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公开(公告)号：USD548740S1
公开(公告)日：2007-08-14
申请号：US29230382
申请日：2005-05-19
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公开(公告)号：US07193161B1
公开(公告)日：2007-03-20
申请号：US11356279
申请日：2006-02-15
申请人： Hem Takiar , Warren Middlekauff , Robert C. Miller
发明人： Hem Takiar , Warren Middlekauff , Robert C. Miller
IPC分类号： H01L23/28
CPC分类号： H01L23/49855 , H01L24/73 , H01L24/97 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , Y10T29/49171 , Y10T29/49172 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A single-lid flash memory card and methods of manufacturing same are disclosed. The single-sided lid flash memory card may be formed from a semiconductor package having two or more tapered, stepped or otherwise shaped edges capable of securing a single-sided lid thereon. The taper, step or other shape may be fabricated by various methods, including during the molding step or during the singulation step. A semiconductor package having shaped edges may be enclosed within an external lid to form a finished flash memory card. The lid may be applied to a single side of the semiconductor package by various processes, including over-molding, or by pre-forming the lid with interior edges to match the exterior edges of the semiconductor package, and then sliding the lid over the package to form a tight fit therebetween. The shaped edge of the semiconductor package effectively holds the lid securely on the memory card without any adhesives and prevents the lid from dislodging from the semiconductor package.
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公开(公告)号：US09337153B2
公开(公告)日：2016-05-10
申请号：US14008457
申请日：2011-12-16
申请人： Peng Fu , Shan Luo , Zhong Lu , Kaiyou Qian , Chin Tien Chiu , Cheeman Yu , Hem Takiar , Ye Bai
发明人： Peng Fu , Shan Luo , Zhong Lu , Kaiyou Qian , Chin Tien Chiu , Cheeman Yu , Hem Takiar , Ye Bai
IPC分类号： H01L23/552 , H01L21/56 , H01L23/433 , H01L23/00 , H01L25/065
CPC分类号： H01L23/552 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/4334 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2223/5442 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/1434 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.
摘要翻译： 公开了一种包括屏蔽电磁辐射和/或耗散热的金属层的存储器件，以及制造存储器件的方法。 金属层形成在金属层转移组件上。 将金属层转移组件和未封装的存储器件放置在模具中并封装。 在模塑料的包封和固化期间，金属层从屏蔽转移到封装的存储器件。
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公开(公告)号：US08659133B2
公开(公告)日：2014-02-25
申请号：US13220354
申请日：2011-08-29
CPC分类号： H01L23/49541 , H01L23/49548 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/48247 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1433 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.
摘要翻译： 公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 半导体封装包括引线框和固定到引线框的管芯焊盘的一个或多个半导体管芯。 引线框形成有多个电端子，其表面安装到主机PCB。 引线框还包括一个或多个延伸导线，其中至少一个包括导电岛，该导电岛用电端子表面安装到主机PCB。 岛屿有效地增加了封装内的数字端子，而不会增加封装的占位面积。
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95.发明授权公开(公告)号：US08461675B2
公开(公告)日：2013-06-11
申请号：US11301715
申请日：2005-12-13
申请人： Hem Takiar , Ken Jian Ming Wang , Chih-Chin Liao , Han-Shiao Chen
发明人： Hem Takiar , Ken Jian Ming Wang , Chih-Chin Liao , Han-Shiao Chen
CPC分类号： H05K3/242 , H01L21/4846 , H01L23/49838 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H05K3/0052 , H05K2201/09263 , H01L2924/00
摘要： A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
摘要翻译： 公开了半导体管芯衬底面板，其包括在面板上相邻的半导体封装轮廓之间的最小间隙宽度，同时确保电镀电端子的电隔离。 通过减小相邻封装轮廓之间的边界的宽度，在用于半导体封装的衬底面板上获得额外的空间。
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96.发明申请DISCRETE COMPONENT BACKWARD TRACEABILITY AND SEMICONDUCTOR DEVICE FORWARD TRACEABILITY 审中-公开离散组件后向跟踪和半导体器件的可追溯性公开(公告)号：US20130006564A1
公开(公告)日：2013-01-03
申请号：US13634068
申请日：2010-10-04
申请人： Didier Chavet , Cheeman Yu , Hem Takiar , Frank Lu , Chih-Chiang Tung , Jiaming Shi
发明人： Didier Chavet , Cheeman Yu , Hem Takiar , Frank Lu , Chih-Chiang Tung , Jiaming Shi
CPC分类号： H01L23/544 , H01L21/67294 , H01L22/12 , H01L2223/54406 , H01L2223/54413 , H01L2223/54433 , H01L2924/0002 , H01L2924/00
摘要： A system is disclosed for providing backward and forward traceability by a methodology which identifies discrete components (die, substrate and/or passives) that are included in a semiconductor device. The present technology further includes a system for generating a unique identifier and marking a semiconductor device with the unique identifier enabling the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of the semiconductor device.
