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254 条记录 (耗时 0.05 秒)

    WIRELESS MEASURING APPARATUS AND WIRELESS TEMPERATURE MEASUREMENT SYSTEM
    91.
    发明申请
    WIRELESS MEASURING APPARATUS AND WIRELESS TEMPERATURE MEASUREMENT SYSTEM 审中-公开
    无线测量设备和无线温度测量系统

    公开(公告)号：US20130003779A1

    公开(公告)日：2013-01-03

    申请号：US13518194

    申请日：2010-12-24

    申请人： Tsuguo Fukuda ,  Mitsuru Sato ,  Junichi Kojima ,  Yukinaga Koike

    发明人： Tsuguo Fukuda ,  Mitsuru Sato ,  Junichi Kojima ,  Yukinaga Koike

    IPC分类号： G01K11/22 ,  G01H13/00

    CPC分类号： G01K7/32 ,  G01K1/024

    摘要： There is provided a wireless measuring apparatus that efficiently measures the frequency characteristics of a sensor unit mounted on an object to be measured. The wireless measuring apparatus is a wireless measuring apparatus that measures the frequency characteristics of a sensor unit (10) mounted on an object (40) to be measured, including the sensor unit (10) having a piezo-resonator (11), an antenna (20) that forms a circuitry with the sensor unit (10), and a measuring element (30) that supplies high frequency electricity changed in different frequency to the circuitry and measures the frequency characteristics of the reflected electricity strength received from the circuitry.

    摘要翻译： 提供了一种无线测量装置，其有效地测量安装在被测量物体上的传感器单元的频率特性。 无线测量装置是测量安装在待测物体（40）上的传感器单元（10）的频率特性的无线测量装置，包括具有压电谐振器（11）的传感器单元（10），天线 （20），其形成具有所述传感器单元（10）的电路;以及测量元件（30），其向所述电路提供以不同频率改变的高频电力并测量从所述电路接收的反射电力的频率特性。

    Bonding Method and Bonded Body
    92.
    发明申请
    Bonding Method and Bonded Body 有权
    粘结方法和粘结体

    公开(公告)号：US20120315450A1

    公开(公告)日：2012-12-13

    申请号：US13533521

    申请日：2012-06-26

    申请人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

    发明人： Takatoshi Yamamoto ,  Mitsuru Sato ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

    IPC分类号： B32B37/12 ,  B32B3/10 ,  B32B37/06

    CPC分类号： C09J5/00 ,  C09J2205/31 ,  Y10T428/24851 ,  Y10T428/31663

    摘要： A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

    摘要翻译： 提供了通过接合膜将两个基底部件接合在一起的接合方法。 接合方法是通过接合膜将第一基底构件和第二基底构件接合在一起的接合体的形成方法。 接合方法包括：将含有由硅氧烷化合物构成的硅酮材料的液体材料涂覆在第一和第二基底构件中的至少一个的表面上，以在表面上形成液体涂层; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变成粘结膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

    Separating method of bonded body
    94.
    发明授权
    Separating method of bonded body 有权
    粘结体分离方法

    公开(公告)号：US08211259B2

    公开(公告)日：2012-07-03

    申请号：US12323562

    申请日：2008-11-26

    申请人： Mitsuru Sato ,  Takatoshi Yamamoto ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

    发明人： Mitsuru Sato ,  Takatoshi Yamamoto ,  Shintaro Asuke ,  Yoshiaki Mori ,  Kazuhiro Gomi

    IPC分类号： B29C65/00

    CPC分类号： B32B43/006 ,  B08B7/0057 ,  B09B5/00 ,  B32B37/06 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2310/0831 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1911 ,  Y10T156/1917

    摘要： A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.

    摘要翻译： 提供了一种接合体的分离方法，所述粘合体包括两个基底构件和接合膜，通过该接合膜将基底构件接合在一起，使得能够容易且有效地将接合体分离成两个原始基底构件。 此外，接合膜含有由硅氧烷化合物构成的硅酮材料。 分离方法包括：用接合膜制备粘合体; 并将能量分离到接合薄膜上，使得由于硅酮化合物的分子键的一部分断裂而在接合薄膜内产生裂纹，从而将粘合体分离成第一和第二基底部件。

    Nonvolatile semicondutor memory device and manufacturing method thereof
    95.
    发明申请
    Nonvolatile semicondutor memory device and manufacturing method thereof 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号：US20110287597A1

