公开(公告)号：US09702821B2

公开(公告)日：2017-07-11

申请号：US14762415

申请日：2013-01-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Zhang-Lin Zhou ,  Lihua Zhao ,  Steven J. Barcelo ,  Zhiyong Li

IPC: B82Y15/00 ,  G01N21/64 ,  B82Y20/00 ,  B82Y40/00 ,  G01N21/65

CPC classification number: G01N21/648 ,  B82Y15/00 ,  B82Y20/00 ,  B82Y40/00 ,  G01N21/6428 ,  G01N21/658 ,  G01N2021/6441

Abstract: According to an example, methods for forming three-dimensional (3-D) nano-particle assemblies may include depositing surface-enhanced spectroscopy (SES) elements onto respective tips of nano-fingers, in which the nano-fingers are arranged in sufficiently close proximities to each other to enable the tips of groups of adjacent ones of the nano-fingers to come into sufficiently close proximities to each other to enable the SES elements on the tips to be bonded together when the nano-fingers are partially collapsed. The methods also include causing the nano-fingers to partially collapse toward adjacent ones of the nano-fingers to cause a plurality of SES elements on respective groups of the nano-fingers to be in relatively close proximities to each other and form respective clusters of SES elements, introducing additional particles that are to attach onto the clusters of SES elements, and causing the clusters of SES elements to detach from the nano-fingers.

公开(公告)号：US20160312037A1

公开(公告)日：2016-10-27

申请号：US15100603

申请日：2014-01-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lihua Zhao ,  Sivapackia Ganapathiappan ,  Yan Zhao ,  Krzysztof Nauka ,  Howard S. Tom ,  Hou T. Ng

IPC: C09D5/03 ,  B33Y10/00 ,  B33Y30/00 ,  G06F17/50 ,  B33Y70/00 ,  B33Y50/00 ,  C09D177/02 ,  C08J3/12 ,  B29C67/00 ,  B33Y50/02

CPC classification number: C09D5/031 ,  B29C64/00 ,  B29C64/165 ,  B29C64/386 ,  B29C64/40 ,  B29K2077/00 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/00 ,  B33Y50/02 ,  B33Y70/00 ,  C08J3/12 ,  C08J2377/02 ,  C08L77/02 ,  C08L77/06 ,  C08L101/00 ,  C08L2205/025 ,  C09D177/02 ,  G06F17/5009

Abstract: A polymeric powder composition for three-dimensional printing includes first, second, and third polymeric particles. The first particles, having a first average size, are present in an amount ranging from about 70 wt % to about 95 wt %. The second particles, having a second average size smaller than the first average size, are present in an amount ranging from about 0.5 wt % to about 21 wt %. The third particles, having a third average size smaller than the second average size, are present in an amount ranging from greater than 0 wt % up to about 21 wt %. Each of the first, second, and third average sizes independently ranges from 5 μm to about 100 μm. A sum of the fractional weight ratios of all of the polymeric particles in the polymeric powder composition equals

Abstract translation: 用于三维印刷的聚合物粉末组合物包括第一，第二和第三聚合物颗粒。 具有第一平均尺寸的第一颗粒以约70重量％至约95重量％的量存在。 具有小于第一平均尺寸的第二平均尺寸的第二颗粒以约0.5重量％至约21重量％的量存在。 具有小于第二平均尺寸的第三平均尺寸的第三颗粒以大于0重量％至约21重量％的量存在。 第一，第二和第三平均尺寸中的每一个独立地在5μm至约100μm的范围内。 聚合物粉末组合物中所有聚合物颗粒的分数重量比的总和等于

公开(公告)号：US12017406B2

公开(公告)日：2024-06-25

申请号：US17288552

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jarrid A. Wittkopf ,  Kristopher J. Erickson ,  Lihua Zhao

IPC: B29C41/22 ,  B29C64/112 ,  B29C64/165 ,  B29C70/88 ,  B33Y10/00 ,  B33Y70/00 ,  H01C17/065 ,  B29C35/08 ,  B29K105/16 ,  B29K505/00 ,  B29L31/34

CPC classification number: B29C64/165 ,  B29C70/882 ,  B33Y10/00 ,  B33Y70/00 ,  H01C17/06526 ,  B29C2035/0827 ,  B29C2795/005 ,  B29K2105/162 ,  B29K2505/00 ,  B29K2995/0005 ,  B29K2995/0006 ,  B29K2995/0007 ,  B29L2031/3406 ,  B29L2031/3487

Abstract: In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.

