公开(公告)号：US5837561A

公开(公告)日：1998-11-17

申请号：US862870

申请日：1997-05-23

Applicant: Fred A. Kish, Jr. ,  Richard P. Schneider, Jr.

Inventor： Fred A. Kish, Jr. ,  Richard P. Schneider, Jr.

IPC: H01L23/15 ,  H01L23/40 ,  H01L27/00 ,  H01L33/00 ,  H01S5/00 ,  H01S5/02 ,  H01S5/026 ,  H01S5/183 ,  H01S5/323 ,  H01S3/043

CPC classification number: H01S5/0217 ,  H01S5/183 ,  H01S5/0215 ,  H01S5/0224 ,  H01S5/024 ,  H01S5/0264 ,  H01S5/18305 ,  H01S5/18308 ,  H01S5/1838 ,  H01S5/18388 ,  H01S5/32341

Abstract: A method for fabricating transparent substrate vertical cavity surface emitting lasers ("VCSEL"s) using wafer bonding is described. The VCSELs have their active layers located much more closely to a heat sink than is possible in known absorbing substrate VCSELs. The improved heat transport from the active layer to the heat sink permits higher current operation with increased light output as a result of the lower thermal impedance of the system. Alternatively, the same light output can be obtained from the wafer bonded VCSEL at lower drive currents. Additional embodiments use wafer bonding to improve current crowding, current and/or optical confinement in a VCSEL and to integrate additional optoelectronic devices with the VCSEL.

Abstract translation: 描述了使用晶片接合制造透明衬底垂直腔表面发射激光器（“VCSEL”）的方法。 与已知的吸收衬底VCSEL中可能的VCSELs相比，它们的有源层比散热器更靠近散热器。 由于系统的较低的热阻抗，从有源层到散热器的改进的热传输允许更高的电流操作，增加的光输出。 或者，可以在较低驱动电流下从晶片结合的VCSEL获得相同的光输出。 另外的实施例使用晶片接合来改善VCSEL中的电流拥挤，电流和/或光限制并且将附加光电器件与VCSEL集成。

公开(公告)号：US5783477A

公开(公告)日：1998-07-21

申请号：US835948

申请日：1997-04-14

Applicant: Fred A. Kish, Jr. ,  David A. Vanderwater

Inventor： Fred A. Kish, Jr. ,  David A. Vanderwater

IPC: H01L21/18 ,  H01L33/00 ,  H01L29/22

CPC classification number: H01L21/187 ,  H01L33/0079 ,  H01L2924/12041

Abstract: A method for forming an ohmic interface between unipolar (isotype) compound semiconductor wafers without a metallic interlayer and the semiconductor devices formed with these ohmic interfaces are disclosed. The ohmic interface is formed by simultaneously matching the crystallographic orientation of the wafer surfaces and the rotational alignment within the surfaces of the two wafers and then subjecting them to applied uniaxial pressure under high temperatures to form the bonded ohmic interface. Such an ohmic interface is required for the practical implementation of devices wherein electrical current is passed from one bonded wafer to another.

Abstract translation: 公开了一种在没有金属中间层的单极（同种型）化合物半导体晶片之间形成欧姆界面的方法以及用这些欧姆接口形成的半导体器件。 欧姆接口通过同时匹配晶片表面的晶体取向和两个晶片的表面内的旋转对准，然后在高温下施加单轴压力以形成接合的欧姆界面而形成。 这种欧姆接口对于其中电流从一个接合晶片传递到另一个的器件的实际实现是必需的。

公开(公告)号：US5661316A

公开(公告)日：1997-08-26

申请号：US718223

申请日：1996-09-20

Applicant: Fred A. Kish, Jr. ,  David A. Vanderwater

Inventor： Fred A. Kish, Jr. ,  David A. Vanderwater

IPC: H01L21/205 ,  H01L21/18 ,  H01L33/00 ,  H01S5/02 ,  H01S5/042 ,  H01L21/302

CPC classification number: H01L33/0062 ,  H01L21/187 ,  H01S5/0215 ,  H01S5/0421

Abstract: A method for forming an ohmic interface between unipolar (isotype) compound semiconductor wafers without a metallic interlayer and the semiconductor devices formed with these ohmic interfaces are disclosed. The ohmic interface is formed by simultaneously matching the crystallographic orientation of the wafer surfaces and the rotational alignment within the surfaces of the two wafers and then subjecting them to applied uniaxial pressure under high temperatures to form the bonded ohmic interface. Such an ohmic interface is required for the practical implementation of devices wherein electrical current is passed from one bonded wafer to another.

