摘要:
Provided is a planar light source device, which comprises a light guide having at least one side end serving as a light incident side and having one surface serving as a light-emitting side, a light source disposed in the vicinity of the side end of the light guide, and a light reflector disposed on the other side opposite to the light-emitting side, and which is characterized in that the light guide is essentially formed of a polyolefin resin, the light reflector is also essentially formed of a polyolefin resin, and when a piece of the light reflector having a face size of 1.5 cm×1.5 cm is prepared, and it is pressed against the surface of the light guide with its reflective face being in contact with the surface of the light guide under a load of 135 g/cm2 thereto, and, in that condition, when it is reciprocated 10 times on the surface of the light guide to a width of 5 cm every time at a speed of 2.5 cm/sec, then the surface of the light guide is not substantially scratched by it. The planar light source device is characterized in that the light guide therein is hardly scratched and the device is lightweight.
摘要翻译:提供一种平面光源装置,其包括具有至少一个侧端用作光入射侧并具有一个表面用作发光侧的光导,设置在该光源的侧端附近的光源 导光体和配置在与发光侧相反的另一侧的光反射体,其特征在于,所述导光体基本上由聚烯烃树脂形成,所述光反射体也基本上由聚烯烃树脂形成,并且 当准备具有1.5cm×1.5cm面积的光反射体的一部分时,其反射面在135°的负载下与导光体的表面接触而被压靠在导光体的表面上 g / cm 2,并且在该条件下,每当以2.5cm / sec的速度每次在导光体的表面上往复运动10次至5cm的宽度时,则 导光体的表面基本上不划伤 由它编辑。 平面光源装置的特征在于,其中的导光体几乎不被划伤,并且该装置重量轻。
摘要:
6-trifluoromethyl-2-vinyloxy-4-oxatricyclo[4.2.1.03,7]nonan-5-one of the present invention is represented by the following formula (1). This compound can be produced by reacting 6-trifluoromethyl-2-hydroxy-4-oxatricyclo[4.2.1.03,7]nonan-5-one represented by the following formula (2) with a compound represented by the following formula (3a) or (3b), wherein Ra and Rb are each a hydrogen atom or a hydrocarbon group.
摘要:
A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.
摘要:
When input equipment is instructed by a remote control unit on the basis of a display of a monitor, a data signal is transmitted from a microcomputer of an AV amplifier to a microcomputer of a CD changer. When the signal is received by a microcomputer of the CD changer, display data is formed in the microcomputer of the CD changer on the basis of data in a memory and is outputted. In the AV amplifier, a switch is switched to the CD changer side. A cursor is formed by the microcomputer of the AV amplifer, the cursor and display data from the CD changer are synthesized by an image synthesizing circuit and displayed on the monitor. When an instruction is generated by the remote control unit on the basis of the display on the monitor, position coordinates of the cursor on the picture plane are generated from the microcomputer of the A/V amplifier to the microcomputer of the CD changer. On the basis of the display data and the position coordinates, the CD changer is controlled by its microcomputer. When a predetermined position on the picture plane is instructed by the remote control unit, the control is returned to the AV amplifier.
摘要:
An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.
摘要:
1-aminopropanediol-2,3 containing 2-aminopropanediol-1,3 of less than 0.30% by weight can be prepared by the present purification process, which comprises distilling a l-aminopropanediol-2,3 containing at least 0.3% of 2-aminopropanediol-1,3 based on the weight of 1-aminopropanediol-2,3 with a distillation column, said distillation column having low pressure loss.
摘要:
An illuminated sign board which comprises a film having printing, a frame, and a light source is described. The film is a semi-transparent film made of a stretched resin film containing a finely divided powder of a white inorganic material. The semi-transparent film satisfies the following requirements (1) to (4): (1) an opacity of from 40% to 70%; (2) a whiteness of from 80% to 100%; (3) a total light beam average reflectance of from 30 to 60%; and (4) a total light beam average transmittance of from 30% to 70%.
摘要:
A process for forming electrodes for semiconductor devices having a semiconductor substrate and an electrically conductive portion covered and protected by an electrically insulating coating. The process includes the steps of forming an electrically conductive film on the electrically insulating coating, forming an electrode to be connected to an external circuit on the electrically conductive film at a position overlying the electrically conductive portion by exposing portions of the electrically insulating coating and the first electrically conductive film to a converged ion beam, electrically connecting the electrode to the exposed portions of the electrically conductive film, and removing the portions of the electrically conductive film not covered by the electrode. As a result, the likelihood of breakdown of the internal circuit of the semiconductor device connected to the electrically conductive portion while the electrode is being formed is greatly reduced.
摘要:
A system for detecting the speed of an engine for a vehicle calculates the engine speed in accordance with a signal which is outputted from a main rotation sensor in accordance with the operation of the engine. In case the main rotation sensor is subjected to malfunction, the engine speed is calculated using a back-up signal. Namely, an auxiliary rotation sensor detects the rotation of a portion of a power transmission device. When the above portion of the power transmission device is connected to an output shaft of the engine, the signal from the auxiliary rotation sensor is used as the back-up signal. When the two are disconnected from each other, a signal, representing the condition of the operation of an actuator for controlling the amount of supply of fuel to the engine, is used as the back-up signal.
摘要:
A process for forming electrodes for semiconductor devices having a semiconductor substrate and an electrically conductive portion covered and protected by an electrically insulating coating. The process includes the steps of forming an electrically conductive film on the electrically insulating coating, forming an electrode to be connected to an external circuit on the electrically conductive film at a position overlying the electrically conductive portion by exposing portions of the electrically insulating coating and the first electrically conductive film to a converged ion beam, electrically connectig the electrode to the exposed portions of the electrically conductive film, and removing the portions of the electrically conductive film not covered by the electrode. As a result, the likelihood of breakdown of the internal circuit of the semiconductor device connected to the electrically conductive portion while the electrode is being formed is greatly reduced.