公开(公告)号：US20110109071A1

公开(公告)日：2011-05-12

申请号：US13003952

申请日：2009-07-16

申请人： Kazuhiro Onda ,  Nobuhiro Kawamoto ,  Itaru Genpei ,  Makoto Uchikawa ,  Takashi Kikuchi ,  Yukio Hiruta ,  Yuichi Saito

发明人： Kazuhiro Onda ,  Nobuhiro Kawamoto ,  Itaru Genpei ,  Makoto Uchikawa ,  Takashi Kikuchi ,  Yukio Hiruta ,  Yuichi Saito

IPC分类号： B60R21/16 ,  B23P11/00

CPC分类号： B60R21/23138 ,  B60R21/2338 ,  B60R21/239 ,  B60R2021/23146 ,  B60R2021/23382 ,  Y10T29/49826

摘要： An airbag for a vehicle, the airbag formed as a bag body by sewing together a base cloth, wherein the bag body is configured so that a direction in which the bag body unfolds expands from a base end side of the bag body to a tip end side, and, the bag body includes a tensional force providing mechanism generating a tensional force pulling an upper rim of the bag body toward an outer side by forming a tension line extending so as to cross with the direction in which the bag body unfolds, along a side surface of the bag body.

摘要翻译： 一种用于车辆的安全气囊，所述气囊通过将基布缝合在一起而形成为袋体，其中所述袋体构造成使得所述袋体展开的方向从所述袋体的基端侧扩展到所述顶端 并且袋体包括拉伸力提供机构，通过形成沿着袋体展开方向交叉延伸的张力线，从而产生张力，从而将袋体的上边缘向外侧拉动 袋体的侧面。

公开(公告)号：US20110089563A1

公开(公告)日：2011-04-21

申请号：US12900407

申请日：2010-10-07

申请人： Takashi Kikuchi ,  Tomoaki Hashimoto ,  Tatsuya Hirai

发明人： Takashi Kikuchi ,  Tomoaki Hashimoto ,  Tatsuya Hirai

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2224/03 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.

摘要翻译： 与微电脑芯片（半导体芯片）的焊盘（电极焊盘）电连接的端子（接合引线）配置在周边部分侧的焊盘上的凸起电极（导电部件）用密封树脂（密封体）密封。 此后，密封树脂被部分地研磨（去除），使得每个凸起电极的一部分露出。 在研磨步骤之后，执行从密封树脂的前表面突出每个凸起电极的一部分的步骤。

公开(公告)号：US20100266850A1

公开(公告)日：2010-10-21

申请号：US12746959

申请日：2008-12-03

申请人： Kanji Shimoohsako ,  Takashi Kikuchi ,  Takashi Ito ,  Shigeru Tanaka

发明人： Kanji Shimoohsako ,  Takashi Kikuchi ,  Takashi Ito ,  Shigeru Tanaka

IPC分类号： B32B27/34 ,  B32B9/04 ,  B05D3/02 ,  B05D3/12

CPC分类号： H05K3/387 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2203/1105 ,  Y10T428/31504

摘要： An object of the present invention is to improve, in a laminate and a flexible printed circuit board obtained using the laminate, (i) adhesiveness between a resin material and a plating layer and (ii) soldering heat resistance after moisture absorption. This object is attained by a method for producing a laminate including at least a polymer film, a to-be-plated layer containing at least a crystalline thermoplastic resin, and a plating layer, said method including the steps of: A) applying plating to a resin material including at least a polymer film and a to-be-plated layer containing at least a crystalline thermoplastic resin, in order to produce a laminate including at least the polymer film, the to-be-plated layer containing at least the crystalline thermoplastic resin, and a plating layer: and B) heating the laminate.