公开(公告)号：US11878346B2

公开(公告)日：2024-01-23

申请号：US16076159

申请日：2017-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  Thomas C. Anthony ,  Lihua Zhao

IPC: B22F10/16 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  B29C64/165 ,  B28B1/00 ,  C09D11/037 ,  C09D11/101 ,  B22F10/38 ,  B22F10/14 ,  B22F1/10 ,  B22F1/102 ,  B29K505/00 ,  B29K509/02 ,  B22F12/55

CPC classification number: B22F10/16 ,  B22F1/10 ,  B22F1/102 ,  B22F10/14 ,  B22F10/38 ,  B28B1/001 ,  B29C64/165 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D11/037 ,  C09D11/101 ,  B22F12/55 ,  B22F2302/45 ,  B29K2505/00 ,  B29K2509/02 ,  B22F2999/00 ,  B22F1/10 ,  B22F1/0545 ,  B22F2998/10 ,  B22F10/14 ,  B22F3/1021 ,  B22F3/10

Abstract: According to examples, an object may include a shell including a polymer binder and build material powder; and a core at least partially encompassed by the shell, the core including build material powder and a metal nanoparticle binder.

公开(公告)号：US11840016B2

公开(公告)日：2023-12-12

申请号：US17843222

申请日：2022-06-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Thomas C. Anthony ,  Lihua Zhao

IPC: B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/393 ,  B29C64/30 ,  B33Y40/20 ,  B29C71/00 ,  B29C71/02 ,  C23C18/16 ,  C25D5/56 ,  B22F10/14 ,  B29C64/112 ,  B22F10/50 ,  B22F10/62 ,  B22F10/64 ,  B29C70/88 ,  B29C64/336 ,  B33Y80/00 ,  B33Y99/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/28

CPC classification number: B29C64/165 ,  B22F10/14 ,  B22F10/50 ,  B22F10/62 ,  B22F10/64 ,  B29C64/112 ,  B29C64/30 ,  B29C64/336 ,  B29C64/393 ,  B29C70/882 ,  B29C71/0009 ,  B29C71/02 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20 ,  B33Y50/02 ,  C23C18/1603 ,  C25D5/56 ,  B22F10/12 ,  B22F10/18 ,  B22F10/28 ,  B29C2071/022 ,  B33Y99/00 ,  B22F2999/00 ,  B22F10/14 ,  B22F3/003 ,  B22F12/45 ,  B22F12/55 ,  B22F12/67 ,  B22F2998/10 ,  B22F10/14 ,  B22F3/10

Abstract: A device includes a coater, a dispenser, and a treatment portion. The coater is to coat, layer-by-layer, a build material relative to a build pad to form a 3D object. The dispenser is to at least dispense a fluid including a first at least potentially electrically conductive material in at least some selected locations of an external surface of the 3D object. The treatment portion is to treat the 3D object to substantially increase electrically conductivity on the external surface of the 3D object at the at least some selected locations.

公开(公告)号：US11833750B2

公开(公告)日：2023-12-05

申请号：US17047720

申请日：2018-09-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Adekunle Olubummo ,  Lihua Zhao ,  Aja Hartman

IPC: B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/268 ,  C08K5/17 ,  C08L63/00 ,  C08L77/04 ,  B29K63/00 ,  B29K77/00 ,  B29K105/00 ,  B29K105/24

CPC classification number: B29C64/165 ,  B29C64/268 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08K5/17 ,  C08L63/00 ,  C08L77/04 ,  B29K2063/00 ,  B29K2077/00 ,  B29K2105/0032 ,  B29K2105/24

Abstract: An example of a three-dimensional (3D) printing kit includes a build material composition, an epoxy agent to be applied to at least a portion of the build material composition during 3D printing, and a fusing agent to be applied to the at least the portion of the build material composition during 3D printing. The build material composition includes a polyamide having an amino functional group. The epoxy agent includes an epoxy having an epoxide functional group to react with the amino functional group of the polyamide in the at least the portion. The fusing agent includes an energy absorber.

