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公开(公告)号:US20180182295A1
公开(公告)日:2018-06-28
申请号:US15387979
申请日:2016-12-22
Applicant: INTEL CORPORATION
Inventor: Khaled Ahmed , Prakash K. Radhakrishnan
IPC: G09G3/3241 , G09G3/3266 , G09G3/3283
CPC classification number: G09G3/3241 , G09G3/3233 , G09G3/3266 , G09G3/3283 , G09G2300/043 , G09G2300/0809 , G09G2300/0842 , G09G2320/0646 , G09G2320/0666 , G09G2330/08
Abstract: In one example, a light-emitting diode display system includes one or more light-emitting diodes and a pixel driver circuit. The pixel driver circuit is to receive an input current, to produce a current that is dependent on the input current, and to provide the produced current to the one or more light-emitting diodes.
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公开(公告)号:US09992430B2
公开(公告)日:2018-06-05
申请号:US15184293
申请日:2016-06-16
Applicant: Intel Corporation
Inventor: Richmond Hicks , Khaled Ahmed
IPC: H01L21/00 , H04N5/33 , H04N5/374 , H04N9/04 , H01L27/146
CPC classification number: H04N5/332 , H01L27/14621 , H01L27/14685 , H04N5/374 , H04N9/045
Abstract: A per-pixel performance improvement is described for combined image sensor arrays that measure infrared and visible light. One embodiment is a method that includes forming an array of photodetectors on a silicon substrate, treating a subset of the photodetectors to improve sensitivity to infrared light, and finishing the photodetector array to form an image sensor.
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公开(公告)号:US09922592B2
公开(公告)日:2018-03-20
申请号:US14757637
申请日:2015-12-23
Applicant: Intel Corporation
Inventor: Kunjal Parikh , Khaled Ahmed , Prakash K. Radhakrishnan , Peter L. Chang , Ravi Ranganathan
CPC classification number: G09G3/32 , G09G3/2003 , G09G2300/0404 , G09G2310/08 , G09G2320/0242
Abstract: In one example, a method for controlling a display with a digital signal includes detecting a binary value from a timing controller, the binary value corresponding to a portion of an image to be displayed. The method can also include determining a previous binary value from the timing controller and calculating a difference between the binary value from the timing controller and the previous binary value from the timing controller. Furthermore, the method can include generating an encoded signal based on the difference and transmitting the encoded signal to a display panel.
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公开(公告)号:US20250160059A1
公开(公告)日:2025-05-15
申请号:US18508617
申请日:2023-11-14
Applicant: Intel Corporation
Inventor: Khaled Ahmed , Joshua Fryman , Junyi Qiu , Mozhgan Mansuri , James Jaussi
IPC: H01L33/10 , H01L25/075 , H01L33/32 , H01L33/62
Abstract: A micro-LED includes a light emitter between a pair of reflective metasurfaces formed from nanostructures. The metasurfaces have different levels of reflectivity, with one metasurface reflecting nearly all light, and the other metasurface allowing some light to pass through. The reflections of the light within the micro-LED result in an improved radiation recombination rate, which results in an increased modulation speed. In addition, the light emitted from the micro-LED has a relatively narrow divergence angle and narrow emission linewidth, making the micro-LED suitable for optical communications.
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公开(公告)号:US12094396B2
公开(公告)日:2024-09-17
申请号:US17127859
申请日:2020-12-18
Applicant: Intel Corporation
Inventor: Khaled Ahmed
IPC: G09G3/32 , H01L25/075 , H01L27/12 , H01L29/786
CPC classification number: G09G3/32 , H01L25/0753 , H01L27/1225 , H01L27/1255 , H01L29/78672 , H01L29/78681 , H01L29/7869 , G09G2300/0404 , G09G2300/0443 , G09G2310/0267 , G09G2310/0275
Abstract: A micro-LED display having a plurality of pixels arranged in a two-dimensional matrix, wherein an individual pixel of the plurality of pixels each includes a light-emission section and a drive circuit to drive the light-emission section. The drive section includes an in-pixel PWM circuitry to receive a sawtooth or triangular pulse and an electric potential based on an image signal voltage, and to output a current pulse based on a comparison of the sawtooth or triangular pulse and the electric potential. The in-pixel PWM circuitry includes at most 7 transistors. The micro-LED display includes is coupled to one or more circuitries coupled to the plurality of pixels to provide the sawtooth or triangular pulse and the electric potential.
