公开(公告)号：US20100136284A1

公开(公告)日：2010-06-03

申请号：US12594165

申请日：2008-03-26

Applicant: Masaaki Harazono ,  Masaharu Shirai ,  Katsura Hayashi

Inventor： Masaaki Harazono ,  Masaharu Shirai ,  Katsura Hayashi

IPC: B32B3/12 ,  B32B5/12

CPC classification number: C08J5/04 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0296 ,  Y10T428/24099 ,  Y10T428/24149 ,  Y10T428/24994

Abstract: A fiber-reinforced resin is provided which includes a fiber bundle 2 comprising a plurality of monofilament layers 20, 21, and 22 being laminated, each of the monofilament layers comprising a plurality of monofilaments 23 arranged in one direction and an adhesive 3 for adhering the monofilaments 23 of the fiber bundle 2 together, and the fiber bundle 2 has a honeycomb-shaped cross section.

Abstract translation: 提供了一种纤维增强树脂，其包括层叠多个单丝层20,21和22的纤维束2，每个单丝层包括沿一个方向布置的多根单丝23和粘合剂3 纤维束2的单丝23一起，纤维束2具有蜂窝状的截面。

公开(公告)号：US20240179837A1

公开(公告)日：2024-05-30

申请号：US18519656

申请日：2023-11-27

Applicant: CORNING INCORPORATED

Inventor： Joseph Edward McCarthy ,  Geraint Owen ,  Soumyadyuti Samai ,  Meiyu Zhai

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0296

Abstract: A printed circuit board (PCB) composite material includes a polymer layer and a fiber layer encapsulated within the polymer layer. The fiber layer includes a first monolayer of continuous silica fibers longitudinally co-aligned in a first direction. Each continuous silica fiber in the first monolayer extends without discontinuity through the polymer layer such that opposed ends of each continuous silica fiber are adjacent to a perimeter of the polymer layer. The PCB composite material has a dielectric loss tangent of less than or equal to about 0.0015 at 15 GHz or higher frequency. A printed circuit board (PCB) includes the PCB composite material and at least one conductive layer disposed on a side of the PCB composite material.

公开(公告)号：US4579772A

公开(公告)日：1986-04-01

申请号：US562664

申请日：1983-12-19

Applicant: Anilkumar C. Bhatt ,  Michael J. Cibulsky ,  Donald E. Doran ,  Lawrence J. Hugaboom ,  James W. Knight

Inventor： Anilkumar C. Bhatt ,  Michael J. Cibulsky ,  Donald E. Doran ,  Lawrence J. Hugaboom ,  James W. Knight

IPC: D03D1/00 ,  D03D15/00 ,  D03D15/12 ,  H05K1/03 ,  B32B17/02 ,  B32B17/04

CPC classification number: D03D1/0082 ,  D03D1/00 ,  D03D15/00 ,  D03D15/0011 ,  D03D15/0083 ,  H05K1/0366 ,  D10B2505/02 ,  H05K2201/029 ,  H05K2201/0296 ,  Y10S428/901 ,  Y10T428/2973 ,  Y10T442/2008 ,  Y10T442/2951 ,  Y10T442/3114

Abstract: Woven glass cloth and method of its manufacture suitable for use as a resin-impregnated substrate for printed circuits in which the major dimension or transverse axis of the elliptical warp yarns exceeds a predetermined fraction of that dimension of the fill yarns of the woven cloth. Multi-filament warp yarns are typically subjected to tensile stress during weaving and firing such that the yarn compaction prevents the thorough impregnation by a resin. The result is that voids are maintained along the innermost filaments of the yarn. These voids, when filled with materials other than resin, such as plating solution, ultimately produce circuit failures.

