公开(公告)号：US20240316689A1

公开(公告)日：2024-09-26

申请号：US18580395

申请日：2022-07-26

申请人： OSAKA UNIVERSITY

发明人： Hidetoshi FUJII ,  Huihong LIU ,  Yoshiaki MORISADA

IPC分类号： B23K20/12 ,  B23K103/04 ,  B23K103/10 ,  B23K103/12

CPC分类号： B23K20/129 ,  B23K2103/04 ,  B23K2103/10 ,  B23K2103/12

摘要： Provided are: a solid-state joining method with which it is possible to control the discharge direction of burrs and to realize sufficient joining strength; a solid-state joined joint and a solid-state joined structure that are obtained through the solid-state joining method; and a solid-state joining device that can be suitably used in the solid-state joining method. A solid-state joining method characterized by having a first step for bringing end parts of one material being joined and another material being joined into butting contact with one another and forming a joining interface, a second step for increasing the temperature in the vicinity of the joining interface by using an external heating means, and a third step for plastically deforming the joining interface to thereby discharge burrs and form a solid-state joined interface, the plate thickness of the end part of the one material being joined and/or the other material being joined is reduced, and the solid-state joining method having a gradient such that the plate thickness decreases on a side where discharge of the burrs is suppressed.

公开(公告)号：US12036628B2

公开(公告)日：2024-07-16

申请号：US18140662

申请日：2023-04-28

申请人： Aptiv Technologies AG

发明人： Stephen Antaya ,  William Falk ,  Justin Amalfitano ,  Amit Datta

IPC分类号： B23K35/26 ,  B23K103/00 ,  B23K103/02 ,  B23K103/12 ,  C22C13/00 ,  C22C30/04 ,  C22C30/06

CPC分类号： B23K35/262 ,  C22C13/00 ,  C22C30/04 ,  C22C30/06 ,  B23K2103/02 ,  B23K2103/12 ,  B23K2103/54 ,  Y10T428/12597 ,  Y10T428/12715 ,  Y10T428/12722

摘要： An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

公开(公告)号：US12023754B2

公开(公告)日：2024-07-02

申请号：US18255401

申请日：2021-11-16

申请人： Auto-Kabel Management GmbH

发明人： Urszula Bitner ,  Marie Redder ,  Kabelo Sebetlela

IPC分类号： B23K26/0622 ,  B23K26/00 ,  B23K26/34 ,  B23K26/38 ,  B23K101/36 ,  B23K103/10 ,  B23K103/12

CPC分类号： B23K26/0624 ,  B23K26/0006 ,  B23K26/34 ,  B23K26/38 ,  B23K2101/36 ,  B23K2103/10 ,  B23K2103/12

摘要： A method of coating metal parts, comprising providing a metal part of a first metal material, applying a foil of a second metal material to the metal material onto the metal part in a bearing area, and irradiating the foil applied on the metal part in at least part of the bearing area with a laser.

公开(公告)号：US11980967B2

公开(公告)日：2024-05-14

申请号：US16400792

申请日：2019-05-01

申请人： Electro Scientific Industries, Inc.

发明人： Yunlong Sun

IPC分类号： B23K26/06 ,  B23K26/0622 ,  B23K26/40 ,  B23K103/00 ,  B23K103/10 ,  B23K103/12 ,  B23K103/16

CPC分类号： B23K26/0624 ,  B23K26/0622 ,  B23K26/40 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52

摘要： A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.

公开(公告)号：US11942748B2

公开(公告)日：2024-03-26

申请号：US16979676

申请日：2018-12-14

申请人： Auto-Kabel Management GmbH

发明人： Rene Mathews ,  Kai Moldenhauer

IPC分类号： H01R43/28 ,  B23K20/10 ,  B23K20/227 ,  B23K20/233 ,  H01R11/26 ,  H01R11/28 ,  B23K101/00 ,  B23K101/32 ,  B23K101/38 ,  B23K103/04 ,  B23K103/10 ,  B23K103/12 ,  B23K103/20 ,  H01R4/02 ,  H01R43/02

CPC分类号： H01R43/28 ,  B23K20/106 ,  B23K20/2275 ,  B23K20/2333 ,  B23K20/2336 ,  H01R11/26 ,  H01R11/281 ,  B23K2101/006 ,  B23K2101/32 ,  B23K2101/38 ,  B23K2103/05 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/20 ,  H01R4/029 ,  H01R43/0207 ,  H01R43/0214

摘要： Method for establishing a connection between an electrical connecting element for a motor vehicle on-board network and a cable of the motor vehicle on-board network in which the cable (2) is provided with a metallic stranded conductor (4), firstly the metallic stranded conductor is mechanically compacted in such a way that a flat area is formed, whereby during the compacting, a material bond is formed between strands of the stranded conductor (4), and subsequently, the connecting element is connected to the flat region in a material bond.

