Abstract:
A multiple line grid (MLG) for use in a multiple line grid array(MLGA) packaging incorporates therein circuit elements, e.g., metal lines, resistors, capacitors, inductors, transistors or combinations thereof, with a view to reducing a size of a printed circuit board on which it is mounted. The MLGA package includes a semifinished package including a surface with a first metal pattern formed thereon for connecting a number of input/output terminals, a printed circuit board(PCB) including a top surface with a second metal pattern formed thereon according to the first metal pattern; and at least of a MLG which is disposed between the semifinished package and the PCB. The MLG includes a non-conductive body incorporated therein a plurality of circuit elements and multiple number of conductors in the form of a column. Each of the conductors is electrically isolated from each other and is electrically connected to the first and the second metal patterns.
Abstract:
A capacitor network has an uncomplicated construction enabling the capacitance of the capacitor network to be easily increased or decreased. The capacitor network has a plurality of component capacitors formed from two metallic foil layers on opposite sides of a printed circuit board interconnected by lines disposed on both sides of said printed circuit board. The component capacitors of the capacitor network are arranged into at least one series circuit section and at least one parallel circuit section. The series circuit section includes two or more component capacitor, each including at least one component capacitor, connected in series. The parallel circuit section includes two or more parallel-connected component capacitor circuits, each including at least one component capacitor.
Abstract:
A thick-film integrated circuit device comprises an insulating substrate, first and second conductors, formed on the insulating substrate by means of a thick-film forming method and spaced apart from each other, and a resistance-trimming resistor and a function-trimming resistor, both formed on the insulating substrate by means of the thick-film forming method. Both resistors are rectangular strips. The resistance-trimming resistor has two ends overlapping and thus electrically connected to the facing ends of the first and second conductors, respectively. The function-trimming resistor extends perpendicular to the second conductor, and has one end portion which extends at right angles to, overlaps and is therefore electrically coupled to the thin intermediate portion of the second conductor. A laser beam is applied onto the resistance-trimming resistor, while the resistance between those ends of the first and second conductors which face away from each other is being measured, thereby cutting a notch in the function-trimming resistor and thus greatly adjusting this resistance. A laser beam is applied onto the function-trimming resistor, thereby cutting a notch therein, cutting the resistor into two parts, and thus minutely adjusting the resistance between said ends of the first and second conductors.
Abstract:
A piggyback code switch which provides a unique digital code for various types of circuits, for example, garage door openers, load management control receivers, etc., is used with dual-in-line packaging diodes or resistor arrays in such a manner as to enable any combination of resistors or diodes to be pulled to a preselected voltage level and thus provide such circuits with a common starting code. A switch comprising an array of pins extending from a conductive base is placed atop a DIP network. Specific DIP resistors are shorted together by selectively removing the pins of the switch in accordance with a prearranged coding plan. This provides each circuit with a unique digital identification code.
Abstract:
A printed circuit board has temperature-stable electric components, such as resistance networks, disposed on the soldering side of the circuit board. The components mounted on the soldering side of the board are mounted as a unit containing the network, which unit has a recess which partially surrounds the solder connection location of the circuit board, at which point the unitary component is electrically and mechanically connected to the board. The recesses are beveled to facilitate solder flow, and cover approximately half of the connection location of the circuit board.
Abstract:
A functionally adjusted thick-film thermistor-resistor network having an accurately preselected electrical resistance and change of electrical resistance with temperature, and a method of forming the same. The network features a thermistor and/or a conductor segment contacting the thermistor having a plurality of parallel paths. Some of the paths preferably provide a different resistance change with temperature than others. A selected number of the parallel paths are severed during functional testing to adjust the thermistor to a preselected change in network resistance with change in temperature. The resistor is functionally adjusted in the usual manner to obtain the selected total network resistance value at room temperature.