公开(公告)号：US06313812B1

公开(公告)日：2001-11-06

申请号：US08944961

申请日：1997-10-07

申请人： Shuichi Nagano ,  Akira Katsuyama ,  Hiroshi Koyama ,  Takashi Ishizuka ,  Keiichi Asakura ,  Takahiro Hirai ,  Masami Ishikawa ,  Hiroshi Masuda ,  Takashi Koya

发明人： Shuichi Nagano ,  Akira Katsuyama ,  Hiroshi Koyama ,  Takashi Ishizuka ,  Keiichi Asakura ,  Takahiro Hirai ,  Masami Ishikawa ,  Hiroshi Masuda ,  Takashi Koya

IPC分类号： G09G500

CPC分类号： G11B27/002 ,  G11B27/34 ,  G11B2220/2545 ,  H04B1/205 ,  H04N5/445 ,  H04N5/765

摘要： When input equipment is instructed by a remote control unit on the basis of a display of a monitor, a data signal is transmitted from a microcomputer of an AV amplifier to a microcomputer of a CD changer. When the signal is received by a microcomputer of the CD changer, display data is formed in the microcomputer of the CD changer on the basis of data in a memory and is outputted. In the AV amplifier, a switch is switched to the CD changer side. A cursor is formed by the microcomputer of the AV amplifer, the cursor and display data from the CD changer are synthesized by an image synthesizing circuit and displayed on the monitor. When an instruction is generated by the remote control unit on the basis of the display on the monitor, position coordinates of the cursor on the picture plane are generated from the microcomputer of the A/V amplifier to the microcomputer of the CD changer. On the basis of the display data and the position coordinates, the CD changer is controlled by its microcomputer. When a predetermined position on the picture plane is instructed by the remote control unit, the control is returned to the AV amplifier.

摘要翻译： 当遥控单元根据监视器的显示指示输入设备时，数据信号从AV放大器的微型计算机发送到CD换碟机的微型计算机。 当CD变换器的微型计算机接收到信号时，根据存储器中的数据，在CD换碟机的微型计算机中形成显示数据，并输出。 在AV放大器中，开关切换到CD换碟机侧。 由AV放大器的微计算机形成光标，光标和来自CD换碟机的显示数据由图像合成电路合成并显示在监视器上。 当遥控器根据监视器上的显示产生指令时，从A / V放大器的微型计算机产生图形平面上光标的位置坐标到CD换碟机的微型计算机。 根据显示数据和位置坐标，CD换碟机由微机控制。 当由遥控单元指示画面上的预定位置时，控制返回到AV放大器。

公开(公告)号：US6034737A

公开(公告)日：2000-03-07

申请号：US916032

申请日：1997-08-21

申请人： Hiroshi Koyama ,  Hiroshi Masuda

发明人： Hiroshi Koyama ,  Hiroshi Masuda

IPC分类号： H04N5/44 ,  H04N5/60 ,  H04N5/765 ,  H04N5/775 ,  H04R3/12 ,  H04N7/00 ,  H04N11/00

CPC分类号： H04N5/765 ,  H04N21/4135 ,  H04N21/439 ,  H04N5/60 ,  H04N5/775

摘要： A TV set includes a tuner circuit that selects a channel and outputs video and audio signals from the channel, a first external output terminal for outputting the video signals a second external output terminal for outputting the audio signals a first external input terminal to which video signals are supplied from external AV devices, a first switch means for taking out video signals from the tuner circuit and video signals from the first external input terminal selectively, a second switch teamed with the first switch and taking out audio signals from the tuner circuit when the first switch selects the video signals from the tuner circuit, a display for displaying video signals output from the first switch as images, a speaker for outputting audio signals output from the second switch as sounds, and a control circuit for holding both first and second switches in the status for selecting video signals from the first external input terminal. When an AV amplifier is connected to this TV set, the AV amplifier is also connected to external AV devices and is used to carry out a processing for changing the sound fields of the audio signals supplied together with video signals both from the tuner circuit of the TV set and from the external AV devices.

摘要翻译： 电视机包括选择信道并从信道输出视频和音频信号的调谐器电路，用于向视频信号输出第二外部输出端的第一外部输出端，用于向音频信号输出音频信号的第一外部输入端，视频信号 从外部AV设备提供第一开关装置，用于选择性地从调谐器电路中取出视频信号和来自第一外部输入端的视频信号，第二开关与第一开关配合，并且当第二开关与第一开关配合时从调谐器电路中取出音频信号 第一开关选择来自调谐器电路的视频信号，用于显示从第一开关输出的视频信号作为图像的显示器，用于输出从第二开关输出的音频信号的扬声器作为声音;以及控制电路，用于保持第一和第二开关 处于用于从第一外部输入端子选择视频信号的状态。 当AV放大器连接到该电视机时，AV放大器还连接到外部AV设备，并且用于执行用于改变与视频信号一起提供的音频信号的声场的处理， 电视机和外部AV设备。

