公开(公告)号：US20100109821A1

公开(公告)日：2010-05-06

申请号：US12588955

申请日：2009-11-03

Applicant: Satoshi Takano

Inventor： Satoshi Takano

IPC: H01H50/04

CPC classification number: H01H50/047 ,  H01H50/14 ,  H01H2050/044 ,  H05K1/18 ,  H05K3/308 ,  H05K2201/10053 ,  H05K2201/10462 ,  H05K2201/10818

Abstract: An assembly including an electromagnetic relay and a circuit board. The electromagnetic relay includes a body having a lateral surface and a bottom surface, and a plurality of terminals protruding outward from the lateral surface of the body. The terminals respectively have distal portions extending beyond the bottom surface of the body. The circuit board is provided with a relay-mount surface. The electromagnetic relay is mounted on the relay-mount surface in an orientation such that the bottom surface of the body is opposed to the relay-mount surface, and the distal portions of the terminals being fixed to the circuit board. Each terminal is formed from a flat plate element and has a shape angled in a width direction of the flat plate element. The body has a height defined in a direction orthogonal to the relay-mount surface of the circuit board and corresponding to a length of a shortest edge of the lateral surface, the shortest edge being shorter than any of edges of the bottom surface.

Abstract translation: 包括电磁继电器和电路板的组件。 电磁继电器包括具有侧表面和底表面的主体，以及从主体的侧表面向外突出的多个端子。 端子分别具有延伸超出主体底表面的远端部分。 电路板设有继电器安装面。 电磁继电器以使得本体的底面与继电器安装面相对的方向安装在继电器安装面上，端子的前端部固定在电路基板上。 每个端子由平板元件形成，并且具有在平板元件的宽度方向上成角度的形状。 主体具有与电路板的继电器安装表面正交的方向上的高度，并且与侧表面的最短边缘的长度相对应，其最短边缘比底面的任何边缘短。

公开(公告)号：US20100103637A1

公开(公告)日：2010-04-29

申请号：US12607571

申请日：2009-10-28

Applicant: Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

Inventor： Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

IPC: H05K7/06

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Disclosed herein are a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 这里公开了印刷电路板（PCB）和包括该电路板的探针。 探头包括换能器，具有经由面对面接触与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。

公开(公告)号：US20100085125A1

公开(公告)日：2010-04-08

申请号：US12574006

申请日：2009-10-06

Applicant: Manabu Ito

Inventor： Manabu Ito

IPC: H03L1/04

CPC classification number: H03L1/04 ,  H03L1/022 ,  H05K1/0201 ,  H05K1/18 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2203/165

Abstract: A constant-temperature type crystal oscillator includes: a crystal unit; an oscillator output circuit; a temperature control circuit; and a circuit substrate, on which circuit elements are installed. A principal surface of the crystal unit is installed so as to face one side board plane of the circuit substrate with interposing a first heat conducting resin, and the heating resistors are installed to be thermally coupled to the crystal unit via a second heat conducting resin. The principal surface of the crystal unit adheres to the one side board plane of the circuit substrate with interposing the first heat conducting resin. The heating resistors are installed on the one side board plane of the circuit substrate so as to sandwich the lead wires including a portion between the pair of lead wires of the crystal unit, and the heating resistors surround an outer circumference of the crystal unit.

Abstract translation: 恒温型晶体振荡器包括：晶体单元; 振荡器输出电路; 温度控制电路; 以及电路基板，其上安装有电路元件。 通过插入第一导热树脂将晶体单元的主表面安装成面对电路基板的一个侧板平面，并且加热电阻器被安装成通过第二导热树脂热耦合到晶体单元。 晶体单元的主表面通过插入第一导热树脂粘附到电路基板的一个侧板平面。 加热电阻器安装在电路基板的一个侧板平面上，以将包括晶体单元的一对引线之间的部分的引线夹在一起，并且加热电阻器围绕晶体单元的外周。

公开(公告)号：US07658623B2

公开(公告)日：2010-02-09

申请号：US12254329

申请日：2008-10-20

Applicant: Po-Sheng Lee

Inventor： Po-Sheng Lee

IPC: H01R12/00

CPC classification number: H05K3/301 ,  H05K2201/10015 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: An electronic apparatus has an electronic component and a pin mount. The electronic component has a working surface and two pins protruding from the working surface and each pin being bent to form an L-shape with a proximal part and a distal part. The pin mount has a flat bottom, a rear, two through holes and two communicating recesses. The through holes are defined through the pin mount in parallel, are formed from the front to the rear and receiving the proximal parts of the pins. The communicating recesses are formed in parallel in the front from the through holes toward the bottom of the pin mount, communicate respectively with the through holes and receiving the distal parts of the pins. The pin mount immobilizes the electronic component to prevent the pins from being detached from the electronic component or the PCB to retain the lifetime of the pins.

