公开(公告)号：US06749100B2

公开(公告)日：2004-06-15

申请号：US09996293

申请日：2001-11-28

申请人： Yam Mo Wong ,  Keng Yew Song ,  Ka Shing Kwan ,  Hon Yu Ng ,  Tin Kwan Chan

发明人： Yam Mo Wong ,  Keng Yew Song ,  Ka Shing Kwan ,  Hon Yu Ng ,  Tin Kwan Chan

IPC分类号： B23K3700

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/10 ,  B23K2101/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/7865 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

摘要： The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-head of the apparatus is capable of independent bonding operation simultaneously with the other bond-heads, without synchronization of movement with the other bond-heads.

摘要翻译： 本发明提供一种用于形成半导体芯片和引线框架之间的电连接的引线键合装置，包括与所述引线接合装置上的多个工件保持器相关联的多个焊接头，用于保持多个引线框架， 该装置的头部能够与其他粘合头同时独立地结合操作，而不与其它粘合头同时移动。

公开(公告)号：US07303109B2

公开(公告)日：2007-12-04

申请号：US10612383

申请日：2003-07-01

申请人： Ka Shing Kwan ,  Guoshen Hu ,  Tingyu He ,  Yie Mi ,  Yam Mo Wong

发明人： Ka Shing Kwan ,  Guoshen Hu ,  Tingyu He ,  Yie Mi ,  Yam Mo Wong

IPC分类号： B23K1/06 ,  B23K37/04

CPC分类号： H01L21/68764 ,  H01L24/10 ,  H01L2924/01078 ,  H01L2924/01079

摘要： The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.

摘要翻译： 本发明提供了一种在具有可氧化材料的多个半导体器件上形成导电凸块的装置和方法。 该装置包括凸块形成装置，适于容纳半导体装置的室系统和用于将惰性气体供应到室系统中的气体供应装置。 提供了用于在凸起期间支撑半导体器件的支撑台，并且所述支撑台可操作以在撞击之后将半导体器件从凸起部位移动到腔室系统中。

公开(公告)号：US06572001B2

公开(公告)日：2003-06-03

申请号：US09899485

申请日：2001-07-05

申请人： Yam Mo Wong ,  Keng Yew Song

发明人： Yam Mo Wong ,  Keng Yew Song

IPC分类号： B23K3700

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K2101/38 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A bonding system (1) bonds wires between a first electrical contact surface on a semiconductor chip and a second electrical contact surface on a substrate. The bonding system (1) has a first memory device (3) having a master bond program stored thereon and a second memory device (4) having an operating bond program stored thereon.

摘要翻译： 接合系统（1）在半导体芯片上的第一电接触表面和基板上的第二电接触表面之间接合线。 接合系统（1）具有其上存储有主接合程序的第一存储器件（3）和存储有操作接合程序的第二存储器件（4）。

公开(公告)号：US08919631B2

公开(公告)日：2014-12-30

申请号：US13420739

申请日：2012-03-15

申请人： Yam Mo Wong ,  Ka Shing Kwan ,  Hing Leung Li ,  Xiang Chao Li

发明人： Yam Mo Wong ,  Ka Shing Kwan ,  Hing Leung Li ,  Xiang Chao Li

IPC分类号： B23K20/00 ,  B23K20/10 ,  H01L23/00 ,  B06B3/00

CPC分类号： B23K20/007 ,  B06B3/00 ,  B23K20/002 ,  B23K20/004 ,  B23K20/005 ,  B23K20/10 ,  B23K20/103 ,  B23K20/106 ,  H01L24/78 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/78308 ,  H01L2224/78343 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

摘要： Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

摘要翻译： 公开了一种用于将换能器安装到引线接合器的接合头的装置。 特别地，当在半导体封装内的不同位置之间形成电互连时，引线接合器的结合头可用于机械地驱动换能器。 具体地，该装置包括：i）具有用于连接到换能器的连接器的弯曲结构，该弯曲结构被构造成弯曲; 以及ii）附接到所述弯曲结构的至少一个致动器，所述至少一个致动器可操作以弯曲所述弯曲结构，从而引起经由所述连接器连接到其上的所述换能器的位移。

