LITHOGRAPHY APPARATUS
    1.
    发明公开

    公开(公告)号:US20240353764A1

    公开(公告)日:2024-10-24

    申请号:US18388298

    申请日:2023-11-09

    IPC分类号: G03F7/00

    摘要: Provided is a lithography apparatus including a wafer stage, a cable connected to the wafer stage, the cable being configured to bend based on the wafer stage moving, a support unit configured to prevent the cable from sagging, the support unit including a plurality of clamps configured to restrict movement of the cable and a connection member connecting the plurality of clamps to each other, and a protective unit under the cable, the protective unit being configured to collide with the support unit based on the wafer stage moving, wherein the protective unit includes ultra-high molecular weight polyethylene (UHMWPE).

    LITHOGRAPHY CONTAMINATION CONTROL
    5.
    发明公开

    公开(公告)号:US20230273534A1

    公开(公告)日:2023-08-31

    申请号:US18311795

    申请日:2023-05-03

    IPC分类号: G03F7/00 G02B17/06 H05G2/00

    摘要: A lithography system is provided capable of deterring contaminants, such as tin debris from entering into the scanner. The lithography system in accordance with various embodiments of the present disclosure includes a processor, an extreme ultraviolet light source, a scanner, and a hollow connection member. The light source includes a droplet generator for generating a droplet, a collector for reflecting extreme ultraviolet light into an intermediate focus point, and a light generator for generating pre-pulse light and main pulse light. The droplet generates the extreme ultraviolet light in response to the droplet being illuminated with the pre-pulse light and the main pulse light. The scanner includes a wafer stage. The hollow connection member includes an inlet that is in fluid communication with an exhaust pump. The hollow connection member provides a hollow space in which the intermediate focus point is disposed. The hollow connection member is disposed between the extreme ultraviolet light source and the scanner.

    Collector flow ring
    6.
    发明授权

    公开(公告)号:US11740565B2

    公开(公告)日:2023-08-29

    申请号:US17784951

    申请日:2020-12-09

    IPC分类号: G03F7/20 G03F7/00

    摘要: Systems, apparatuses, and methods are provided for a collector flow ring (CFR) housing configured to mitigate an accumulation of fuel debris in an extreme ultraviolet (EUV) radiation system. An example CFR housing can include a plurality of showerhead flow channel outlets configured to output a plurality of first gaseous fluid flows over a plurality of portions of a plasma-facing surface of the CFR housing. The example CFR housing can further include a gutter purge flow channel outlet configured to output a second gaseous fluid flow over a fuel debris-receiving surface of the CFR housing. The example CFR housing can further include a shroud mounting structure configured to support a shroud assembly, a cooling flow channel configured to transport a fluid, and a plurality of optical metrology ports configured to receive a plurality of optical metrology tubes.

    METHOD FOR MANUFACTURING A MEMBRANE ASSEMBLY

    公开(公告)号:US20230213851A1

    公开(公告)日:2023-07-06

    申请号:US18120886

    申请日:2023-03-13

    IPC分类号: G03F7/20 G03F1/62

    摘要: A method for manufacturing a membrane assembly for EUV lithography, the method including: providing a stack having a planar substrate and at least one membrane layer, wherein the planar substrate includes an inner region and a border region around the inner region; and selectively removing the inner region of the planar substrate. The membrane assembly includes: a membrane formed from the at least one membrane layer; and a border holding the membrane, the border formed from the border region of the planar substrate. The stack is provided with a mechanical protection material configured to mechanically protect the border region during the selectively removing the inner region of the planar substrate.

    Exposure machine
    8.
    发明授权

    公开(公告)号:US11662667B2

    公开(公告)日:2023-05-30

    申请号:US17439566

    申请日:2021-06-17

    发明人: Bo Liu

    IPC分类号: G03F7/20

    摘要: The present application provides an exposure machine, relates to semiconductor integrated circuit manufacturing technologies. The exposure machine includes a machine platform, a shielding device, and a drive device; the machine platform is provided with a recess portion, the recess portion has a top opening, a base and a placement table are disposed in the recess portion, the placement table is configured to carry a mask carrier, and the mask carrier can be placed on the placement table through the top opening; and the machine platform is further provided with a drive device and a movable shielding device, when the shielding device is at an initial position, the shielding device covers the top opening, and when the mask carrier needs to be placed on the placement table through the top opening, the drive device opens the shielding device to expose the top opening.