Abstract translation: 电子设备具有电子部件和销安装件。 电子部件具有工作面和从工作面突出的两个销，每个销弯曲形成具有近端部分和远端部分的L形。 销安装座有一个平底，一个后部，两个通孔和两个连通的凹槽。 通孔平行地通过销安装件形成，从前到后形成并容纳销的近端部分。 连通凹部从前面的通孔朝向销安装座的底部平行地形成，分别与通孔连通并且接收销的远端部分。 引脚安装件固定电子部件，以防止引脚与电子部件或PCB分离，以保持引脚的寿命。

公开(公告)号：US07561442B2

公开(公告)日：2009-07-14

申请号：US11751227

申请日：2007-05-21

Applicant: Yasuyuki Fukumoto

Inventor： Yasuyuki Fukumoto

IPC: H05K7/02

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: An electronic component holder includes a holder body and a wire retaining portion. The holder body includes a plurality of first grooves formed in a top face of the holder body and a plurality of second grooves formed in a back face of the holder body. The first grooves and the second grooves are configured to receive a lead wire of an electronic component. The lead wire is configured to be bent to be disposed in one of the second grooves. The back face intersects with the top face. The wire retaining portion is provided to the holder body. The wire retaining portion is configured to engage the lead wire to retain the lead wire in the second grooves.

Abstract translation: 电子部件保持器包括保持器主体和电线保持部。 保持器本体包括形成在保持器主体的顶面中的多个第一槽和形成在保持器主体的后表面中的多个第二槽。 第一凹槽和第二凹槽构造成接收电子部件的引线。 引线被配置为弯曲以设置在第二凹槽中的一个中。 背面与顶面相交。 电线保持部设置在保持体上。 电线保持部分构造成接合引线以将导线保持在第二凹槽中。

公开(公告)号：US20080259580A1

公开(公告)日：2008-10-23

申请号：US11788702

申请日：2007-04-20

Applicant: Morris D. Stillabower ,  Sathur N. Venkatesan ,  Philip W. Wittmer

Inventor： Morris D. Stillabower ,  Sathur N. Venkatesan ,  Philip W. Wittmer

IPC: H05K3/30 ,  H05K7/00

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/0129 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10977 ,  H05K2203/1105 ,  Y10T29/4913

Abstract: A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.

Abstract translation: 一种用于稳定具有主体的电气部件和从主体突出并被接纳在限定在基板中的通孔中的电引线的方法，同时避免了在组装电气封装期间分配热熔粘合剂相关的缺点，包括提供 具有用于接收引线电气部件的引线的通孔的电路基板，提供具有主体的电气部件和从主体延伸的引线，将预成型的热熔粘合剂定位在电路基板上或电气部件上， 电气元件，使得引线延伸到通孔中，使得预成型的热熔性粘合剂位于电气部件的主体和基板之间并填充电气部件的主体之间的间隙，并且激活和固化热 - 熔融粘合剂以将电组件的主体牢固地粘附到基底上。

公开(公告)号：US07301531B2

公开(公告)日：2007-11-27

申请号：US10814147

申请日：2004-04-01

Applicant: Yung Fu Wu

Inventor： Yung Fu Wu

IPC: G09G5/08

CPC classification number: G06F3/0317 ,  H05K1/0274 ,  H05K1/18 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10462

Abstract: An optical mouse has a housing, a printed circuit board, a light source unit, a photodetector unit, a light-guiding unit and a lens unit. The light source unit has different colors of image light sources and is disposed on the printed circuit board. The light-guiding unit is arranged in the housing and adjacent to the light source unit for guiding a non-complementary color light relative to a reflection surface from one of the image light sources to the reflection surface. The lens unit is arranged in the housing and positioned below the photodetector unit for converging a reflected light reflected by the reflection surface into the photodetector unit. Furthermore, the optical mouse can be operated on various colors of reflection surfaces, and still retains better sensitivity.

