公开(公告)号：US06830957B2

公开(公告)日：2004-12-14

申请号：US10452488

申请日：2003-05-30

申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Chih-Ming Huang

发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Chih-Ming Huang

IPC分类号： H01L2144

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3128 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of fabricating BGA (Ball Grid Array) packages is proposed, which utilizes a specially-designed carrier to serve as an auxiliary tool to package semiconductor chips on substrates. The carrier is formed with a plurality of cavities respective for receiving a substrate and in communication with an injection gate, such that no injection gate is required on the substrate, thereby not restricting the trace routability on the substrate. Moreover, a two-piece type of mold is allowed being used to form a number of encapsulation bodies at one time, making the fabrication more productive and cost-effective. Furthermore, the proposed BGA fabrication method can be implemented without having to provide an air outlet in the substrate but allows the resulted encapsulation body to be free of voids to assure the quality of the packages. The proposed BGA fabrication method is therefore more advantageous to use than the prior art.

摘要翻译： 提出了一种制造BGA（球栅阵列）封装的方法，该封装采用专门设计的载体作为将半导体芯片封装在衬底上的辅助工具。 载体形成有多个腔体，分别用于接收衬底并与注入栅极连通，使得在衬底上不需要注入栅极，从而不限制衬底上的迹线布线性。 此外，允许两件式的模具一次用于形成多个包封体，使得制造更加生产和成本有效。 此外，可以实现所提出的BGA制造方法，而不必在衬底中提供空气出口，但是允许所得到的封装体没有空隙以确保包装的质量。 因此，提出的BGA制造方法比现有技术更有利于使用。

公开(公告)号：US06784019B2

公开(公告)日：2004-08-31

申请号：US10219245

申请日：2002-08-15

申请人： Chien-Ping Huang

发明人： Chien-Ping Huang

IPC分类号： H01L2144

CPC分类号： B82Y15/00 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A stacked dual-chip semiconductor packaging technology is proposed for the packaging of two semiconductor chips in one single package unit. The proposed dual-chip semiconductor package is characterized by an intercrossedly-stacked dual-chip arrangement which is constructed on a specially-designed leadframe having a supporting frame; a die pad supported on the supporting frame and having a peripherally-located upper portion and a centrally-located downset portion; and a set of leads linked to the supporting frame and arranged around the die pad. By the proposed packaging technology, a first semiconductor chip is mounted within the downset portion of the die pad, while a second semiconductor chip is mounted on the upper portion of the die pad in an intercrossedly-stacked manner in relation to the first semiconductor chip. Compared to the prior art, the proposed technology allows the packaging process to be implemented in a less complex and more cost-effective manner. Moreover, since the underlying chip is attached to die pad, it allows an increased heat-dissipation efficiency to the semiconductor package.

摘要翻译： 提出了一种堆叠的双芯片半导体封装技术，用于在一个封装单元中封装两个半导体芯片。 所提出的双芯片半导体封装的特征在于跨交叠堆叠的双芯片布置，其构造在具有支撑框架的特殊设计的引线框架上; 支撑在所述支撑框架上并且具有外围定位的上部和位于中心的下降部分的管芯焊盘; 以及连接到支撑框架并且布置在管芯焊盘周围的一组引线。 通过提出的封装技术，将第一半导体芯片安装在芯片焊盘的压缩部分内，而第二半导体芯片相对于第一半导体芯片以交叉交叠的方式安装在芯片焊盘的上部。 与现有技术相比，所提出的技术允许以不那么复杂和更具成本效益的方式实现包装过程。 此外，由于底层芯片附接到管芯焊盘，因此允许对半导体封装件的散热效率提高。

