公开(公告)号：US10134680B2

公开(公告)日：2018-11-20

申请号：US15676288

申请日：2017-08-14

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takaharu Yamano ,  Hajime Iizuka ,  Hideaki Sakaguchi ,  Toshio Kobayashi ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Kiyoaki Iida ,  Tomoaki Mashima ,  Koichi Tanaka ,  Yuji Kunimoto ,  Takashi Yanagisawa

IPC: H02B1/00 ,  H01L23/538 ,  H01L23/00 ,  H01L23/552 ,  H01L21/683 ,  H01L21/56 ,  H05K1/18 ,  H01L25/16 ,  H01L25/10 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H05K3/46 ,  H05K3/20

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

公开(公告)号：US09451702B2

公开(公告)日：2016-09-20

申请号：US14321030

申请日：2014-07-01

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takaharu Yamano ,  Hajime Iizuka ,  Hideaki Sakaguchi ,  Toshio Kobayashi ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Kiyoaki Iida ,  Tomoaki Mashima ,  Koichi Tanaka ,  Yuji Kunimoto ,  Takashi Yanagisawa

IPC: H05K1/18 ,  H01L21/683 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/16 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H05K3/20 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract translation: 公开了一种电子部件嵌入式基板。 电子部件嵌入式基板包括第一基板，第二基板，电子部件，电连接部件和密封部件。 还公开了一种制造电子部件嵌入式基板的方法。 该方法包括将电子部件安装到第一基板上，通过电连接部件将第二基板层压在第一基板上; 以及用密封构件填充第一基板和第二基板之间的空间以密封电子部件。

公开(公告)号：US20160143139A1

公开(公告)日：2016-05-19

申请号：US14938091

申请日：2015-11-11

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Haruo Sorimachi ,  Tetsuya Koyama

IPC: H05K1/11 ,  H05K1/09 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01L23/49816 ,  H01L23/5383 ,  H01L24/00 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/1403 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/141 ,  H05K3/4694 ,  H05K2201/0367 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y02P70/611

Abstract: An electronic component device includes a first insulating layer, a wiring layer, a second insulating layer, a wiring component, and first and second electronic components. The first insulating layer includes a mounting region on an upper surface thereof. The wiring layer is formed on the first insulating layer except the mounting region. The second insulating layer is formed on the first insulating layer, is formed with an opening in the mounting region, and is formed with first and second connection holes on the wiring layer. The wiring component is mounted in the mounting region and in the opening and includes first and second connecting portions. The first electronic component is connected to the first connecting portion and is connected to the wiring layer in the first connection hole. The second electronic component is connected to the second connecting portion and is connected to the wiring layer in second connection hole.

Abstract translation: 电子部件装置包括第一绝缘层，布线层，第二绝缘层，布线部件以及第一和第二电子部件。 第一绝缘层包括在其上表面上的安装区域。 布线层形成在除了安装区域之外的第一绝缘层上。 第二绝缘层形成在第一绝缘层上，在安装区域形成有开口，并且在布线层上形成有第一和第二连接孔。 布线部件安装在安装区域和开口中，并且包括第一和第二连接部分。 第一电子部件连接到第一连接部分并连接到第一连接孔中的布线层。 第二电子部件连接到第二连接部，并且在第二连接孔中连接到布线层。

公开(公告)号：US09257386B2

公开(公告)日：2016-02-09

申请号：US14548784

申请日：2014-11-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiromu Arisaka ,  Noriyoshi Shimizu ,  Masato Tanaka ,  Tetsuya Koyama ,  Akio Rokugawa

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H01L21/00

CPC classification number: H01L23/49838 ,  H01L23/145 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/0137 ,  H05K2201/029 ,  H05K2201/0296 ,  H01L2924/00

Abstract: A wiring substrate includes first and second wiring structures. The first wiring structure includes a core substrate, first and second insulation layers each formed from a thermosetting insulative resin including a reinforcement material, and a via wire formed in the first insulation layer. The second wiring structure includes a wiring layer formed on upper surfaces of the first insulation layer and the via wire, an insulation layer formed on the upper surface of the first insulation layer, and an uppermost wiring layer including a pad used to electrically connect a semiconductor chip and the wiring layer. An outermost insulation layer stacked on a lower surface of the second insulation layer exposes a portion of a lowermost wiring layer stacked on the lower surface of the second insulation layer as an external connection pad. The second wiring structure has a higher wiring density than the first wiring structure.

