Abstract:
Disclosed is a paste for screen printing which is used in the fabrication of an anode functional layer, an electrolyte layer, or a cathode layer of an anode-supported solid oxide fuel cell. The paste contains a raw material powder, ethyl cellulose alpha terpineol, and an alcoholic solvent in which a thermosetting binder is soluble. Also provided is a method of fabricating an anode-supported solid oxide fuel cell using the paste. Thus, a reliable high-performance, large area solid oxide fuel cell that can be economically and efficiently fabricated is provided.
Abstract:
A flash memory cell string and a method of fabricating the same are provided. The flash memory cell string includes a plurality of cell devices and switching devices connected to ends of the cell devices. Each of the cell devices includes a semiconductor substrate, a tunneling insulating layer, a charge storage node, a control insulating layer, and a control electrode which are sequentially laminated on the semiconductor substrate. In each cell device, a source/drain region is not formed. The switching device does not include a source or drain region in a side connected to the cell devices. The switching device includes a source or drain region in the other side that is not connected to the cell devices. The source or drain region does or does not overlap the control electrode. Accordingly, it is possible to improve a miniaturization property and performance of NAND flash memory cell devices. If necessary, it is possible to electrically connect cells or cell strings by inducing an inversion layer through a fringing electric field from a control electrode.
Abstract:
Disclosed is an atmospheric pressure plasma apparatus for enhancing and or controlling the dissociation of a secondary gas by converting a source gas into a plasma state at atmospheric pressure and controlling the interaction between that plasma and the secondary gas using porous metal, and ceramic tubes to create a path having controllable isolation from the region where plasma is generated.
Abstract:
There are provided methods of fabricating a metal silicate layer on a semiconductor substrate using an atomic layer deposition technique. The methods include performing a metal silicate layer formation cycle at least one time in order to form a metal silicate layer having a desired thickness. The metal silicate layer formation cycle includes an operation of repeatedly performing a metal oxide layer formation cycle K times and an operation of repeatedly performing a silicon oxide layer formation cycle Q times. K and Q are integers ranging from 1 to 10 respectively. The metal oxide layer formation cycle includes the steps of supplying a metal source gas to a reactor containing the substrate, exhausting the metal source gas remaining in a reactor to clean the inside of the reactor, and then supplying an oxide gas into the reactor. The silicon oxide layer formation cycle includes supplying a silicon source gas, exhausting the silicon source gas remaining in the reactor to clean the inside of the reactor, and then supplying an oxide gas into the reactor.
Abstract:
A dielectric multilayer structure of a microelectronic device, in which a leakage current characteristic and a dielectric constant are improved, is provided in an embodiment. The dielectric multilayer structure includes a lower dielectric layer, which is made of amorphous silicate (M1-xSixOy) or amorphous silicate nitride (M1-xSixOyNz), and an upper dielectric layer which is formed on top of the lower dielectric layer and which is made of amorphous metal oxide (M'Oy) or amorphous metal oxynitride (M'OyNz).
Abstract:
A dielectric multilayer structure of a microelectronic device, in which a leakage current characteristic and a dielectric constant are improved, is provided in an embodiment. The dielectric multilayer structure includes a lower dielectric layer, which is made of amorphous silicate (M1-xSixOy) or amorphous silicate nitride (M1-xSixOyNz), and an upper dielectric layer which is formed on top of the lower dielectric layer and which is made of amorphous metal oxide (M′Oy) or amorphous metal oxynitride (M′OyNz).
Abstract:
Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still In still other example embodiments of the present invention, there may be a tin-bismuth (Sn—Bi) family alloy solder between a semiconductor chip and a substrate, and a semiconductor device using the alloy solder. The semiconductor device may include a semiconductor chip formed with a plurality of gold bumps, a substrate having metal wirings connected to the gold bumps, and a junction including a tin-bismuth family alloy solder interposed between and connecting the gold bump and the metal wiring.
Abstract:
An apparatus and a method for canceling interference based on Maximum Likelihood (ML) at a receiver of a multi-antenna system are provided. The method includes estimating a channel using a signal received over one or more receiver antennas; generating one or more weights using the estimated channel to cancel interference; detecting a candidate symbol having the shortest Euclidean distance through Maximum Likelihood using a first weight; and soft-decoding the candidate symbol using a second weight. Therefore, by receiving the signal based on the ML under the interference, the system capacity can be increased and the reception performance can be enhanced.
Abstract:
Disclosed herein is a one-transistor (1T) floating-body Dynamic Random Access Memory (DRAM) cell device with a non-volatile function for implementing the high integration/high performance DRAM. The 1T floating-body DRAM cell device includes a floating body for storing information of the DRAM cell device, a source and a drain formed on respective sides of the floating body, a gate insulating layer formed on a top of the floating body, a gate electrode formed on a top of the gate insulating layer, a gate stack formed under the floating body and configured to have a charge storage node for storing electric charges, and a control electrode formed on a lower side of the gate stack or partially or completely surrounded by the gate stack. The DRAM cell device performs “write0” and “write1” operations or a read operation. The DRAM cell device performs a non-volatile program operation or a non-volatile erase operation.
Abstract:
A device includes a base substrate, a package including an encapsulated die, the package at least partially embedded in the base substrate, and a wiring portion on the package and extending across at least a portion of the base substrate adjacent to the package.