Abstract translation: 光学鼠标具有壳体，印刷电路板，光源单元，光电检测器单元，导光单元和透镜单元。 光源单元具有不同的图像光源颜色，并且布置在印刷电路板上。 导光单元布置在壳体中并且与光源单元相邻，用于相对于从图像光源中的一个到反射表面的反射表面引导非互补色光。 透镜单元布置在壳体中并且位于光电检测器单元下方，用于将由反射表面反射的反射光会聚到光电检测器单元中。 此外，光学鼠标可以以各种颜色的反射表面操作，并且仍然保持更好的灵敏度。

公开(公告)号：US20070222057A1

公开(公告)日：2007-09-27

申请号：US11388536

申请日：2006-03-23

Applicant: Yin Lai ,  Benjamin Selvaraj ,  Gangadevi Payedathaly

Inventor： Yin Lai ,  Benjamin Selvaraj ,  Gangadevi Payedathaly

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H05K3/3442 ,  H01C1/02 ,  H01C1/148 ,  H01C7/001 ,  H05K2201/10462 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: Embodiments of the present invention provide an apparatus, a system, and a method, and include a generally rectilinear body having a first surface and a second surface. The second surface is substantially perpendicular to the first surface. An electrically operative element is disposed on the first surface, and has opposite ends. Spaced apart terminations are disposed on the second surface, and are electrically coupled with the opposite ends of the electrically operative element. The terminations are designed to be coupled with a substrate.

Abstract translation: 本发明的实施例提供了一种装置，系统和方法，并且包括具有第一表面和第二表面的大致直线的主体。 第二表面基本上垂直于第一表面。 电操作元件设置在第一表面上，并具有相对端。 间隔开的终端设置在第二表面上，并且与电操作元件的相对端电耦合。 端子被设计成与衬底耦合。

公开(公告)号：US20070114638A1

公开(公告)日：2007-05-24

申请号：US11309215

申请日：2006-07-13

Applicant: Ling-Ling Shen

Inventor： Ling-Ling Shen

IPC: H01L23/495

CPC classification number: H05K1/0243 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10075 ,  H05K2201/10287 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10969 ,  H01L2924/00

Abstract: A printed circuit board with a quartz crystal oscillator includes a mounting area for receiving the quartz crystal oscillator, two first vias, and two second vias. A copper foil is arranged on the mounting area. Pins of the quartz crystal oscillator are inserted into the first vias. The second vias are connected to a ground layer of the PCB and communicate with the copper foil, for transmitting noise of the quartz crystal oscillator to the ground layer of the PCB.

Abstract translation: 具有石英晶体振荡器的印刷电路板包括用于接收石英晶体振荡器的安装区域，两个第一通孔和两个第二通孔。 铜箔布置在安装区域上。 将石英晶体振荡器的引脚插入第一通孔中。 第二通孔连接到PCB的接地层，并与铜箔连通，将石英晶体振荡器的噪声传递到PCB的接地层。

公开(公告)号：US07061361B2

公开(公告)日：2006-06-13

申请号：US10768066

申请日：2004-02-02

Applicant: Haruo Koizumi ,  Makoto Onozawa

Inventor： Haruo Koizumi ,  Makoto Onozawa

IPC: H01F5/00

CPC classification number: H05K1/18 ,  H01F5/003 ,  H01F17/0033 ,  H01F27/22 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/165 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A circuit board assembly has a flat coil element mounted on a circuit board so that an electric power loss is not generated even when the flat coil element is mounted to the circuit board together with a circuit part having a large heat sink. A module mounted on the circuit board has an electronic circuit device and a heat radiator attached to the electronic circuit device. The heat radiator has an extending part protruding from the electronic circuit device and extending parallel to a surface of the circuit board. A coil mounting area provided with no pattern wire is formed in a part of the circuit board facing the extending part. The flat coil element is mounted parallel to the circuit board in a state where a coil part of the flat coil element faces the coil mounting area.

Abstract translation: 电路板组件具有安装在电路板上的扁平线圈元件，使得即使当扁平线圈元件与具有大散热器的电路部件一起安装到电路板时也不会产生电力损失。 安装在电路板上的模块具有电子电路装置和附接到电子电路装置的散热器。 散热器具有从电子电路装置突出并且平行于电路板的表面延伸的延伸部分。 在面向延伸部的电路板的一部分上形成没有图形线的线圈安装区域。 扁平线圈元件在扁平线圈元件的线圈部分面向线圈安装区域的状态下平行于电路板安装。