Abstract translation: 公开了一种在没有金属中间层的单极（同种型）化合物半导体晶片之间形成欧姆界面的方法以及用这些欧姆接口形成的半导体器件。 欧姆接口通过同时匹配晶片表面的晶体取向和两个晶片的表面内的旋转对准，然后使其在高温下施加单轴压力以形成结合的欧姆界面而形成。 这种欧姆接口对于其中电流从一个接合晶片传递到另一个的器件的实际实现是必需的。

公开(公告)号：US10012797B1

公开(公告)日：2018-07-03

申请号：US11045462

申请日：2005-01-27

Applicant: Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr. ,  Masaki Kato ,  Charles H. Joyner ,  David F. Welch ,  Randal A. Salvatore ,  Richard P. Schneider ,  Mehrdad Ziari ,  Damien Jean Henri Lambert ,  Sheila K. Hurtt ,  Andrew G. Dentai ,  Atul Mathur ,  Vincent G. Dominic

Inventor： Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr. ,  Masaki Kato ,  Charles H. Joyner ,  David F. Welch ,  Randal A. Salvatore ,  Richard P. Schneider ,  Mehrdad Ziari ,  Damien Jean Henri Lambert ,  Sheila K. Hurtt ,  Andrew G. Dentai ,  Atul Mathur ,  Vincent G. Dominic

IPC: G02B6/12 ,  G02B6/293

CPC classification number: G02B6/12004 ,  G02B6/12009 ,  G02B6/136 ,  H01S5/02248 ,  H01S5/026 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0683 ,  H01S5/1221 ,  H01S5/1231 ,  H01S5/34306 ,  H01S5/4012 ,  H01S5/4087

Abstract: A semiconductor monolithic transmitter photonic integrated circuit (TxPIC) comprises two different situations, either at least one signal channel in the PIC having a modulated source with the channel also extended to include at least one additional element or a plurality of modulated sources comprising N signal channels in the PIC of different transmission wavelengths, where N is equal to or greater than two (2), which may also approximate emission wavelengths along a standardized wavelength grid. In these two different situations, a common active region for such modulated sources and additional channel elements is identified as an extended identical active layer (EIAL), as it extends from a single modulated source to such additional channel elements in the same channel and/or extends to additional modulated sources in separate channels where the number of such channels is N equal to two or greater. The emission wavelength of laser sources in the modulated sources have different positively detuned offsets of the laser emission wavelength relative to the laser active region wavelength, i.e., (λL,i−λPL,L,j>0), and their emission wavelengths form a wavelength grid which may substantially conform to a standardized wavelength grid, such as the ITU grid. These laser sources in the modulated sources with an EIAL are preferentially detuned in the range, for example, of about 20 nm to about 70 nm, preferentially from about 25 nm to about 50 nm, from the active region wavelength of the modulated sources.

公开(公告)号：US20140003763A1

公开(公告)日：2014-01-02

申请号：US13537675

申请日：2012-06-29

Applicant: Radhakrishnan L. NAGARAJAN ,  Masaki Kato ,  Fred A. Kish, JR.

Inventor： Radhakrishnan L. NAGARAJAN ,  Masaki Kato ,  Fred A. Kish, JR.

IPC: G02B6/12

CPC classification number: G02B6/12 ,  G02B6/12014 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/126

Abstract: An optical device may include a slab, a first waveguide extending from a first portion of the slab to supply multiple first optical signals to the first portion of the slab, multiple second waveguides coupled to a second portion and to a third portion of the slab. The optical device may include multiple third waveguides provided extending from a fourth portion of the slab to direct a corresponding one of the multiple first optical signals away from the slab, a fourth waveguide extending from the fourth portion of the slab to supply multiple second optical signals to the fourth portion of the slab, and multiple fifth waveguides extending from the first portion of the slab to direct a corresponding one of the multiple second optical signals away from the slab. The optical device may include circuits to receive the first optical signals, the second optical signals, and local oscillator signals.

Abstract translation: 光学装置可以包括平板，从板的第一部分延伸的第一波导，以向板的第一部分提供多个第一光信号，多个第二波导耦合到板的第二部分和第三部分。 光学装置可以包括多个第三波导，其从板的第四部分延伸以将多个第一光信号中的相应一个引导离开板，第四波导从板的第四部分延伸以提供多个第二光信号 到板坯的第四部分，以及从板坯的第一部分延伸的多个第五波导，以将多个第二光信号中相应的一个引导离开板坯。 光学装置可以包括用于接收第一光信号，第二光信号和本地振荡器信号的电路。

公开(公告)号：US20130279911A1

公开(公告)日：2013-10-24

申请号：US13449532

申请日：2012-04-18

Applicant: Mehrdad Ziari ,  Scott Corzine ,  Masaki Kato ,  Michael Francis Van Leeuwen ,  Radhakrishnan L. Nagarajan ,  Matthew L. Mitchell ,  Fred A. Kish, JR.

Inventor： Mehrdad Ziari ,  Scott Corzine ,  Masaki Kato ,  Michael Francis Van Leeuwen ,  Radhakrishnan L. Nagarajan ,  Matthew L. Mitchell ,  Fred A. Kish, JR.