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公开(公告)号:US11908687B2
公开(公告)日:2024-02-20
申请号:US17563968
申请日:2021-12-28
Applicant: Intel Corporation
Inventor: Khaled Ahmed , Anup Pancholi , John Heck , Thomas Sounart , Harel Frish , Sansaptak Dasgupta
IPC: H01L21/00 , H01L21/02 , H01L21/8234 , H01L21/8222
CPC classification number: H01L21/02458 , H01L21/02389 , H01L21/02452 , H01L21/8222 , H01L21/823418
Abstract: A device includes a layer including a first III-Nitride (III-N) material, a channel layer including a second III-N material, a release layer including nitrogen and a transition metal, where the release layer is between the first III-N material and the second III-N material. The device further includes a polarization layer including a third III-N material above the release layer, a gate structure above the polarization layer, a source structure and a drain structure on opposite sides of the gate structure where the source structure and the drain structure each include a fourth III-N material. The device further includes a source contact on the source structure and a drain contact on the drain structure.
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公开(公告)号:US20230204819A1
公开(公告)日:2023-06-29
申请号:US17561366
申请日:2021-12-23
Applicant: Intel Corporation
Inventor: Khaled Ahmed , Pooya Tadayon , Joshua B. Fryman , Sergey Yuryevich Shumarayev
CPC classification number: G02B1/002 , H01L25/167 , H04B10/502 , G02B5/04
Abstract: Technologies for chip-to-chip optical data transfer are disclosed. In the illustrative embodiment, microLEDs on a first chip are used to send data to microphotodiodes on a second chip. The beams from the microLEDs may be sent to the microphotodiodes using an optical bridge, microprisms, a channel through a substrate, a channel defined in a substrate, etc. The microLEDs may be used for high-speed data transfer with low power usage. A chip may include a relatively large number of microLEDs and/or microphotodiodes, allowing for a large bandwidth connection. MicroLEDs and microphotodiodes may be used to connect different parts of the same chip, different chips on the same package, different packages on the same device, or different chips on different devices.
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公开(公告)号:US11527515B2
公开(公告)日:2022-12-13
申请号:US17076689
申请日:2020-10-21
Applicant: Intel Corporation
Inventor: Khaled Ahmed , Kunjal Parikh
IPC: H01L25/075 , H01L33/32 , H01L33/24 , H01L33/06 , H01L27/14 , H01L27/15 , H01L33/60 , G06T19/00 , G09G5/10 , G09G5/377 , H01L33/40
Abstract: Emissive display devices having LED sources with super-lambertian radiation patterns. An exemplary emission source may have a half-emission-cone-angle of less than 40°. A system, such as an augmented reality display system, employing such an emissive display device may display a reduction in power of up to three times relative to LED sources with a lambertian radiation pattern. In some systems, such as augmented reality display systems, the optical path down stream of such an emissive display device may be simplified and/or dimensionally scaled, and/or manufactured to lower tolerances. For example, a discrete collimating lens may be eliminated from the optical path of such an emissive display device.
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公开(公告)号:US11430921B2
公开(公告)日:2022-08-30
申请号:US16717323
申请日:2019-12-17
Applicant: Intel Corporation
Inventor: Khaled Ahmed
Abstract: Apparatus, systems, methods, and articles of manufacture to generate, trap, and convert light using a micro light emitting diode (LED) or similar device are disclosed. An example apparatus includes a first mirror to reflect a first wavelength light and a second wavelength light. The example apparatus includes a micro LED on the first mirror, the micro LED to generate the first wavelength light. The example apparatus includes a quantum dot film on the micro LED, the quantum dot film to convert the first wavelength light to the second wavelength light. The example apparatus includes a second mirror on the quantum dot film, the second mirror to reflect the first wavelength light and transmit the second wavelength light.
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公开(公告)号:US11177243B2
公开(公告)日:2021-11-16
申请号:US15933163
申请日:2018-03-22
Applicant: Intel Corporation
Inventor: Khaled Ahmed , Anup Pancholi
Abstract: Micro light-emitting diode (LED) display fabrication and assembly are described. In an example, a micro-light emitting diode (LED) display panel includes a display backplane substrate having a plurality of metal bumps thereon. A plurality of LED pixel elements includes ones of LED pixel elements bonded to corresponding ones of the plurality of metal bumps of display backplane substrate. One or more of the plurality of LED pixel elements has a graphene layer thereon. The graphene layer is on a side of the one or more of the plurality of LED pixel elements opposite the side of the metal bumps.
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