公开(公告)号：US06753206B2

公开(公告)日：2004-06-22

申请号：US10289796

申请日：2002-11-07

申请人： Chien-Ping Huang ,  Lian-Cherng Chiang ,  Michael Chang

发明人： Chien-Ping Huang ,  Lian-Cherng Chiang ,  Michael Chang

IPC分类号： H01L2144

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48639 ,  H01L2224/48739 ,  H01L2224/48839 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A dual-chip integrated circuit package with unaligned chip arrangement and a method of manufacturing such a dual-chip integrated circuit package are provided. The dual-chip integrated circuit package includes a leadframe having a first set of leads and a second set of leads. The dual-chip integrated circuit package is used to pack two integrated circuit chips in an unaligned chip arrangement, in which the first integrated circuit chip is mounted to one side of the inner part of the first set of leads, and the second integrated circuit chip is mounted to the other side of the same in such a manner as to allow the bonding pads on the second integrated circuit chip to be positioned in the spacing formed between the two sets of leads. This unaligned chip arrangement can help facilitate the wire-bonding process for the bonding pads on the second integrated circuit chip. An encapsulant is used for encapsulating the first integrated circuit chip, the second integrated circuit chip, the first set of bonding wires, the second set of bonding wires, the inner part of the first set of leads, and the inner part of the second set of leads. The particular structure of the dual-chip integrated circuit package allows no restriction to the relative size between the two integrated circuit chips, thus allowing flexible selection for the combination of the two integrated circuit chips. Moreover, the dual-chip integrated circuit package can help save layout space on the circuit board and offers more functionality and storage capacity.

摘要翻译： 提供了具有未对准芯片布置的双芯片集成电路封装以及制造这种双芯片集成电路封装的方法。 双芯片集成电路封装包括具有第一组引线和第二组引线的引线框架。 双芯片集成电路封装用于以未对准的芯片布置来封装两个集成电路芯片，其中第一集成电路芯片安装在第一组引线的内部的一侧，第二集成电路芯片 以这样的方式安装到其另一侧，即允许第二集成电路芯片上的接合焊盘定位在两组引线之间形成的间隔中。 这种未对准的芯片布置可以帮助促进第二集成电路芯片上的焊盘的引线接合工艺。 密封剂用于封装第一集成电路芯片，第二集成电路芯片，第一组接合线，第二组接合线，第一组引线的内部和第二组的内部 的领导。 双芯片集成电路封装的特定结构不会限制两个集成电路芯片之间的相对尺寸，因此允许灵活选择两个集成电路芯片的组合。 此外，双芯片集成电路封装可以帮助节省电路板上的布局空间，并提供更多功能和存储容量。

公开(公告)号：US06677665B2

公开(公告)日：2004-01-13

申请号：US10092808

申请日：2002-03-06

申请人： Chien-Ping Huang

发明人： Chien-Ping Huang

IPC分类号： H01L23495

CPC分类号： H01L24/32 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/05613 ,  H01L2224/29007 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A dual-die integrated circuit package is provided, which can be used to pack two semiconductor dies in the same package unit. These two semiconductor dies are of the type having an array of bonding pads formed thereon. The dual-die integrated circuit package has a first leadframe and a second leadframe, each having a die pad and a plurality of leads, with the die pad being arranged at a different elevation with respect to the leads. The two semiconductor dies are mounted on the respective die pads of the two leadframes, with the bottom surface of each semiconductor die facing the bottom surface of the other, allowing the bottom surface of one semiconductor die to be separated from the die pad of the first leadframe and the bottom surface of the other semiconductor die to be separated from the die pad of the second leadframe. This dual-die integrated circuit package structure can help prevent the interface between the semiconductor die and the die pad from delamination and eliminate contamination to the semiconductor dies and also allows the manufacture to be more cost-effective to implement than the prior art.

摘要翻译： 提供了一种双管芯集成电路封装，可用于将两个半导体管芯封装在相同的封装单元中。 这两个半导体管芯具有形成在其上的接合焊盘阵列的类型。 双芯片集成电路封装具有第一引线框架和第二引线框架，每个引线框架和第二引线框架均具有管芯焊盘和多个引线，其中管芯焊盘相对于引线设置在不同的高度。 两个半导体管芯安装在两个引线框架的相应管芯焊盘上，每个半导体管芯的底表面面对另一个半导体管芯的底表面，允许一个半导体管芯的底表面与第一个半导体管芯的管芯焊盘分离 引线框架和另一半导体管芯的底表面与第二引线框架的管芯焊盘分离。 这种双管芯集成电路封装结构可以帮助防止半导体管芯和管芯焊盘之间的界面脱层，并且消除对半导体管芯的污染，并且还允许制造比现有技术更具成本效益。