IPC: H04J14/06 ,  H01S3/30

CPC classification number: H04B10/2916 ,  H01S3/094073 ,  H01S3/302 ,  H01S5/005 ,  H01S5/4012

Abstract: A Raman pump may include a dual output laser configured to output two optical signals; a delay interferometer configured to delay a first of the two optical signals to decorrelate the two optical signals from each other; and a combiner configured to combine the delayed first of the two optical signals and a second of the two optical signals to provide a Raman amplification signal.

Abstract translation: 拉曼泵可以包括配置成输出两个光信号的双输出激光器; 延迟干涉仪被配置为延迟两个光信号中的第一个以将两个光信号相互去相关; 以及组合器，其被配置为组合两个光信号中延迟的第一个和两个光信号中的第二个，以提供拉曼放大信号。

公开(公告)号：US08548333B2

公开(公告)日：2013-10-01

申请号：US12753833

申请日：2010-04-02

Applicant: Radhakrishnan L. Nagarajan ,  Masaki Kato ,  Fred A. Kish, Jr. ,  David F. Welch ,  Charles H. Joyner

Inventor： Radhakrishnan L. Nagarajan ,  Masaki Kato ,  Fred A. Kish, Jr. ,  David F. Welch ,  Charles H. Joyner

IPC: H04B10/00

CPC classification number: H04J14/02 ,  H04B10/40 ,  H04J14/06

Abstract: The present invention provides for a transceiver comprising a transmitter portion and a receiver portion. The transmitter portion includes a laser, the laser providing an optical signal having one of a plurality of wavelengths. The optical signal from the laser is modulated to create a first wavelength-division multiplexed signal at an output of the transceiver. The optical signal from the laser is also used by a demultiplexer to demultiplexer a second wavelength-division multiplexed signal at an input of the transceiver. The use of the optical signal from the laser in both modulation and demodulation of wavelength-division multiplexed signals results in a transceiver having fewer discrete components resulting in a compact design and reduced costs.

Abstract translation: 本发明提供一种收发器，包括发射机部分和接收机部分。 发射机部分包括激光器，激光器提供具有多个波长中的一个的光信号。 来自激光器的光信号被调制以在收发器的输出处产生第一波分复用信号。 来自激光器的光信号也被解复用器使用，以在收发器的输入端解复用第二波分复用信号。 在波分复用信号的调制和解调中使用来自激光器的光信号导致具有较少分立组件的收发器，导致紧凑的设计并降低了成本。

公开(公告)号：US08521020B2

公开(公告)日：2013-08-27

申请号：US12795619

申请日：2010-06-07

Applicant: David F. Welch ,  Drew D. Perkins ,  Fred A. Kish, Jr. ,  Ting-Kuang Chiang

Inventor： David F. Welch ,  Drew D. Perkins ,  Fred A. Kish, Jr. ,  Ting-Kuang Chiang

IPC: H04B10/04 ,  H04B10/08

CPC classification number: H01S5/0265 ,  B82Y20/00 ,  G02B6/12021 ,  H01S5/026 ,  H01S5/0264 ,  H01S5/0268 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/3408 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/25 ,  H04B10/2914 ,  H04B10/50 ,  H04B10/675 ,  H04J14/02 ,  H04J14/0279

Abstract: A forward error correction (FEC) communication device that includes a transmitter photonic integrated circuit (TxPIC) or a receiver photonic integrated circuit (RxPIC) and a FEC device for FEC coding at least one channel with a first error rate and at least one additional channel with a second error rate, wherein the first error rate is greater than the second error rate. The TxPIC chip is a monolithic multi-channel chip having an array of modulated sources integrated on the chip, each operating at a different wavelength, wherein at least one of the modulated sources is modulated with a respective FEC encoded signal. The TxPIC also includes an integrated wavelength selective combiner for combining the channels for transport over an optical link.

Abstract translation: 包括发射机光子集成电路（TxPIC）或接收机光子集成电路（RxPIC）的前向纠错（FEC）通信设备和用于FEC编码具有第一错误率的至少一个信道和至少一个附加信道的FEC设备 具有第二错误率，其中第一错误率大于第二错误率。 TxPIC芯片是具有集成在芯片上的调制源阵列的单片多通道芯片，每个调制源阵列以不同的波长工作，其中至少一个调制源以相应的FEC编码信号进行调制。 TxPIC还包括用于组合用于光链路传输的信道的集成波长选择组合器。

公开(公告)号：US08184929B2

公开(公告)日：2012-05-22

申请号：US12345434

申请日：2008-12-29

Applicant: Fred A. Kish, Jr. ,  Charles H. Joyner ,  David F. Welch ,  Robert B. Taylor ,  Alan C. Nilsson