Abstract translation: 编织玻璃布及其制造方法适合用作印刷电路用树脂浸渍基材，其中椭圆经纱的主要尺寸或横轴超过织布的填充纱线的该尺寸的预定分数。 多丝经纱通常在织造和烧制期间经受拉伸应力，使得纱线压实防止树脂的彻底浸渍。 结果是沿着纱线的最内侧的细丝保持空隙。 当填充树脂以外的材料（如电镀溶液）时，这些空隙最终会导致电路故障。

公开(公告)号：US08377543B2

公开(公告)日：2013-02-19

申请号：US12514365

申请日：2007-10-09

Applicant: Toshinobu Ogatsu

Inventor： Toshinobu Ogatsu

IPC: B32B9/00

CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/4635 ,  H05K3/4691 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0296 ,  H05K2201/09018 ,  H05K2203/302 ,  Y10T428/24917 ,  Y10T442/3065 ,  Y10T442/3195 ,  Y10T442/3236

Abstract: Provided is a multilayer-wired substrate for mobile electric equipment, wherein the multilayer-wired substrate is very strong, includes a larger elastically deformable region and a higher elasticity than those of the conventional structure, and can be curved. The multilayer-wired substrate is a multilayer-wired substrate including one or more insulating layers. At least one insulating layer of the substrate is made of a material in which the mechanical characteristic in an in-plane direction component exhibits anisotropy.

Abstract translation: 本发明提供一种移动电子设备用多层布线基板，其中多层布线基板非常坚固，包括比常规结构更大的弹性变形区域和更高的弹性，并且可以是弯曲的。 多层布线基板是包括一个或多个绝缘层的多层布线基板。 衬底的至少一个绝缘层由其中面内方向分量的机械特性表现出各向异性的材料制成。

公开(公告)号：US08012561B2

公开(公告)日：2011-09-06

申请号：US12594165

申请日：2008-03-26

Applicant: Masaaki Harazono ,  Masaharu Shirai ,  Katsura Hayashi

Inventor： Masaaki Harazono ,  Masaharu Shirai ,  Katsura Hayashi

IPC: B32B3/12

CPC classification number: C08J5/04 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0296 ,  Y10T428/24099 ,  Y10T428/24149 ,  Y10T428/24994

Abstract: A fiber-reinforced resin is provided which includes a fiber bundle 2 comprising a plurality of monofilament layers 20, 21, and 22 being laminated, each of the monofilament layers comprising a plurality of monofilaments 23 arranged in one direction and an adhesive 3 for adhering the monofilaments 23 of the fiber bundle 2 together, and the fiber bundle 2 has a honeycomb-shaped cross section.

Abstract translation: 提供了一种纤维增强树脂，其包括层叠多个单丝层20,21和22的纤维束2，每个单丝层包括沿一个方向布置的多根单丝23和粘合剂3 纤维束2的单丝23一起，纤维束2具有蜂窝状的截面。

公开(公告)号：US06543258B1

公开(公告)日：2003-04-08

申请号：US09555401

申请日：2000-05-30

Applicant: Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

Inventor： Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

IPC: C03B37083

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

公开(公告)号：US09257386B2

公开(公告)日：2016-02-09

申请号：US14548784

申请日：2014-11-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiromu Arisaka ,  Noriyoshi Shimizu ,  Masato Tanaka ,  Tetsuya Koyama ,  Akio Rokugawa

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H01L21/00

CPC classification number: H01L23/49838 ,  H01L23/145 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/0137 ,  H05K2201/029 ,  H05K2201/0296 ,  H01L2924/00

Abstract: A wiring substrate includes first and second wiring structures. The first wiring structure includes a core substrate, first and second insulation layers each formed from a thermosetting insulative resin including a reinforcement material, and a via wire formed in the first insulation layer. The second wiring structure includes a wiring layer formed on upper surfaces of the first insulation layer and the via wire, an insulation layer formed on the upper surface of the first insulation layer, and an uppermost wiring layer including a pad used to electrically connect a semiconductor chip and the wiring layer. An outermost insulation layer stacked on a lower surface of the second insulation layer exposes a portion of a lowermost wiring layer stacked on the lower surface of the second insulation layer as an external connection pad. The second wiring structure has a higher wiring density than the first wiring structure.