公开(公告)号：US06657296B2

公开(公告)日：2003-12-02

申请号：US09962596

申请日：2001-09-25

申请人： Tzong-Da Ho ,  Chien-Ping Huang

发明人： Tzong-Da Ho ,  Chien-Ping Huang

IPC分类号： H01L2334

CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package is proposed, in which at least one chip is mounted on a substrate, and at least one die-attach region is formed on the substrate. A plurality of thermal vias formed in the die-attach region and penetrating the substrate, in a manner that the thermal vias each has a top end connected to the chip mounted on the substrate and a bottom end connected to a thermal pad formed beneath the substrate at a position corresponding to the die-attach region. The thermal pad has a surface directly exposed to the atmosphere, allowing heat generated by the chip to be dissipated through the thermal vias and the exposed surface of the thermal pad to the atmosphere, so as to significantly improve heat dissipating efficiency for the semiconductor package.

摘要翻译： 提出了一种半导体封装，其中至少一个芯片安装在基板上，并且在该基板上形成至少一个管芯附着区域。 形成在芯片附着区域中并穿透基板的多个热通孔以热通孔各自具有连接到安装在基板上的芯片的顶端和连接到形成在基板下方的热垫的底端 在与芯片附着区域对应的位置。 散热垫具有直接暴露在大气中的表面，允许由芯片产生的热量通过热通孔和散热垫的暴露表面散发到大气中，从而显着提高半导体封装的散热效率。

公开(公告)号：US06643919B1

公开(公告)日：2003-11-11

申请号：US09574869

申请日：2000-05-19

申请人： Chien-Ping Huang

发明人： Chien-Ping Huang

IPC分类号： H01R4300

CPC分类号： H01L23/49861 ,  B29C33/0044 ,  B29C39/10 ,  B29C45/14655 ,  B29L2031/3061 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49169 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device package fabrication method is proposed, which is used for the fabrication of a semiconductor device package of the type having a core-hollowed portion that is typically used to house an optically-sensitive semiconductor device such as an image sensor or an ultraviolet-sensitive EPROM (Electrically-Programmable Read-Only Memory) device. The proposed method is characterized in the use of a support pillar, which is positioned beneath the lead frame when the lead frame is clamped between a top inserted mold and a bottom cavity mold, to help prevent resin flash on the lead frame during the molding of the core-hollowed portion. As a result, the proposed method can help strengthen the bonding of the semiconductor device on the die pad as well as the wire bonding on the inner end of the finger portion of the lead frame, Moreover, since the making of the support pillar would be significantly cheaper and easier to implement than the use of an organic high-molecule coating and a solvent as in the case of the prior art flash prevention, the proposed method is more cost-effective and environmentally-friendly to use than the prior art.

摘要翻译： 提出了一种半导体器件封装制造方法，其用于制造具有芯空心部分的类型的半导体器件封装，该芯 - 中空部分通常用于容纳诸如图像传感器或紫外线照射的光敏半导体器件， 灵敏的EPROM（电可编程只读存储器）器件。 所提出的方法的特征在于当引线框架被夹持在顶部插入的模具和底部空腔模具之间时，位于引线框架下方的支撑柱的使用，以帮助防止在成型期间引线框架上的树脂闪光 芯 - 中空部分。 结果，所提出的方法可以有助于加强半导体器件在芯片焊盘上的接合以及引线框架的指状部分的内端上的引线接合。此外，由于支撑柱的制造将是 与使用现有技术闪光灯防止的情况相比，使用有机高分子涂层和溶剂显着地便宜且易于实现，所提出的方法比现有技术更具成本效益和使用环境友好性。

公开(公告)号：US06621150B1

公开(公告)日：2003-09-16

申请号：US10193530

申请日：2002-07-10

申请人： Yvonne Lee ,  Chien-Ping Huang ,  Han-Ping Pu

发明人： Yvonne Lee ,  Chien-Ping Huang ,  Han-Ping Pu

IPC分类号： H01L23495

CPC分类号： H01L23/4951 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2924/00

摘要： Conventional configuration of a lead frame, particularly a lead frame in a Lead-on-Chip package, is substituted by one having inward ends of leads thereof arranged in unprecedented ways, resulting in bigger gap between any two adjacent inward ends of inner leads, leading to bigger Inner Lead Pitch of a lead frame in which the space available is inherently limited. It is by the new configuration that an IC packaging process can be immunized against the difficulty resulting from too small Inner Lead Pitch of a lead frame, and the bottle neck in the process of packaging an IC subject to the tendency of minimizing the size of an IC can thus be overcome.