摘要翻译： 本发明的目的在于提高使用层叠体得到的层叠体和柔性印刷电路板，（i）树脂材料与镀层之间的粘合性，（ii）吸湿后的耐热性。 该目的通过一种用于制造至少包含聚合物膜，至少含有结晶热塑性树脂的镀覆层和镀层的层压体的方法来实现，所述方法包括以下步骤：A）将电镀施加到 至少包含聚合物膜和至少含有结晶热塑性树脂的被镀层的树脂材料，以便制造至少包含聚合物膜的层压体，至少含有晶体的结晶 热塑性树脂和镀层; B）加热层压体。

公开(公告)号：US20100244489A1

公开(公告)日：2010-09-30

申请号：US12730558

申请日：2010-03-24

申请人： Masamitsu Shiono ,  Kazuhiro Onda ,  Hitoshi Kato ,  Takashi Kikuchi

发明人： Masamitsu Shiono ,  Kazuhiro Onda ,  Hitoshi Kato ,  Takashi Kikuchi

IPC分类号： B62D25/20 ,  B62D25/00

CPC分类号： B62D25/20 ,  B60N2/4235 ,  B60N2/793

摘要： A reinforcing element structure placed between left and right seats. A reinforcing element comprises a pair of left and right side walls positioned so as to be disposed opposite from interior faces of a pair of left and right seats, and a reinforcing member for coupling the pair of left and right side walls. The pair of left and right side walls and the reinforcing member are jointly fastened to a tunnel section. A load that acts on the reinforcing element is transferred from one of the side walls to the other side wall via the reinforcing member. The load is withstood by a highly rigid reinforcing element constituted by the left and right side walls and the reinforcing member.

摘要翻译： 位于左右座椅之间的加固元件结构。 加强元件包括一对左右侧壁，其被定位成与一对左右座椅的内表面相对设置，以及用于联接该一对左右侧壁的加强构件。 一对左右侧壁和加强构件共同紧固到隧道部。 作用在增强元件上的负载经由加强构件从一个侧壁转移到另一侧壁。 负载由左右侧壁和加强构件构成的高刚性加强元件承受。

公开(公告)号：US07758948B2

公开(公告)日：2010-07-20

申请号：US11593523

申请日：2006-11-07

申请人： Shigenobu Suzuki ,  Nobuo Murota ,  Takashi Kikuchi ,  Hironori Hamazaki

发明人： Shigenobu Suzuki ,  Nobuo Murota ,  Takashi Kikuchi ,  Hironori Hamazaki

IPC分类号： B32B3/24 ,  E04B1/99

CPC分类号： B32B7/02 ,  B32B15/06 ,  F16F1/40 ,  F16F9/006 ,  F16F13/08 ,  F16F2224/04 ,  Y10T428/24339 ,  Y10T428/24942

摘要： A laminate support includes a layered elastic body structured by rigid plates, which have rigidity, and elastic plates, which have elasticity, being layered alternately in a predetermined layering direction, and a hollow portion is formed in the layered elastic body in the layering direction. A plastic fluid material structured by an elastic perfect plastic body (a non-hardening elastoplastic body) is placed-in the elastic body hollow portion of the layered elastic body. Further, a plurality of particle-shaped hard fillers, which are structured of a hard material which is considered to be a rigid body with respect to the plastic fluid material, are filled-in the plastic fluid material so as to be a predetermined volume fill rate. A laminate support, which can be disposed of or the like at a low cost and which can exhibit a large damping force, can be obtained.

摘要翻译： 叠层支撑体包括由具有刚性的刚性板构成的层状弹性体和具有弹性的弹性板，其在预定的层叠方向交替地分层，并且在分层弹性体中沿分层方向形成中空部分。 由弹性完美塑料体（非硬化弹性体）构成的塑料流体材料被放置在层状弹性体的弹性体中空部分中。 此外，由相对于塑料流体材料被认为是刚性体的硬质材料构成的多个颗粒状硬质填料填充在塑料流体材料中，以便成为预定体积填充物 率。 可以获得可以以低成本进行处置并且可以呈现大的阻尼力的层叠支撑件。

公开(公告)号：US20100143729A1

公开(公告)日：2010-06-10

申请号：US11989851

申请日：2006-07-26

申请人： Takashi Kikuchi ,  Hisayasu Kaneshiro ,  Shogo Fujimoto

发明人： Takashi Kikuchi ,  Hisayasu Kaneshiro ,  Shogo Fujimoto

IPC分类号： B32B15/088

CPC分类号： H05K1/0346 ,  C08G73/1067 ,  C08L79/08 ,  C23C14/205 ,  H05K1/024 ,  H05K1/0393 ,  H05K2201/0154 ,  Y10T428/31681