Abstract translation: 布线基板包括第一和第二布线结构。 第一布线结构包括芯基板，由包括增强材料的热固性绝缘树脂形成的第一绝缘层和第二绝缘层，以及形成在第一绝缘层中的通孔布线。 第二布线结构包括形成在第一绝缘层和通孔导线的上表面上的布线层，形成在第一绝缘层的上表面上的绝缘层，以及包括用于将半导体 芯片和布线层。 堆叠在第二绝缘层的下表面上的最外绝缘层暴露作为外部连接焊盘堆叠在第二绝缘层的下表面上的最下布线层的一部分。 第二布线结构具有比第一布线结构更高的布线密度。

公开(公告)号：US20150179560A1

公开(公告)日：2015-06-25

申请号：US14548784

申请日：2014-11-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiromu Arisaka ,  Noriyoshi SHIMIZU ,  Masato TANAKA ,  Tetsuya KOYAMA ,  Akio ROKUGAWA

IPC: H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02 ,  H01L25/10 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/145 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/0137 ,  H05K2201/029 ,  H05K2201/0296 ,  H01L2924/00

Abstract: A wiring substrate includes first and second wiring structures. The first wiring structure includes a core substrate, first and second insulation layers each formed from a thermosetting insulative resin including a reinforcement material, and a via wire formed in the first insulation layer. The second wiring structure includes a wiring layer formed on upper surfaces of the first insulation layer and the via wire, an insulation layer formed on the upper surface of the first insulation layer, and an uppermost wiring layer including a pad used to electrically connect a semiconductor chip and the wiring layer. An outermost insulation layer stacked on a lower surface of the second insulation layer exposes a portion of a lowermost wiring layer stacked on the lower surface of the second insulation layer as an external connection pad. The second wiring structure has a higher wiring density than the first wiring structure.

Abstract translation: 布线基板包括第一和第二布线结构。 第一布线结构包括芯基板，由包括增强材料的热固性绝缘树脂形成的第一绝缘层和第二绝缘层，以及形成在第一绝缘层中的通孔布线。 第二布线结构包括形成在第一绝缘层和通孔导线的上表面上的布线层，形成在第一绝缘层的上表面上的绝缘层，以及包括用于将半导体 芯片和布线层。 堆叠在第二绝缘层的下表面上的最外绝缘层暴露作为外部连接焊盘堆叠在第二绝缘层的下表面上的最下布线层的一部分。 第二布线结构具有比第一布线结构更高的布线密度。

公开(公告)号：US06615616B2

公开(公告)日：2003-09-09

申请号：US10361701

申请日：2003-02-11

Applicant: Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

Inventor： Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

IPC: C03B37083

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

Abstract translation: 非织造布由高度扁平的玻璃纤维构成，该玻璃纤维的截面为平坦的玻璃纤维，平坦度为2.0〜10，填充率为85％以上，优选为90％以上， 。 在该非织造布中，玻璃纤维部分的形状接近矩形，因此玻璃纤维可以非常密集地布置以形成具有高堆积密度的薄无纺布，并且当其用作层压材料时，玻璃纤维 可以提高纤维含量，同时可以提高表面平滑性，并且可以适当地用作印刷线路板的增强材料。 此外，上述平板玻璃纤维可以通过使用例如具有扁平喷嘴孔的喷嘴片的长轴壁的一侧部分凹口的形状的喷嘴来制造。

公开(公告)号：US20030131632A1

公开(公告)日：2003-07-17

申请号：US10361701

申请日：2003-02-11

Applicant: NITTO BOSEKI CO., LTD.

Inventor： Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

IPC: C03B037/083

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

Abstract translation: 非织造布由高度扁平的玻璃纤维构成，该玻璃纤维的截面为平坦的玻璃纤维，平坦度为2.0〜10，填充率为85％以上，优选为90％以上的部分， 。 在该非织造布中，玻璃纤维部分的形状接近矩形，因此玻璃纤维可以非常密集地布置以形成具有高堆积密度的薄无纺布，并且当其用作层压材料时，玻璃纤维 可以提高纤维含量，同时可以提高表面平滑性，并且可以适当地用作印刷线路板的增强材料。 此外，上述平板玻璃纤维可以通过使用例如具有扁平喷嘴孔的喷嘴片的长轴壁的一侧部分凹口的形状的喷嘴来制造。