    公开(公告)日：2011-11-24

    申请号：US13064559

    申请日：2011-03-31

    申请人： Masaru Kito ,  Hideaki Aochi ,  Ryota Katsumata ,  Akihiro Nitayama ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Yasuyuki Matsuoka ,  Mitsuru Sato

    发明人： Masaru Kito ,  Hideaki Aochi ,  Ryota Katsumata ,  Akihiro Nitayama ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Yasuyuki Matsuoka ,  Mitsuru Sato

    IPC分类号： H01L29/788

    CPC分类号： H01L27/11582 ,  G11C16/0483 ,  H01L21/8221 ,  H01L27/0688 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11556 ,  H01L27/11573 ,  H01L27/11578

    摘要： A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.

    摘要翻译： 提供了具有新结构的非易失性半导体存储器件，其中以三维状态层叠存储单元，从而可以减小芯片面积。 本发明的非易失性半导体存储装置是具有串联连接有多个电可编程存储单元的多个存储串的非易失性半导体存储装置。 存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极（n是大于1的自然数）。 存储器串的第一或第n电极和存储器串的其它第一或第n电极分别是以二维状态扩展的第一或第n导体层。

    Solid-state imaging device
    96.
    发明授权
    Solid-state imaging device 有权
    固态成像装置

    公开(公告)号：US08017984B2

    公开(公告)日：2011-09-13

    申请号：US12323006

    申请日：2008-11-25

    申请人： Yoshiaki Kitano ,  Hideshi Abe ,  Jun Kuroiwa ,  Kiyoshi Hirata ,  Hiroaki Ohki ,  Nobuhiro Karasawa ,  Ritsuo Takizawa ,  Mitsuru Yamashita ,  Mitsuru Sato ,  Katsunori Kokubun

    发明人： Yoshiaki Kitano ,  Hideshi Abe ,  Jun Kuroiwa ,  Kiyoshi Hirata ,  Hiroaki Ohki ,  Nobuhiro Karasawa ,  Ritsuo Takizawa ,  Mitsuru Yamashita ,  Mitsuru Sato ,  Katsunori Kokubun

    IPC分类号： H01L31/113 ,  H01L27/146

    CPC分类号： H01L27/14601 ,  H01L27/14689 ,  H01L27/14806 ,  H04N5/335

    摘要： A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.

    摘要翻译： 具有这样一种结构的固态成像装置，该结构使得用于读取信号电荷的电极设置在构成像素的光接收传感器部分的一侧; 将预定的电压信号V施加到形成为覆盖除了光接收传感器部分之外的图像拾取区域的遮光膜; 第二导电型半导体区域形成在构成光接收传感器部分的光电转换区域的第一导电型半导体区域的表面上的中心; 并且在第一导电型半导体区域的电极侧的端部的表面上形成比第二导电型半导体区域的杂质浓度低的区域， 像素分离区域。

    Method of forming bonded body and bonded body
    97.
    发明授权
    Method of forming bonded body and bonded body 有权
    形成粘结体和粘结体的方法

    公开(公告)号：US07967185B2

    公开(公告)日：2011-06-28

    申请号：US12358531

    申请日：2009-01-23

    申请人： Mitsuru Sato ,  Takatoshi Yamamoto

    发明人： Mitsuru Sato ,  Takatoshi Yamamoto

    IPC分类号： B23K31/02

    CPC分类号： B32B37/12 ,  B32B37/24 ,  B32B2037/1223 ,  B32B2037/246 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/105 ,  B32B2309/12 ,  B32B2457/00 ,  Y10T428/12882

    摘要： A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted mainly of copper. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided.

    摘要翻译： 提供一种形成由第一基底构件，第二基底构件和第一接合膜构成的接合体的方法和设置在第一基底构件和第二基底构件之间的第二接合薄膜。 第一接合膜和第二接合膜主要由铜构成。 该方法包括：通过使用化学气相成膜法在第一基底构件上形成第一接合膜; 通过使用化学气相成膜法在第二基底构件上形成第二接合膜; 使形成在第一基底构件上的第一接合膜与形成在第二基底构件上的第二接合膜接触，使得第一接合膜面向第二接合膜; 并且向第一基底构件和第二基底构件施加压缩力，使得第一接合膜和第二接合膜接合在一起，从而获得接合体。 两个基底构件可以在低温下以高尺寸精度牢固有效地粘合在一起，并且在使用粘合体之后可以将两个基底构件彼此有效地分离（剥离）。 此外，还提供了粘合体。