公开(公告)号：US06827247B1

公开(公告)日：2004-12-07

申请号：US09913014

申请日：2001-08-08

申请人： Liming Fan ,  Hon Yu Peter Ng ,  Xianbin Zhu ,  Yam Mo Wong ,  Keng Yew Song

发明人： Liming Fan ,  Hon Yu Peter Ng ,  Xianbin Zhu ,  Yam Mo Wong ,  Keng Yew Song

IPC分类号： B23K520

CPC分类号： H01L24/78 ,  B23K20/10 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/12043 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： Apparatus for detecting the oscillation amplitude of an oscillating object (3) includes an optical radiation source (9) and a detector (10) including first and second optical radiation sensing areas (24A, 24B) adjacent each other. The detector (10) and the optical radiation source (9) are adapted to be located opposite each other with the oscillating object (3) located between the source (9) and the detector (10) so that the object (3) blocks a portion of the sensing areas (24A, 24B) from receiving optical radiation from the source (9). A processor (18) coupled to the detector (10) receives first and second output signals representing the magnitude of optical radiation sensed by the first and second optical radiation sensing areas (24A, 24B), respectively. The processor (18) processes the first and second output signals to obtain an indication of the amplitude of oscillation of the object (3).

摘要翻译： 用于检测振荡物体（3）的振荡幅度的装置包括光辐射源（9）和包括彼此相邻的第一和第二光学辐射感测区域（24A，24B）的检测器（10）。 检测器（10）和光辐射源（9）适于彼此相对定位，其中振荡对象（3）位于源（9）和检测器（10）之间，使得物体（3）阻挡 感测区域（24A，24B）的一部分不接收来自源（9）的光辐射。 耦合到检测器（10）的处理器（18）分别接收表示由第一和第二光学辐射感测区域（24A，24B）感测的光辐射的大小的第一和第二输出信号。 处理器（18）处理第一和第二输出信号以获得对象（3）的振荡幅度的指示。

公开(公告)号：US07780064B2

公开(公告)日：2010-08-24

申请号：US11753957

申请日：2007-05-25

申请人： Yam Mo Wong ,  Mow Huat Goh

发明人： Yam Mo Wong ,  Mow Huat Goh

IPC分类号： B23K31/02

CPC分类号： B23K20/007 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method of forming a wire bond with a bonding tool is provided that comprises the steps of forming a ball bond onto a bonding surface, raising the bonding tool away from the ball bond to form a neck portion integrated with a top of the ball bond, locating a circumference of a tip of the bonding tool onto the neck portion, pressing the neck portion with the circumference of the tip to form a depression in the neck portion without bonding the neck portion to the ball bond, and thereafter raising the bonding tool away from the ball bond.

摘要翻译： 提供了一种与焊接工具形成引线接合的方法，其包括以下步骤：在接合表面上形成球接合，使接合工具远离球接头，形成与球接头顶部整合的颈部， 将接合工具的尖端的圆周定位在颈部上，用颈部的周边按压颈部以在颈部形成凹陷，而不将颈部粘合到球形接合处，然后将接合工具提升离开 从球的债券。

公开(公告)号：US07494042B2

公开(公告)日：2009-02-24

申请号：US10677604

申请日：2003-10-02

申请人： Yam Mo Wong ,  Yi Bin Wang ,  Wei Liu

发明人： Yam Mo Wong ,  Yi Bin Wang ,  Wei Liu

IPC分类号： B23K31/02

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method of bonding wire between first and second bonding points with a bonding tool, such as a capillary, is disclosed. A first bond is formed at the first bonding point with the bonding tool, and further steps include moving the bonding tool away from the first bond by a first distance, then moving the bonding tool towards the first bonding point and coupling the wire to the first bond. Thereafter, the bonding tool is moved away from the first bond by a second distance and a kink is formed in the wire. The bonding tool is subsequently moved to extend a sufficient length of wire to form a wire loop between the first and second bonding points before the bonding tool is moved to the second bonding point to form a second bond. Characteristics of wire bonds formable using the method are also disclosed.