摘要： Disclosed is a flexible metal clad laminate plate with good appearance which can be manufactured by a metalizing method such as evaporation coating, sputtering or plating. The flexible metal clad laminate plate has a polyimide film. The polyamide film is produced by reacting an aromatic diamine with an aromatic acid dianhydride to produce a polyamide acid and then imidizing the polyamide. The polyamide film has (A) an inflexion point of the storage modulus falling within the range from 270 to 340° C., (B) the peak top of tan δ; (which is a value given by dividing the loss modulus by the storage modulus) falling within the range from 320 to 410° C., (C) the storage modulus at 400° C. falling within the range from 0.5 to 1.5 GPa, and (D) the storage modulus α1 (GPa) at the inflexion point and the storage modulus α2 (GPa) at 400° C. both falling within the range satisfying Formula (1) below 85≧{(α1−α2)/α1}×100≧70.  (Formula 1)

摘要翻译： 公开了一种具有良好外观的柔性金属包覆层压板，其可以通过诸如蒸发涂覆，溅射或电镀的金属化方法制造。 柔性金属包覆层压板具有聚酰亚胺膜。 通过使芳族二胺与芳香族酸二酐反应制造聚酰胺酸，然后使聚酰胺酰亚胺化来制造聚酰胺薄膜。 聚酰胺膜具有（A）储能模量的拐点在270〜340℃的范围内，（B）tanδ的峰顶; （其是通过将损耗模量除以储能模量给出的值）落在320至410℃的范围内，（C）在400℃下的储能模量落在0.5至1.5GPa的范围内，以及 （D）在屈服点处的储能模量α1（GPa）和在400℃下的储能模量α2（GPa）均低于满足式（1）的范围低于85≥{（α1-α2）/α1}× 100≧70。 （公式1）

公开(公告)号：US07639913B2

公开(公告)日：2009-12-29

申请号：US12190685

申请日：2008-08-13

申请人： Shigetoshi Nakamura ,  Takashi Kikuchi ,  Roshan Thapliya

发明人： Shigetoshi Nakamura ,  Takashi Kikuchi ,  Roshan Thapliya

IPC分类号： G02B6/26

CPC分类号： G02F1/065 ,  G02F2201/12 ,  G02F2201/50

摘要： An optical waveguide element includes: an optical waveguide including an organic non-linear optical material; a first electrode arranged on one surface side of the optical waveguide; a second electrode arranged on another surface side of the optical waveguide; a protective member disposed on the second electrode, the protective member including (i) a third electrode which is provided on a first surface of the protective member, the first surface facing the second electrode, the third electrode being electrically connected to the second electrode, (ii) a fourth electrode which is provided on a second surface of the protective member, the second surface opposing the first surface, and (iii) a conductive portion which penetrates through the protective member from the first surface to the second surface, and electrically connects the third electrode and the fourth electrode.

摘要翻译： 光波导元件包括：包括有机非线性光学材料的光波导; 布置在所述光波导的一个表面侧的第一电极; 布置在所述光波导的另一表面侧的第二电极; 设置在所述第二电极上的保护构件，所述保护构件包括（i）设置在所述保护构件的第一表面上的第三电极，所述第一表面面向所述第二电极，所述第三电极电连接到所述第二电极， （ii）设置在所述保护构件的第二表面上的第四电极，与所述第一表面相对的所述第二表面，以及（iii）从所述第一表面穿过所述保护构件到所述第二表面的导电部分， 连接第三电极和第四电极。

公开(公告)号：US20090155610A1

公开(公告)日：2009-06-18

申请号：US11991220

申请日：2006-09-01

申请人： Hisayasu Kaneshiro ,  Takashi Kikuchi ,  Takaaki Matsuwaki

发明人： Hisayasu Kaneshiro ,  Takashi Kikuchi ,  Takaaki Matsuwaki

IPC分类号： C09J7/02 ,  B32B27/34 ,  B32B15/08 ,  C09J179/08

CPC分类号： C09J179/08 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/281 ,  B32B27/34 ,  B32B2307/306 ,  B32B2307/51 ,  B32B2307/732 ,  B32B2457/08 ,  C09J7/20 ,  C09J7/25 ,  C09J2203/326 ,  C09J2479/08 ,  C09J2479/086 ,  H05K1/0346 ,  H05K1/036 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0154 ,  Y10T428/31721

摘要： It is an object of the present invention to provide a heat-resistant adhesive sheet for suppressing fluctuation in dimensional stability of a flexible printed board or, in particular, of a two-layer flexible printed board which has recently been increasingly demanded and which is required to be more highly heat-resistant and reliable. The foregoing problems can be solved by a heat-resistant adhesive sheet having a heat-resistant adhesive layer, containing a thermoplastic polyimide, which is provided on at least one surface of an insulating layer containing a non-thermoplastic polyimide, the heat-resistant adhesive sheet having a stretching of not more than 10 mm at one side thereof.

