MANUFACTURING OF HIGH TRANSPARENT ARTICLES USING FDM 3D PRINTING

    公开(公告)号:US20250042082A1

    公开(公告)日:2025-02-06

    申请号:US18719670

    申请日:2022-12-15

    Inventor: Haifeng SHAN

    Abstract: A fused filament fabrication 3D printing method for fabricating an optical article includes applying a surface treatment (1710) to a building plate; heating the building plate to a predetermined plate temperature (1720); dispensing a thermoplastic through a nozzle set at a predetermined nozzle temperature onto the building plate (1730) while translating the nozzle or the building plate according to a first predetermined pattern at a predetermined printing speed to form a first layer; and solidifying the first layer, wherein a range of the predetermined plate temperature is between 30° C. lower than a glass transition temperature of the thermoplastic and 20° C. higher than the glass transition temperature of the thermoplastic, and a range of the predetermined nozzle temperature is at least 100° C. higher than the glass transition temperature of the thermoplastic, and at least 50° C. lower than a degradation temperature of the thermoplastic.

    Methods for Designing and Manufacturing a Flat Device

    公开(公告)号:US20250001673A1

    公开(公告)日:2025-01-02

    申请号:US18749846

    申请日:2024-06-21

    Abstract: A method for designing a flat device to be thermoformed into a shape-retaining non-flat device using a mold is provided. The flat device comprises two concentric annular layers: a carrier layer, having an outer radius (RCout) and a carrier layer width (WC); and a support layer having a support layer width (WS). The support layer is mechanically attached to the carrier layer wherein an inner distance (GAP) is formed between an inner edge of the carrier layer and an inner edge of the support layer. The method comprises obtaining predetermined values for the outer radius of the carrier layer, the support layer width and the inner distance, obtaining a geometry of the mold, and obtaining material properties of the support layer and the carrier layer. The method further comprises performing at least two simulations of thermoforming a simulated flat device into a non-flat device using the mold, based on the obtained predetermined values, material properties, and geometry of the mold for at least two different carrier layer widths. The method further comprises determining a circumferential strain at an outer edge of the support layer in each of the simulated non-flat devices. The method further comprises determining, based on the determined circumferential strains, a linear relation between the circumferential strain and a dimension ratio defined by ratio = ( W C - ( W S + GAP ) ) / R Cout . The method further comprises determining (1070), based on the determined linear relation, a value (ratioMNB) of the dimension ratio for which the strain is zero and determining, from the dimension ratio for which the strain is zero, the width of the carrier layer in the flat device as W C = ratio * R Cout + W S + GAP .

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