公开(公告)号：US20110099813A1

公开(公告)日：2011-05-05

申请号：US12674512

申请日：2008-10-02

申请人： Kazuto Kobayashi ,  Hiroshi Koyama

发明人： Kazuto Kobayashi ,  Hiroshi Koyama

IPC分类号： B21D53/10

CPC分类号： F16C33/64 ,  F16C19/186 ,  F16C2240/80 ,  F16C2326/02

摘要： A method for manufacturing a bearing ring member for a rolling bearing unit is provided. In this method, a blank hollow cylindrical portion having a smaller diameter than a hollow cylindrical portion is formed, the blank hollow cylindrical portion is radially expanded to form the hollow cylindrical portion, and a raceway surface is formed on either inner or outer circumferential surface of the hollow cylindrical portion along a circumferential direction thereof.

摘要翻译： 提供一种用于制造滚动轴承单元的轴承环构件的方法。 在该方法中，形成直径小于中空圆筒部的坯料中空圆筒部，使空心圆筒部径向膨胀，形成中空圆筒部，在内周面或外周面上形成有滚道面 中空圆筒部沿其圆周方向。

公开(公告)号：US20100101091A1

公开(公告)日：2010-04-29

申请号：US12522311

申请日：2008-01-16

申请人： Kazuto Kobayashi ,  Hiroshi Koyama

发明人： Kazuto Kobayashi ,  Hiroshi Koyama

IPC分类号： F16C33/64 ,  B21H1/12 ,  B21K1/04 ,  B21D53/12

CPC分类号： B23P15/003 ,  B21H1/12 ,  B21J1/00 ,  B21J1/04 ,  B21J5/02 ,  B21J5/10 ,  B21K1/04 ,  B21K21/02 ,  F16C19/184 ,  F16C33/62 ,  F16C33/64 ,  Y10T29/49636 ,  Y10T29/49643 ,  Y10T29/49689

摘要： Provided is a manufacturing method of an outer ring (3) of a back-to-back arrangement double-row angular ball bearing from a raw material (10) comprising a upsetting (A to B), a backward extrusion process (C to D), a punching (D to E), a rolling (E to F) and a finishing, wherein an outer diameter of a first intermediate material (11a) produced by the upsetting is equal to or smaller than an inside diameter of an inner periphery large diameter portion (18) of the inner circumference of a die (13) used in the backward extrusion process and larger than an inside diameter of an inner periphery small portion (19) of the die (13), and in a condition with the first intermediate material (11a) sitting on the inner periphery inclined portion (20) of the die (13), the intermediate material (11a) is pushed toward a base of the die (13) by a punch (14), to thereby the middle metal material (29) with the highest cleanliness of the raw material (10) is exposed to the two outer ring raceways (2) of the outer ring (3).

摘要翻译： 本发明提供从包括镦粗（A〜B），向后挤压工序（C〜D）的原料（10）的背靠背排列双列角球轴承的外圈（3）的制造方法 ），冲压（D〜E），轧制（E〜F）和精加工，其中通过镦锻制造的第一中间材料（11a）的外径等于或小于内周的内径 在向后挤压过程中使用的模具（13）的内周的大直径部分（18）大于模具（13）的内周小部分（19）的内径，并且在 第一中间材料（11a）位于模具（13）的内周倾斜部分（20）上，中间材料（11a）通过冲头（14）被推向模具（13）的基部，由此 原料（10）清洁度最高的中间金属材料（29）暴露于t的两个外圈滚道（2） 他外圈（3）。

公开(公告)号：US20080259473A1

公开(公告)日：2008-10-23

申请号：US11628075

申请日：2005-05-31

申请人： Takahiko Ueda ,  Hiroshi Koyama

发明人： Takahiko Ueda ,  Hiroshi Koyama

IPC分类号： G02B5/08

CPC分类号： G02B6/0055 ,  G02F1/133605 ,  Y10T428/24355

摘要： A light reflector including a laminate film having a light-diffusive layer on one surface of a substrate layer, wherein the surface roughness index of the light-reflective surface is at least 1, the reflectance thereof is at least 95%, and the regular reflectance thereof is at most 3%. The light reflector has higher brightness and higher reflectivity.

摘要翻译： 1.一种光反射器，包括在基板层的一个表面上具有光扩散层的层压膜，其中所述光反射表面的表面粗糙度指数至少为1，其反射率为至少95％，并且所述反射率为 至多3％。 光反射器具有更高的亮度和更高的反射率。

公开(公告)号：US20080246188A1

公开(公告)日：2008-10-09

申请号：US12078865

申请日：2008-04-07

申请人： Tsuyoshi Arai ,  Tadayoshi Takahara ,  Yoshihito Saigo ,  Tatsuya Inoyama ,  Hiroshi Koyama

发明人： Tsuyoshi Arai ,  Tadayoshi Takahara ,  Yoshihito Saigo ,  Tatsuya Inoyama ,  Hiroshi Koyama

IPC分类号： B29C45/00

CPC分类号： B29C45/76 ,  B29C2945/76588

摘要： The method of predicting the amount of deformation due to shrinkage of a molded article of the present invention finds a support point P of the bending moment M from a distribution of shrinkage rates of a molding material forming a molded article 10 and uses the support point P to predict the amount of deformation. At that time, it is preferable to use the support point P to find the bending moment M and to use the bending moment M to predict the amount of deformation.