摘要翻译： 公开了一种用于通过识别包括在半导体器件中的分立组件（裸片，衬底和/或无源）的方法来提供向后和向前可追溯性的系统。 本技术还包括用于产生唯一标识符和标记半导体器件的系统，该半导体器件具有能够使半导体器件以及该器件内的分立器件被跟踪并通过每个工艺进行跟踪并在半导体生产中测试的唯一标识符 设备。
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97.发明申请公开(公告)号：US20120146247A1
公开(公告)日：2012-06-14
申请号：US13265666
申请日：2011-06-08
申请人： Itzhak Pomerantz , Shiv Kumar , Robert Miller , Chin-Tien Chiu , Peng Fu , Cheeman Yu , Hem Takiar , Chih Chiang Tung , Kaiyou Qian , Rahav Yairi
发明人： Itzhak Pomerantz , Shiv Kumar , Robert Miller , Chin-Tien Chiu , Peng Fu , Cheeman Yu , Hem Takiar , Chih Chiang Tung , Kaiyou Qian , Rahav Yairi
IPC分类号： H01L23/28
CPC分类号： G06K19/07732 , H01L2924/0002 , H05K5/0278 , H01L2924/00
摘要： A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of a curable fluid such as glue or ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface.
摘要翻译： 公开了一种记录装置，其包括至少一个经过预处理的表面以粗糙化表面，以便在表面上更好地粘附可固化流体例如胶水或油墨。 存储器件的表面可以通过用激光在表面上刻划线或者通过用粒子喷射器形成离散的变形来预处理。 在封装过程中，通过在模板上提供粗糙图案也可以使表面粗糙化。 在另外的实施例中，表面可以被化学预处理以使表面粗糙化和/或增加表面的粘附能。
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公开(公告)号：US08129272B2
公开(公告)日：2012-03-06
申请号：US12493582
申请日：2009-06-29
申请人： Hem Takiar , Cheeman Yu , Ken Jian Ming Wang , Chin-Tien Chiu , Han-Shiao Chen , Chih-Chin Liao
发明人： Hem Takiar , Cheeman Yu , Ken Jian Ming Wang , Chin-Tien Chiu , Han-Shiao Chen , Chih-Chin Liao
IPC分类号： H01L21/44
CPC分类号： H01L25/0657 , H01L21/3205 , H01L23/04 , H01L23/3121 , H01L23/5386 , H01L24/48 , H01L24/64 , H01L24/65 , H01L2224/32145 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.
摘要翻译： 公开了一种加强的半导体管芯基板和封装。 衬底可以包括形成有非线性边缘的接触指状物。 向接触指边缘提供非线性轮廓减少了施加在半导体管芯上的机械应力，否则这些应力将以直接接触指的边缘发生。 衬底可以附加地或可选地包括从接触指一定角度延伸的电镀迹线。 以一定角度延伸，至少衬底边缘处的电镀迹线的端部被覆盖在半导体封装被封装的盖子的下方。 因此，当与主机设备一起使用时，避免了盖子下方的电镀痕迹的端部和主机设备的接触销之间的接触。
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公开(公告)号：US08053880B2
公开(公告)日：2011-11-08
申请号：US12489298
申请日：2009-06-22
申请人： Cheeman Yu , Chih-Chin Liao , Hem Takiar
发明人： Cheeman Yu , Chih-Chin Liao , Hem Takiar
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/3121 , H01L24/73 , H01L25/105 , H01L25/18 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/1064 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.
摘要翻译： 公开了一种包括多个堆叠的半导体封装的电子部件。 第一个这样的实施例包括用于电耦合堆叠的半导体封装的内部连接器。 第二个这样的实施例包括用于电耦合堆叠的半导体封装的外部连接器。
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公开(公告)号：US08008132B2
公开(公告)日：2011-08-30
申请号：US11966303
申请日：2007-12-28
IPC分类号： H01L21/00
CPC分类号： H01L23/49541 , H01L23/49548 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/48247 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1433 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.
摘要翻译： 公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 半导体封装包括引线框和固定到引线框的管芯焊盘的一个或多个半导体管芯。 引线框形成有多个电端子，其表面安装到主机PCB。 引线框还包括一个或多个延伸导线，其中至少一个包括导电岛，该导电岛用电端子表面安装到主机PCB。 岛屿有效地增加了封装内的数字端子，而不会增加封装的占位面积。
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