公开(公告)号：US11936152B2

公开(公告)日：2024-03-19

申请号：US16937082

申请日：2020-07-23

申请人： NEXANS

发明人： Helmut Steinberg

IPC分类号： H01R4/02 ,  B23K20/12 ,  H01R43/02 ,  B23K101/38 ,  B23K103/10 ,  B23K103/12 ,  H01R4/58

CPC分类号： H01R43/02 ,  B23K20/122 ,  H01R4/029 ,  B23K2101/38 ,  B23K2103/10 ,  B23K2103/12 ,  H01R4/58

摘要： A method is provided for electrically conductively connecting a contact part to a conductor having a multiplicity of individual wires includes inserting the conductor into a cavity in the contact part and lowering a tool for friction stir welding onto the contact part. The tool for friction stir welding is moved on the contact part in a plane, thus giving rise to a planar cohesive connection between the contact part and the conductor. In this way, a direct cohesive connection of a stranded conductor and a contact part is produced without the need for an additional part such as a sleeve, for example, to prevent the stranded conductor from “sticking out”.

公开(公告)号：US11897050B1

公开(公告)日：2024-02-13

申请号：US17971512

申请日：2022-10-21

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Taizo Tomioka

IPC分类号： B23K20/00 ,  B23K20/12 ,  B23K103/04 ,  B23K103/20 ,  B23K103/12 ,  B23K103/08 ,  B23K103/10

CPC分类号： B23K20/125 ,  B23K2103/04 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/15 ,  B23K2103/20

摘要： A method for joining dissimilar metals according to the embodiment is a method for butt-joining, using frictional heat, a first member having a plate shape and containing first metal and a second member having a plate shape and containing second metal having a melting point higher than that of the first metal. The method for joining dissimilar metals includes: overlapping an end portion of the second member on an end portion of the first member; and pressurizing the second member toward the first member by bringing a rotating joining tool having a protruding portion at a tip end into contact with an overlapping portion of the second member with the first member. When the second member is pressurized toward the first member, the tip end of the rotating joining tool is not in contact with the first member.

公开(公告)号：US11823920B2

公开(公告)日：2023-11-21

申请号：US17124475

申请日：2020-12-16

申请人： JMJ Korea Co., Ltd.

发明人： Yun Hwa Choi ,  Jung Min Park

IPC分类号： H01L21/67 ,  B22F7/06 ,  B23K1/00 ,  B23K1/005 ,  B23K1/012 ,  B23K3/06 ,  B23K37/04 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68 ,  B23K103/12 ,  B23K101/40

CPC分类号： H01L21/67144 ,  B22F7/064 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/012 ,  B23K3/0607 ,  B23K37/04 ,  H01L21/67034 ,  H01L21/67333 ,  H01L21/67754 ,  H01L21/681 ,  B22F2301/10 ,  B22F2301/255 ,  B23K2101/40 ,  B23K2103/12

摘要： Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.

公开(公告)号：US11534864B2

公开(公告)日：2022-12-27

申请号：US17057577

申请日：2019-05-27

申请人： Robert Bosch GmbH

发明人： Andreas Heider ,  Reiner Ramsayer

IPC分类号： B23K26/08 ,  B23K26/20 ,  B23K26/21 ,  B23K26/32 ,  B23K26/244 ,  B23K26/035 ,  B23K26/70 ,  B23K37/04 ,  B23K103/10 ,  B23K103/12 ,  B23K101/36

摘要： A method for connecting two components with the aid of a laser weld seam. The two components are situated one above the other in a joining area. The first component is pressed in the direction of the second component with the aid of a clamping device. A laser beam impacts the first component on the side facing away from the second component and at least indirectly fusing material of the two components.

公开(公告)号：US11504801B2

公开(公告)日：2022-11-22

申请号：US16551284

申请日：2019-08-26

申请人： Phoenix Laser Solutions

发明人： Christopher Learn ,  Albert Hammeke

IPC分类号： B23K25/00 ,  B23K26/03 ,  B23K35/00 ,  B23K35/02 ,  B23K26/20 ,  B23K26/22 ,  B23K103/12 ,  B23K103/04 ,  B23K103/22

摘要： A method of attaching a first metal object to a second metal object is presented. The first metal object and the second metal object are dissimilar materials. The first metal object comprises an upper surface and a lower surface. The method comprises: positioning the first metal object in intimate contact with the second metal object such that the second metal object is in contact with the lower surface of the first metal object; identifying at least one attachment location on the upper surface of the first metal object where the first metal object is in intimate contact with the second metal object; adding a powdered metal on the upper surface of the first metal object at the at least one attachment location; and firing a heat source at the powdered metal to melt the powdered metal and drive the melted powdered metal through the first metal object and into the second metal object.