摘要翻译： 由本发明的成形品收缩引起的变形量的预测方法根据成型品10的成形材料的收缩率的分布求出弯矩M的支撑点P，并使用支承点P 预测变形量。 此时，优选使用支撑点P来找到弯矩M，并且使用弯矩M来预测变形量。

公开(公告)号：US07344283B2

公开(公告)日：2008-03-18

申请号：US11282658

申请日：2005-11-21

申请人： Takahiko Ueda ,  Hiroshi Koyama ,  Tomotsugu Takahashi

发明人： Takahiko Ueda ,  Hiroshi Koyama ,  Tomotsugu Takahashi

IPC分类号： F21V7/22

CPC分类号： G02B6/0043 ,  G02B1/105 ,  G02B1/14 ,  G02B5/0808 ,  G02B5/0841 ,  G02B6/0055 ,  G02F1/133615 ,  G02F2201/34 ,  G09F13/14 ,  G09F13/18

摘要： Disclosed is a light reflector formed of a white polyolefin film which contains a polyolefin resin and a filler and is oriented at least monoaxially to have an areal draw ratio of from 1.3 to 80 times, which has a whole ray reflectance of at least 95% and undergoes a dimensional change of at most 1.5% when left at 70° C. for 300 hours, and which has a melting-starting temperature of 70° C. or higher. The light reflector hardly causes brightness unevenness of the planar light source when it is built in a planar light source device and used for a long period of time.

摘要翻译： 公开了一种由聚烯烃树脂和填料构成的白色聚烯烃膜形成的光反射体，其至少单轴取向，其面积拉伸比为1.3〜80倍，全光线反射率为95％以上， 当在70℃下放置300小时，其熔融起始温度为70℃以上时的尺寸变化为1.5％以下。 当平面光源内置在平面光源装置中并且长时间使用时，光反射器几乎不引起平面光源的亮度不均匀。

公开(公告)号：US07291302B2

公开(公告)日：2007-11-06

申请号：US11484577

申请日：2006-07-12

申请人： Hiroshi Koyama ,  Tetsuya Kuno

发明人： Hiroshi Koyama ,  Tetsuya Kuno

IPC分类号： B29C45/14

CPC分类号： B29C45/1671 ,  B29C45/0062 ,  B29C45/0416 ,  B29C45/162 ,  B29C45/2681 ,  B29C2045/0063 ,  B29L2023/22 ,  B29L2031/246 ,  B29L2031/601

摘要： A manufacturing method for a synthetic resin hollow molded body includes a first injection molding process, a positioning process and a second injection molding process in which each of the contact portions of the first split assembly member, second split assembly member, and the third split assembly member is made to contact the corresponding contact portion and each of the contact portions is joined with the corresponding contact portion by a second injection between the first die and the second die.

摘要翻译： 合成树脂中空成型体的制造方法包括第一注射成型工艺，定位工艺和第二注射成型工艺，其中第一分割组件部件，第二分割组件部件和第三分割组件中的每个接触部分 使第一模具和第二模具之间通过第二次注射将构件与对应的接触部分接触，并且每个接触部分与对应的接触部分接合。

公开(公告)号：US07091620B2

公开(公告)日：2006-08-15

申请号：US11116209

申请日：2005-04-28

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/50 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

公开(公告)号：US06923632B2

公开(公告)日：2005-08-02

申请号：US09955095

申请日：2001-09-19

申请人： Hiroshi Koyama ,  Tsutomu Onoue ,  Keigo Asano ,  Tadatsugu Nakamura ,  Izuru Shoji

发明人： Hiroshi Koyama ,  Tsutomu Onoue ,  Keigo Asano ,  Tadatsugu Nakamura ,  Izuru Shoji

IPC分类号： B29C33/02 ,  B29C33/12 ,  B29C45/14 ,  B29C45/73 ,  H01F41/12

CPC分类号： B29C45/73 ,  B29C45/14073 ,  B29C45/7337 ,  B29C2045/14852 ,  B29C2045/7343 ,  B29C2045/7356

摘要： An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.

摘要翻译： 插入件由可移动的保持构件保持在模具组内的空腔中。 当插入物被保持构件保持时，将熔融的树脂注入腔中。 保持构件在给定的时间与插入物分离。 保持构件的表面被加热到高于模具的内表面的温度的温度。 保持构件表面接触熔融树脂。 模具内表面暴露在空腔中。