公开(公告)号：US11787110B2

公开(公告)日：2023-10-17

申请号：US18113024

申请日：2023-02-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Adekunle Olubummo ,  Kyle Wycoff ,  Aja Hartman ,  Lihua Zhao

IPC: B29C64/165 ,  C08L77/02 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/04 ,  C08K5/00 ,  C09D177/02 ,  C09D7/63 ,  B29K63/00 ,  B29K101/12 ,  B33Y80/00 ,  B29K105/16 ,  B22F1/054

CPC classification number: C08L77/02 ,  B29C64/165 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/04 ,  C08K5/0091 ,  C09D7/63 ,  C09D177/02 ,  B22F1/054 ,  B29K2063/00 ,  B29K2101/12 ,  B29K2105/16 ,  B33Y80/00

Abstract: The present disclosure is drawn to multi-fluid kits for three-dimensional to printing, three-dimensional printing kits, and methods of making three-dimensional printed articles. In one example, a multi-fluid kit for three-dimensional printing can include a fusing agent, a first reactive agent, and a second reactive agent. The fusing agent can include water and a radiation absorber. The first reactive agent can include a first liquid vehicle and an epoxy compound having multiple epoxide groups. The second reactive agent can include a second liquid vehicle and an amine compound having multiple amino groups.

公开(公告)号：US11685114B2

公开(公告)日：2023-06-27

申请号：US17258315

申请日：2019-01-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher Erickson ,  Jarrid Wittkopf ,  Lihua Zhao

IPC: B29C64/188 ,  B29C64/393 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/264 ,  B29C64/209 ,  B29L31/34

CPC classification number: B29C64/188 ,  B29C64/165 ,  B29C64/209 ,  B29C64/264 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29L2031/34

Abstract: Some examples include an additive manufacturing system including a processor and a memory to store instructions. The instructions cause the processor to generate print data from received data related to a three-dimensional build object. The generated print data includes defined print data to dispensing a first agent at a build area of a build material layer, defined print data to selectively dispensing a second agent at a component receiving area within the build area of the build material layer, the second agent to locally reduce a viscosity of the build material at the component receiving area to a viscous state, and defined print data to position a component within the component receiving area at a time of the component receiving area being in a viscous state.

公开(公告)号：US11642853B2

公开(公告)日：2023-05-09

申请号：US17236698

申请日：2021-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Aja Hartman ,  Lihua Zhao

IPC: B29C64/393 ,  B29C64/165 ,  G01N25/72 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y10/00 ,  G01N21/00

CPC classification number: B29C64/393 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  G01N21/00 ,  G01N25/72

Abstract: In one example, an additive manufacturing process includes: making an object slice by slice, including dispensing a first quantity of each of multiple liquid functional agents on to a layer of fusable build material and then irradiating the layer of build material; while making the object, identifying a deviant region in a slice; and dispensing a second quantity different from the first quantity of at least one of the functional agents into a location corresponding to the deviant region.

公开(公告)号：US11565472B2

公开(公告)日：2023-01-31

申请号：US16098106

申请日：2016-07-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Lihua Zhao ,  Gary J. Dispoto

IPC: B29C64/393 ,  B33Y10/00 ,  B33Y80/00 ,  B29C70/88 ,  B29C64/336 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/153 ,  B29C64/165 ,  B29C64/10 ,  B29C64/106 ,  G01N27/00

Abstract: A 3D object is additively formed via arranging non-conductive material relative to a receiving surface. During additive formation of the 3D object, a conductive channel is formed as part of the 3D object. In some instances, non-destructive fracture sensing is performed via measurement of an electrical parameter of the conductive channel.