同一平面上的台架上，然后与引线接线。 此后，各级从压力释放，使得互连构件从其弹性变形状态恢复。 当磁传感器芯片组合在一起以实现三个感测方向时，可以精确地测量磁性的三维轴承，并且可以降低磁传感器的尺寸并以降低的成本制造磁传感器。

公开(公告)号：US20070176272A1

公开(公告)日：2007-08-02

申请号：US11566879

申请日：2006-12-05

申请人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

发明人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

IPC分类号： H01L23/02

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C3/005 ,  B81C2203/0109 ,  B81C2203/054 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned

摘要翻译： 本发明的半导体器件包括：在顶表面上具有中空的中空部分的衬底; 安装在基板的中空部分中的半导体芯片; 以及盖，其具有与基板相对并覆盖中空部的基本上板状的顶板部，并且具有至少一对侧壁部，该侧壁部从顶板部的圆周朝向基板突出并且与一对 基板的侧表面。 基板和盖子可以精确定位

公开(公告)号：US07192808B2

公开(公告)日：2007-03-20

申请号：US10780723

申请日：2004-02-19

申请人： Hiroshi Saitoh

发明人： Hiroshi Saitoh

IPC分类号： H01L21/00

CPC分类号： H01L24/48 ,  H01L23/3114 ,  H01L23/4951 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is produced using a lead frame whose size is smaller than a prescribed center area of a semiconductor chip surrounded by its bonding pads, which are connected with electrodes supported by electrode supports and interconnected with outer frames and an intermediate frame of the lead frame via bonding wires. A series of projections and hollows are formed on the outer frames, wherein the electrode supports are interconnected with the hollows of the outer frames respectively. The semiconductor chip combined with the lead frame, is integrally enclosed in a resin under the condition where only the electrode surfaces are exposed to the exterior, thus forming a resin package. Then, the electrode supports locating the electrodes are cut out and partially removed, so that the electrodes are made electrically independent from each other.

摘要翻译： 使用尺寸小于由其接合焊盘围绕的半导体芯片的规定中心区域的引线框制造半导体器件，该接合焊盘与由电极支撑件支撑并与外框架相互连接的电极和引线框架的中间框架连接 通过接合线。 在外框架上形成一系列凸起和凹槽，其中电极支撑件分别与外框架的中空部分互连。 与引线框架组合的半导体芯片在只有电极表面暴露于外部的条件下被整体封闭在树脂中，从而形成树脂封装。 然后，电极支撑件定位电极被切出并部分去除，使得电极彼此电独立。

公开(公告)号：US20070028685A1

公开(公告)日：2007-02-08

申请号：US11543034

申请日：2006-10-05

申请人： Kenichi Shirasaka ,  Hiroshi Saitoh

发明人： Kenichi Shirasaka ,  Hiroshi Saitoh

IPC分类号： G01P1/02

CPC分类号： B81B7/0077 ,  B81B2201/0235 ,  B81B2201/025 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in proximity to the outer ends of the physical quantity sensor chips. It is possible to realize the inclination of stages without using molds, wherein absorption devices are used to absorb prescribed portions related to stages, which rotate about axial lines and are thus inclined with respect to a prescribed base. In manufacturing, a thin metal plate having a plurality of lead frames is placed on a base delimited by a clamp; then, intersecting points of intermediate portions formed between the lead frames are subjected to pressing so as to realize the inclination of stages.

摘要翻译： 物理量传感器包括一对物理量传感器芯片，其相对于外部模具封装的底部倾斜，其侧表面各自在厚度方向上倾斜0°至5°的角度并且形成在接近 到物理量传感器芯片的外端。 可以在不使用模具的情况下实现阶段的倾斜，其中吸收装置用于吸收与围绕轴线旋转并且因此相对于规定基座倾斜的阶段相关的规定部分。 在制造中，具有多个引线框架的薄金属板放置在由夹具限定的基座上; 然后，对形成在引线框架之间的中间部分的相交点进行压制，以实现级的倾斜。

公开(公告)号：US07171956B2

公开(公告)日：2007-02-06

申请号：US10526331

申请日：2002-07-31

申请人： Takazi Igami ,  Toshimichi Kobayashi ,  Jyohei Yamamoto ,  Hiroshi Saitoh

发明人： Takazi Igami ,  Toshimichi Kobayashi ,  Jyohei Yamamoto ,  Hiroshi Saitoh

IPC分类号： F02M25/07 ,  F02B47/08 ,  F28F9/02 ,  F28F1/08

CPC分类号： F28D1/05333 ,  F02M26/32 ,  F28D1/047 ,  F28D21/0003 ,  F28F1/06 ,  F28F1/42 ,  F28F1/426 ,  F28F9/0131

摘要： The present invention provides an EGR cooler that is easy to manufacture and can accelerate heat exchange. Round in section tubes are plastically deformed in one plane crossing centerlines thereof such that corrugated exhaust gas flow paths are formed inside the tubes.

摘要翻译： 本发明提供一种易于制造并可加速热交换的EGR冷却器。 截面管中的圆形在穿过其中心线的一个平面中塑性变形，使得在管内形成波纹废气流动路径。

公开(公告)号：US20060211176A1

公开(公告)日：2006-09-21

申请号：US11368848

申请日：2006-03-07

申请人： Kenichi Shirasaka ,  Hiroshi Saitoh

发明人： Kenichi Shirasaka ,  Hiroshi Saitoh

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： G01P1/023 ,  G01P15/18 ,  H01L24/45 ,  H01L24/75 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/75303 ,  H01L2224/75745 ,  H01L2224/78301 ,  H01L2224/78803 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A physical quantity sensor is produced using a lead frame having at least one stage for mounting a physical quantity sensor chip and a frame having leads, wherein the physical quantity sensor chip is inclined with respect to the frame. A bonding device performs wire bonding so as to electrically connect the physical quantity sensor chip and leads, which are respectively located perpendicular to a capillary for discharging wires. The bonding device includes a wedge tool having a first planar surface for holding one ends of wires with leads and a second planar surface for holding the other ends of wires with the physical quantity sensor chip. The lead frame includes interconnection leads, having shape memory alloys, for interconnecting the stage and frame together. The physical quantity sensor chip can be mounted on the stage via an inclination member having a wedge shape.

摘要翻译： 使用具有用于安装物理量传感器芯片的至少一个级的引线框架和具有引线的框架来生产物理量传感器，其中物理量传感器芯片相对于框架倾斜。 接合装置进行引线接合，以将物理量传感器芯片和引线电连接，所述物理量传感器芯片和引线分别垂直于用于放电导线的毛细管定位。 接合装置包括楔形工具，该楔形工具具有第一平面表面，用于将导线的一端保持为引线，第二平坦表面用于用物理量传感器芯片保持电线的另一端。 引线框架包括具有形状记忆合金的互连引线，用于将平台和框架相互连接在一起。 物理量传感器芯片可以通过具有楔形的倾斜构件安装在平台上。