摘要翻译： 引线框架，特别是芯片上封装的引线框架的传统结构被以前所未有的方式布置的引线框架的内端置换为引线框架，导致内引线的任何两个相邻内端之间的间隙较大 到引脚框架的较大的内引脚间距，其中可用的空间固有地受到限制。 通过新的配置，IC封装过程可以免受针脚引起的内部引线间距太小的困难，并且在封装IC的过程中瓶颈处于使IC的尺寸最小化的趋势 因此可以克服IC。

公开(公告)号：US06583499B2

公开(公告)日：2003-06-24

申请号：US09861757

申请日：2001-05-21

申请人： Chien-Ping Huang ,  Tzong-Dar Her

发明人： Chien-Ping Huang ,  Tzong-Dar Her

IPC分类号： H01L23495

CPC分类号： H01L23/3114 ,  H01L23/49503 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A quad flat non-leaded package comprises: a die pad having a first upper surface and a corresponding first lower surface thereon a plurality of interlacing slots are formed, each of the interlacing slots extending to the edges of the die pad to form a plurality of island-like blocks; a plurality of leads disposed at the periphery of the die pad, wherein each of the leads has respectively a second upper surface and a corresponding second lower surface coplanar to the surface of the island-like blocks; a chip having an active surface and a corresponding back surface adhered onto the first upper surface of the die pad; and a molding compound encapsulating the chip, the second upper surface, the first upper surface and the interlacing slots while exposing the surface of the island-like blocks and the second lower surface of the leads.

摘要翻译： 四边形无铅包装包括：形成具有第一上表面和其上的对应的第一下表面的管芯焊盘，其上形成有多个交缠槽，每个交缠槽延伸到管芯焊盘的边缘以形成多个 岛状块 多个引线设置在管芯焊盘的周边，其中每个引线分别具有与岛状块的表面共面的第二上表面和相应的第二下表面; 芯片，其具有粘附到芯片焊盘的第一上表面上的活性表面和对应的背面; 以及在使岛状块的表面和引线的第二下表面暴露的同时封装芯片，第二上表面，第一上表面和交织槽的模塑料。

公开(公告)号：US06541854B2

公开(公告)日：2003-04-01

申请号：US09894884

申请日：2001-06-29

申请人： Chien-Ping Huang ,  Tzong-Dar Her

发明人： Chien-Ping Huang ,  Tzong-Dar Her

IPC分类号： H01L2334

CPC分类号： H01L21/568 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/18165 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2924/00 ,  H01L2224/45099

摘要： A super low profile package with high efficiency of heat dissipation comprises the substrate, the heat sink, the die, the wires and the plastic mold. The heat sink adheres to the ground ring by the extending part of the heat sink, and the first surface of the die adheres to the heat sink. In addition, the die is connected to the substrate by the wires, and the plastic mold encapsulates the die, the heat sink and the wires. The chip package according to the invention possesses the small size and high efficiency of heat dissipation; besides, it also decreases the production cost for eliminating the conventional procedures of taping and de-taping.

公开(公告)号：US06507121B2

公开(公告)日：2003-01-14

申请号：US09756086

申请日：2001-01-08

申请人： Chien-Ping Huang

发明人： Chien-Ping Huang

IPC分类号： H01L2348

CPC分类号： H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A solder ball array type package structure is able to control collapse. The package includes a substrate, a carrier, a plurality of dies, a molding compound and a plurality of solder balls. The substrate has at least one active surface. Pads are located on the first surface of the substrate. The carrier has at least an active surface and a back surface opposite the active surface. A plurality of dies are located on the back surface and the active surface of the carrier. The dies arranged on the active surface are electrically connected to the carrier by flip chip technology. A molding compound encapsulates on the back surface of the carrier to cover the dies on the back surface of the carrier. Solder balls having a base material are provided on the active surface of the carrier in array. At least three solder balls coated with the base material having a high melting-temperature core are further provided in the periphery of the array. The carrier is arranged such that the active surface faces the first surface of the substrate to allow each solder ball correspond to the one of the pads, respectively.