摘要翻译： 本发明的目的是提供一种用于抑制柔性印刷电路板的尺寸稳定性的波动的耐热粘合片，特别是近来越来越多地需要并且需要的两层柔性印刷电路板 具有更高的耐热性和可靠性。 上述问题可以通过具有耐热粘合剂层的耐热粘合剂层来解决，所述耐热粘合剂层包含热塑性聚酰亚胺，其设置在包含非热塑性聚酰亚胺的绝缘层的至少一个表面上，耐热粘合剂 在其一侧具有不超过10mm的拉伸的片材。

公开(公告)号：US07542341B2

公开(公告)日：2009-06-02

申请号：US11841265

申请日：2007-08-20

申请人： Takashi Kikuchi

发明人： Takashi Kikuchi

IPC分类号： G11C11/34

CPC分类号： G11C11/412 ,  G11C11/413

摘要： A nonvolatile semiconductor memory device includes a first latch to store data, a nonvolatile memory cell including two MIS transistors to store data as an irreversible change of transistor characteristics occurring in one of the two MIS transistors selected in response to the data stored in the first latch, a second latch to store data obtained by sensing a difference in the transistor characteristics between the two MIS transistors, a logic circuit to produce a signal indicative of comparison between the data of the first latch and the data of the second latch, and a control circuit configured to repeat a store operation storing data in the nonvolatile memory cell, a recall operation storing data in the second latch, and a verify operation producing the signal indicative of comparison until the signal indicates that the data of the first latch and the data of the second latch are the same.

摘要翻译： 非易失性半导体存储器件包括用于存储数据的第一锁存器，包括两个MIS晶体管的非易失性存储器单元，用于将数据存储为在响应于存储在第一锁存器中的数据选择的两个MIS晶体管之一中出现的晶体管特性的不可逆变化 用于存储通过感测两个MIS晶体管之间的晶体管特性的差异获得的数据的第二锁存器，产生指示第一锁存器的数据与第二锁存器的数据之间的比较的信号的逻辑电路，以及控制 电路，被配置为重复存储在非易失性存储单元中的数据的存储操作，存储第二锁存器中的数据的调用操作，以及产生指示比较的信号的校验操作，直到信号指示第一锁存器的数据和 第二个锁存器是相同的。

公开(公告)号：US20090011231A1

公开(公告)日：2009-01-08

申请号：US11664311

申请日：2005-09-29

申请人： Hisayasu Kaneshiro ,  Takashi Kikuchi

发明人： Hisayasu Kaneshiro ,  Takashi Kikuchi

IPC分类号： B32B15/04 ,  B32B7/12

CPC分类号： H05K1/0346 ,  C09J7/25 ,  C09J2479/086 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/2852 ,  Y10T428/31678

摘要： Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulting layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E′2/E′1 between the storage elasticity modulus E′1 at 25° C. and the storage elasticity modulus E′2 at 380° C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200° C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250° C. after heat treatment at 380° C. for 30 second under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.

摘要翻译： 公开了一种具有高尺寸稳定性的粘合膜，其可以适用于两层FPC。 具体地，公开了由绝缘层和布置在绝缘层的一侧或两侧上的粘合层构成的粘合片。 该粘合片的特征在于绝缘层在25℃下的储能弹性模量E'1与380℃下的储能弹性模量E'2之间的比率E'2 / E'1不大于 0.2，在100〜200℃下MD方向的热膨胀系数为5〜15ppm。其特征还在于，热处理后的粘合片的热膨胀系数在100〜250℃的变化 在拉伸方向下在380℃，30秒的拉伸下处理30秒，在拉伸方向垂直的方向不大于10ppm。