Laser reseal including a protective structure

    公开(公告)号:US10183861B2

    公开(公告)日:2019-01-22

    申请号:US15368740

    申请日:2016-12-05

    申请人: Robert Bosch GmbH

    摘要: A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. An access opening connecting the first cavity to surroundings of the micromechanical component is formed in the substrate or in the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. A layer for protecting the sealed access opening is applied to or deposited on or grown on a material area, which transitions into a liquid aggregate state and then transitions into a solid aggregate state and seals the access opening.

    Multi-pressure MEMS package
    94.
    发明授权

    公开(公告)号:US09695039B1

    公开(公告)日:2017-07-04

    申请号:US15143762

    申请日:2016-05-02

    IPC分类号: H01L21/00 B81B7/04 B81C1/00

    摘要: The present disclosure relates to a microelectromechanical systems (MEMS) package having two MEMS devices with different pressures, and an associated method of formation. In some embodiments, the (MEMS) package includes a device substrate and a cap substrate bonded together. The device substrate includes a first trench and a second trench. A first MEMS device is disposed over the first trench and a second MEMS device is disposed over the second trench. A first stopper is raised from a first trench bottom surface of the first trench but below a top surface of the device substrate and a second stopper is raised from a second trench bottom surface of the second trench but below the top surface of the device substrate. A first depth of the first trench is greater than a second depth of the second trench.

    SYSTEMS AND METHODS FOR MEMS-BASED CROSS-POINT ELECTRICAL SWITCHING
    96.
    发明申请
    SYSTEMS AND METHODS FOR MEMS-BASED CROSS-POINT ELECTRICAL SWITCHING 有权
    用于基于MEMS的交叉点电气开关的系统和方法

    公开(公告)号:US20150076923A1

    公开(公告)日:2015-03-19

    申请号:US14027818

    申请日:2013-09-16

    IPC分类号: B81B7/00 H04Q11/00 B81B7/04

    摘要: A Microelectromechanical systems (MEMS)-based N×M cross-point switch, a MEMS-based system, and a method provide MEMS-based cross-point electrical switching for a Layer 0 flow-based switch. The N×M cross-point switch includes N inputs each at least 10 Gbps, M output each at least 10 Gbps, a plurality of Radio Frequency (RF) MEMS switches selectively interconnecting the N inputs to the M outputs; and control and addressing circuitry to selectively control the plurality of RF MEMS switches to switch each of the N inputs to a corresponding output of the M outputs. The systems and methods provide an electrical switching fabric for flow-based switching of wavelengths that can be part of a Reconfigurable Electrical Add/Drop Multiplexer (READM) with similar functionality as a ROADM in the electronic domain.

    摘要翻译: 基于微机电系统(MEMS)的N×M交叉点开关,基于MEMS的系统和方法为基于层0的基于流的交换机提供基于MEMS的交叉点电气交换。 N×M交叉点开关包括每个至少10Gbps的N个输入,每个至少10Gbps的M个输出;多个射频(RF)MEMS开关,其将N个输入选择性地互连到M个输出; 以及控制和寻址电路,以选择性地控制多个RF MEMS开关以将N个输入中的每一个切换到M个输出的相应输出。 这些系统和方法提供了用于基于流的基于波长的交换的电交换结构,其可以是具有与电子域中的ROADM类似的功能的可重构电附加多路复用器(READM)的一部分。

    MICROCHIP FLUID CONTROL MECHANISM
    97.
    发明申请
    MICROCHIP FLUID CONTROL MECHANISM 审中-公开
    MICROCHIP流体控制机制

    公开(公告)号:US20100112681A1

    公开(公告)日:2010-05-06

    申请号:US12530377

    申请日:2008-03-04

    CPC分类号: G01N35/08

    摘要: Compressed gas is supplied from above to a specimen vessel having an open top. Transfer channels to reaction vessels are provided under a microchip and transfer channels extending from the reaction vessels are provided on the microchip. Transfer element is provided outside the microchip so as to supply the compressed gas from a member (cover) holding the microchip.

