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公开(公告)号:US2763605A
公开(公告)日:1956-09-18
申请号:US51057155
申请日:1955-05-23
发明人: MILLER MIKE A , BAKER COLE D
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公开(公告)号:US1911122A
公开(公告)日:1933-05-23
申请号:US38568429
申请日:1929-08-13
申请人: ELLIS FOSTER CO
发明人: KEYES DONALD B , PHIPPS THOMAS E , WALTER KLABUNDE
IPC分类号: C25D3/44
CPC分类号: C25D3/44
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公开(公告)号:US20230092570A1
公开(公告)日:2023-03-23
申请号:US17795509
申请日:2021-02-16
发明人: Lin XU , David Joseph WETZEL , John DAUGHERTY , Hong SHIH , Satish SRINIVASAN , Yuanping SONG , Johnny PHAM , Yiwei SONG , Christopher KIMBALL
摘要: A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10−6/K. A metal oxide layer is then disposed over a surface of the component body.
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94.
公开(公告)号:US20220119975A1
公开(公告)日:2022-04-21
申请号:US17567327
申请日:2022-01-03
发明人: LEI CHEN
摘要: A coating system for an aluminum component includes a substrate formed from an aluminum material, a zinc or zinc alloy sacrificial layer deposited on the substrate, and an aluminum coating deposited over the zinc or zinc alloy sacrificial layer.
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公开(公告)号:US20220081792A1
公开(公告)日:2022-03-17
申请号:US17534925
申请日:2021-11-24
申请人: Fabric8Labs, Inc.
IPC分类号: C25D1/00 , C25D15/00 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y70/00 , C25D3/12 , C25D3/20 , C25D3/24 , C25D3/40 , C25D3/44 , C25D3/46 , C25D5/04 , C25D5/10 , C25D9/02 , C25D21/12 , C25D3/22 , C25D3/38 , C25D17/12
摘要: An apparatus and method for electrochemically depositing a layer using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data, and for outputting a signal causing an anode array pattern; in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array thereby causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit.
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公开(公告)号:US11164831B2
公开(公告)日:2021-11-02
申请号:US16477701
申请日:2018-01-15
发明人: Won Jin Beom , Sun Hyung Lee , Eun Sil Choi , Ki Deok Song , Hyung Cheol Kim
IPC分类号: B32B15/00 , H01L23/00 , B32B15/01 , B32B15/20 , C23C14/16 , C23C14/34 , C25D3/38 , C25D3/44 , H01L21/48 , H01L23/498
摘要: The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A1) having peeling properties, and a second metal (B1) and third metal (C1) facilitating the plating of the first metal (A1).
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公开(公告)号:US11027535B2
公开(公告)日:2021-06-08
申请号:US15638913
申请日:2017-06-30
发明人: Rogier Sebastiaan Blom , John Freer , Dean Michael Robinson , Subhrajit Roychowdhury , Harry Kirk Mathews, Jr.
IPC分类号: B33Y30/00 , G05B19/4099 , B33Y50/02 , B33Y70/00 , B22F3/105 , C25D21/12 , B22F3/00 , C25D3/44 , C25D17/12
摘要: A manufacturing computer device for dynamically adapting additive manufacturing of a part is configured to store a model of the part including a plurality of build parameters. The manufacturing computer device is also configured to receive current sensor information of at least one current sensor reading of a melt pool from a build of the part in progress. The computer device is further configured to determine one or more attributes of the melt pool based on the current sensor information. Moreover, the computer device is configured to calculate at least one unseen attribute of the melt pool. In addition, the computer device is configured to determine an adjusted build parameter based on the at least one unseen attribute, the one or more attributes, and the plurality of build parameters. The computer device is also configured to transmit the adjusted build parameter to a machine currently manufacturing the part.
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公开(公告)号:US20210156043A1
公开(公告)日:2021-05-27
申请号:US16693613
申请日:2019-11-25
申请人: The Boeing Company
摘要: A method for plating a metallic material onto a titanium substrate, wherein the titanium substrate includes an outer surface and an oxide layer on the outer surface. The method includes chemically etching the outer surface of the titanium substrate to remove at least a portion of the oxide layer, thereby yielding an etched titanium substrate. The method also includes establishing a cathodic protection current through the etched titanium substrate while the etched titanium substrate is immersed in a cathodic electrolyte solution. The method further includes strike plating a bond promoter layer onto the outer surface of the etched titanium substrate after the establishing of the cathodic protection current. The method lastly includes plating the metallic material onto the bond promoter layer.
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公开(公告)号:US20190301034A1
公开(公告)日:2019-10-03
申请号:US16432857
申请日:2019-06-05
申请人: Fabric8Labs, Inc.
IPC分类号: C25D1/00 , C25D15/00 , B33Y70/00 , C25D3/38 , C25D3/22 , C25D3/40 , B33Y30/00 , C25D3/12 , C25D3/20 , C25D3/24 , C25D21/12 , C25D3/44 , C25D3/46 , C25D5/04 , C25D5/10 , C25D9/02 , B33Y10/00 , B33Y50/02 , C25D17/12
摘要: An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern; and, a controller. in communication with the addressing circuit and the anode array, configured to electrically control each anode in the anode array to cause an electrochemical reaction at the cathode that deposits a unitary layer structure according to the anode array pattern signal.
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公开(公告)号:US20190256994A1
公开(公告)日:2019-08-22
申请号:US16074346
申请日:2016-02-16
发明人: Hunaid B. NULWALA , John D. WATKINS , Xu ZHOU
摘要: The disclosure relates to a method for the electrodeposition of at least one metal onto a surface of a conductive substrate. In some embodiments, the electrodeposition is conducted at a temperature from about 10° C. to about 70° C., about 0.5 atm to about 5 atm, in an atmosphere comprising oxygen. In some embodiments, the method comprises electrodepositing the at least one metal via electrochemical reduction of a metal complex dissolved in a substantially aqueous medium.
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