摘要翻译： 公开了一种使用诸如毛细管的接合工具在第一和第二接合点之间接合线的方法。 在与焊接工具的第一接合点处形成第一接合，并且其它步骤包括使接合工具远离第一接合移动第一距离，然后将接合工具朝向第一接合点移动并将接合线耦合到第一接合点 键。 此后，接合工具从第一接合部移开第二距离，并且在线中形成扭结。 接合工具随后移动以延伸足够长的线，以在接合工具移动到第二接合点之前形成第一和第二接合点之间的线环，以形成第二接合。 还公开了使用该方法可形成的丝焊的特性。

公开(公告)号：US07214606B2

公开(公告)日：2007-05-08

申请号：US10798053

申请日：2004-03-11

申请人： Yam Mo Wong ,  Chee Wai Siew ,  Wei Liu ,  Zuo Cheng Shen

发明人： Yam Mo Wong ,  Chee Wai Siew ,  Wei Liu ,  Zuo Cheng Shen

IPC分类号： H01L21/44 ,  H01L23/48 ,  B23K31/02

CPC分类号： H01L24/48 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48455 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48997 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2224/05599

摘要： The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguous with the first stitch bond.

摘要翻译： 本发明提供一种将电线连接到电子设备的连接焊盘上的引线键合以及形成引线接合的方法。 在连接焊盘上形成第一缝合接头，接下来形成与第一针迹接合的连接焊盘上的第二缝合。

公开(公告)号：US06866182B2

公开(公告)日：2005-03-15

申请号：US10267143

申请日：2002-10-08

申请人： Yam Mo Wong ,  Ka Shing Kenny Kwan ,  Rong Duan ,  Zhao Ya Rui

发明人： Yam Mo Wong ,  Ka Shing Kenny Kwan ,  Rong Duan ,  Zhao Ya Rui

IPC分类号： B23K20/00 ,  B23K20/10 ,  B23K20/14 ,  B23K20/16 ,  H01L21/00 ,  H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  H01L23/495 ,  H05K3/00 ,  H05K13/00 ,  B23K31/02 ,  B23K1/06

CPC分类号： H01L24/78 ,  B23K20/005 ,  B23K20/14 ,  B23K2101/40 ,  H01L24/45 ,  H01L2224/45147 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00015

摘要： The invention provides an apparatus and a method for preventing oxidation of an electronic device, such as a semiconductor leadframe, when it is heated. The apparatus comprises an area in which said device is to be heated and inlet means adapted to supply a relatively inert gas to the said area. In particular, the apparatus includes a porous distribution element through which the inert gas is passed from the inlet means to said area, whereby to protect the electronic device in the area from oxidation.

摘要翻译： 本发明提供一种当加热时防止诸如半导体引线框架的电子器件的氧化的装置和方法。 所述设备包括其中要加热所述装置的区域，并且适于向所述区域供应相对惰性气体的入口装置。 特别地，该设备包括多孔分配元件，惰性气体通过该多孔分配元件从入口装置传递到所述区域，从而保护该区域中的电子设备不被氧化。

公开(公告)号：US07677431B2

公开(公告)日：2010-03-16

申请号：US11843012

申请日：2007-08-22

申请人： Yam Mo Wong ,  Keng Yew James Song ,  Ka Shing Kenny Kwan

发明人： Yam Mo Wong ,  Keng Yew James Song ,  Ka Shing Kenny Kwan

IPC分类号： B23K31/02

CPC分类号： B23K37/047 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/7865 ,  H01L2224/85121 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the electronic device has been bonded, the electronic device is conveyed to a rotary platform that is rotatable along a substantially horizontal plane. The electronic device is rotated on the rotary platform to change the respective positions of the bonded first portion and unbonded second portion of the electronic device, before the electronic device is conveyed to the bonding tool such that the second portion of the electronic device is located for bonding by the bonding tool. The second portion of the electronic device may then be bonded.

摘要翻译： 具有包括第一和第二部分的一侧上具有接合区域的大型电子设备可以通过首先定位用于通过接合工具进行接合的电子设备的第一部分而不是第二部分来进行接合。 在电子设备的第一部分已经结合之后，电子设备被传送到可沿着基本上水平的平面旋转的旋转平台。 在电子设备被传送到接合工具之前，电子设备在旋转平台上旋转以改变接合的第一部分和未结合的电子设备的第二部分的位置，使得电子设备的第二部分位于 通过粘合工具进行粘合。 然后可以结合电子设备的第二部分。