    摘要翻译: 压缩气体从上方供给到具有开口顶部的试样容器。 在微芯片下面设置向反应容器的转移通道,并且将从反应容器延伸的转移通道设置在微芯片上。 转移元件设置在微芯片外部,以从保持微芯片的构件(盖)供应压缩气体。

    SYSTEM AND METHOD FOR MEMS ARRAY ACTUATION
    99.
    发明申请
    SYSTEM AND METHOD FOR MEMS ARRAY ACTUATION 有权
    用于MEMS阵列启动的系统和方法

    公开(公告)号:US20090289606A1

    公开(公告)日:2009-11-26

    申请号:US12126698

    申请日:2008-05-23

    IPC分类号: B81B7/04 H02J7/00

    CPC分类号: G09G3/3433 G09G2300/0809

    摘要: An actuator and method for MEMS array actuation is disclosed. In one embodiment, the actuator having a pixel coupled to a charge integration circuit, the pixel comprising a voltage bias, a variable gap capacitor, and a switch, all in series, the charge integration circuit configured to modulate charge on the variable gap capacitor during an actuation cycle. In one embodiment, the MEMS actuator having a unit cell with parasitic capacitance and coupled to a negative feedback sampling circuit, the unit cell comprising a variable gap capacitor, a voltage bias, a modulated current source, and a voltage-to-current converter, the negative feedback sampling circuit configured to receive an output current from the unit cell, convert the output current from the unit cell to a low voltage signal, sample the low voltage signal, and provide a feedback signal to the modulated current source to compensate for the parasitic capacitance in the unit cell.

    摘要翻译: 公开了一种用于MEMS阵列致动的致动器和方法。 在一个实施例中,致动器具有耦合到电荷积分电路的像素,所述像素包括电压偏置,可变间隙电容器和开关,全部是串联的,电荷积分电路被配置为调制可变间隙电容器上的电荷 一个致动循环。 在一个实施例中,MEMS致动器具有具有寄生电容并且耦合到负反馈采样电路的单位单元,该单元包括可变间隙电容器,电压偏置,调制电流源和电压 - 电流转换器, 负反馈采样电路被配置为从单元接收输出电流,将来自单位单元的输出电流转换为低电压信号,对低电压信号进行采样,并向调制电流源提供反馈信号以补偿 单元电池中的寄生电容。

    HIGH FREQUENCY ELECTRICAL ELEMENT
    100.
    发明申请
    HIGH FREQUENCY ELECTRICAL ELEMENT 审中-公开
    高频电器元件

    公开(公告)号:US20090231778A1

    公开(公告)日:2009-09-17

    申请号:US12402031

    申请日:2009-03-11

    IPC分类号: H01G5/16 B81B7/02 B81B7/04

    CPC分类号: H01P1/127 H01H59/0009

    摘要: A high frequency MEMS 1 as a high frequency electrical element has a silicon substrate 2 wholly formed with an insulation film, a first signal line 4 provided on the silicon substrate 2, a second signal line 5 provided on the silicon substrate 2, the second signal line 5 crossing the first signal line 4 within a first region above the silicon substrate 2, and a dielectric film 9 interposed between the first signal line 4 and the second signal line 5, and provided on one of the first signal line 4 and the second signal line 5, within the first region, the first signal line 4 and the second signal line 5 being relatively movable in directions for a contacting approach and a mutual spacing in between.

    摘要翻译: 作为高频电气元件的高频MEMS1具有完全由绝缘膜形成的硅基板2,设置在硅基板2上的第一信号线4,设置在硅基板2上的第二信号线5,第二信号 线5在硅衬底2上方的第一区域内与第一信号线4交叉,以及介于第一信号线4和第二信号线5之间的电介质膜9,并且设置在第一信号线4和第二信号线4之一上 信号线5在第一区域内,第一信号线4和第二信号线5在接触方向的方向和相互间的相互间隔相对移动。