Abstract translation: 布线基板包括第一和第二布线结构。 第一布线结构包括芯基板，由包括增强材料的热固性绝缘树脂形成的第一绝缘层和第二绝缘层，以及形成在第一绝缘层中的通孔布线。 第二布线结构包括形成在第一绝缘层和通孔导线的上表面上的布线层，形成在第一绝缘层的上表面上的绝缘层，以及包括用于将半导体 芯片和布线层。 堆叠在第二绝缘层的下表面上的最外绝缘层暴露作为外部连接焊盘堆叠在第二绝缘层的下表面上的最下布线层的一部分。 第二布线结构具有比第一布线结构更高的布线密度。

公开(公告)号：US09768122B2

公开(公告)日：2017-09-19

申请号：US15241482

申请日：2016-08-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takaharu Yamano ,  Hajime Iizuka ,  Hideaki Sakaguchi ,  Toshio Kobayashi ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Kiyoaki Iida ,  Tomoaki Mashima ,  Koichi Tanaka ,  Yuji Kunimoto ,  Takashi Yanagisawa

IPC: H05K1/16 ,  H01L23/538 ,  H01L21/683 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/16 ,  H05K1/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H05K3/20 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

公开(公告)号：US09137900B2

公开(公告)日：2015-09-15

申请号：US13968620

申请日：2013-08-16

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Koichi Tanaka ,  Nobuyuki Kurashima ,  Hajime Iizuka ,  Tetsuya Koyama

IPC: H05K1/18 ,  H05K3/36 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L23/538 ,  H01L21/56

CPC classification number: H05K1/185 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H05K1/186 ,  H05K3/36 ,  H05K2201/042 ,  H05K2201/10674 ,  Y10T29/49126 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L24/81 ,  H01L24/83 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/81

Abstract: An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate.

Abstract translation: 电子元件结合基板包括通过间隔单元彼此电连接的第一基板和第二基板。 电子部件安装在第一基板上并且布置在第一基板和第二基板之间。 第一封装树脂形成在第一基板和第二基板之间以封装电子部件。 在第一封装树脂的第一表面上形成第二封装树脂以填充第一封装树脂和第二基板之间的空间。 间隔单元包括沿第一基板和第二基板的堆叠方向堆叠的第一焊球，金属柱和第二焊球的堆叠结构。

公开(公告)号：US09059088B2

公开(公告)日：2015-06-16

申请号：US13944188

申请日：2013-07-17

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Nobuyuki Kurashima ,  Tetsuya Koyama ,  Hajime Ilzuka ,  Koichi Tanaka

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/12 ,  H01L23/28 ,  H01L23/498 ,  H01L21/56 ,  H05K1/14 ,  H01L23/31 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L23/28 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/14 ,  H05K1/186 ,  H05K3/284 ,  H05K3/462 ,  H05K3/4697 ,  H05K2201/10234 ,  H05K2203/1327 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component built-in substrate, includes a lower wiring substrate, an electronic component mounted on the lower wiring substrate, an intermediate wiring substrate including an opening portion in which the electronic component is mounted, and arranged in a periphery of the electronic component, and connected to the lower wiring substrate via a first conductive ball, an upper wiring substrate arranged over the electronic component and the intermediate wiring substrate, and connected to the intermediate wiring substrate via a second conductive ball, and a resin filled into respective areas between the lower wiring substrate, the intermediate wiring substrate, and the upper wiring substrate, and sealing the electronic component, wherein the first conductive ball and the second conductive ball are arranged in displaced positions mutually.

Abstract translation: 电子部件内置基板包括下布线基板，安装在下布线基板上的电子部件，包括安装有电子部件的开口部并配置在电子部件的周围的中间布线基板， 并且经由第一导电球，布置在电子部件上的上部布线基板和中间布线基板连接到下部布线基板，并且经由第二导电球与中间布线基板连接，并且将树脂填充到第二导电球之间的各个区域中 下布线基板，中间布线基板和上布线基板，并且密封电子部件，其中第一导电球和第二导电球相互布置在位移​​位置。