Inventor： Fred A. Kish, Jr. ,  Charles H. Joyner ,  David F. Welch ,  Robert B. Taylor ,  Alan C. Nilsson

IPC: G02F1/01 ,  G02B6/12 ,  G02B6/26

CPC classification number: G02B6/12033 ,  B82Y20/00 ,  G02B6/02204 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/124 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  H01S5/0085 ,  H01S5/024 ,  H01S5/02415 ,  H01S5/02453 ,  H01S5/02461 ,  H01S5/02476 ,  H01S5/026 ,  H01S5/0261 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0425 ,  H01S5/0612 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/0687 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/2214 ,  H01S5/2224 ,  H01S5/227 ,  H01S5/2272 ,  H01S5/2275 ,  H01S5/3408 ,  H01S5/34306 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/2914 ,  H04B10/50 ,  H04B10/506 ,  H04B10/572 ,  H04J14/02

Abstract: An optical transmitter comprises a monolithic transmitter photonic integrated circuit (TxPIC) chip that includes an array of modulated sources formed on the PIC chip and having different operating wavelengths approximating a standardized wavelength grid and providing signal outputs of different wavelengths. A wavelength selective combiner is formed on the PIC chip having a wavelength grid passband response approximating the wavelength grid of the standardized wavelength grid. The signal outputs of the modulated sources optically coupled to inputs of the wavelength selective combiner to produce a combined signal output from the combiner. A first wavelength tuning element coupled to each of the modulated sources and a second wavelength tuning element coupled to the wavelength selective combiner. A wavelength monitoring unit is coupled to the wavelength selective combiner to sample the combined signal output. A wavelength control system coupled to the first and second wavelength tuning elements and to said wavelength monitoring unit to receive the sampled combined signal output. The wavelength control system adjusts the respective wavelengths of operation of the modulated sources to approximate or to be chirped to the standardized wavelength grid and for adjusting the optical combiner wavelength grid passband response to approximate the standardized wavelength grid.

Abstract translation: 光发射机包括单片发射机光子集成电路（TxPIC）芯片，其包括形成在PIC芯片上的调制源的阵列，并且具有接近标准化波长网格并提供不同波长的信号输出的不同工作波长。 在具有近似于标准化波长网格的波长网格的波长网格通带响应的PIC芯片上形成波长选择性组合器。 调制源的信号输出光耦合到波长选择组合器的输入，以产生从组合器输出的组合信号。 耦合到每个调制源的第一波长调谐元件和耦合到波长选择组合器的第二波长调谐元件。 波长监测单元耦合到波长选择组合器以对组合的信号输出进行采样。 波长控制系统耦合到第一和第二波长调谐元件以及所述波长监视单元以接收采样的组合信号输出。 波长控制系统调整调制源的各个波长的波长近似于或被啁啾到标准化波长网格，并且用于调整光合并波长网格通带响应以近似标准化的波长网格。

公开(公告)号：US20110008039A1

公开(公告)日：2011-01-13

申请号：US12795619

申请日：2010-06-07

Applicant: David F. Welch ,  Drew D. Perkins ,  Fred A. Kish, JR. ,  Ting-Kuang Chiang

Inventor： David F. Welch ,  Drew D. Perkins ,  Fred A. Kish, JR. ,  Ting-Kuang Chiang

IPC: H04B10/04

CPC classification number: H01S5/0265 ,  B82Y20/00 ,  G02B6/12021 ,  H01S5/026 ,  H01S5/0264 ,  H01S5/0268 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/3408 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/25 ,  H04B10/2914 ,  H04B10/50 ,  H04B10/675 ,  H04J14/02 ,  H04J14/0279

Abstract: A forward error correction (FEC) communication device that includes a transmitter photonic integrated circuit (TxPIC) or a receiver photonic integrated circuit (RxPIC) and a FEC device for FEC coding at least one channel with a first error rate and at least one additional channel with a second error rate, wherein the first error rate is greater than the second error rate. The TxPIC chip is a monolithic multi-channel chip having an array of modulated sources integrated on the chip, each operating at a different wavelength, wherein at least one of the modulated sources is modulated with a respective FEC encoded signal. The TxPIC also includes an integrated wavelength selective combiner for combining the channels for transport over an optical link.

Abstract translation: 包括发射机光子集成电路（TxPIC）或接收机光子集成电路（RxPIC）的前向纠错（FEC）通信设备和用于FEC编码具有第一错误率的至少一个信道和至少一个附加信道的FEC设备 具有第二错误率，其中第一错误率大于第二错误率。 TxPIC芯片是具有集成在芯片上的调制源阵列的单片多通道芯片，每个调制源阵列以不同的波长工作，其中至少一个调制源以相应的FEC编码信号进行调制。 TxPIC还包括用于组合用于光链路传输的信道的集成波长选择组合器。