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公开(公告)号:US12067557B2
公开(公告)日:2024-08-20
申请号:US17739473
申请日:2022-05-09
Applicant: Advanced Micro Devices, Inc.
Inventor: Juan José Galán López , Cesar Gomez
CPC classification number: G06Q20/367 , G06Q20/12 , G06Q20/326 , G06Q20/384
Abstract: A method for managing operational costs associated with distributed computing. The method includes: creating, via a graphical user interface (GUI), a distributed computing team; linking a digital team wallet to the distributed computing team, wherein the digital team wallet is linked to a currency account; adding a member to the distributed computing team; allowing the member to purchase compute resource access from a plurality of compute resource providers using the digital team wallet; and notifying a team manager when funds in the digital team wallet reduce to at least a team threshold value.
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公开(公告)号:US20240274549A1
公开(公告)日:2024-08-15
申请号:US18169788
申请日:2023-02-15
Applicant: Advanced Micro Devices, Inc. , ATI Technologies ULC
IPC: H01L23/64 , H01F17/00 , H01F17/04 , H01L23/14 , H01L23/498 , H01L25/065
CPC classification number: H01L23/645 , H01F17/0013 , H01F17/04 , H01L23/145 , H01L23/49822 , H01L23/49838 , H01L25/0655 , H01F2017/002 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16227 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2924/1427 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335
Abstract: An apparatus and method for efficient power management of multiple integrated circuits. An apparatus includes an integrated circuit and a package substrate that includes an embedded inductor. The package substrate includes a glass-reinforced epoxy laminate material. The embedded inductor is formed within a cavity of the package substrate, and includes two negatively coupled inductors connected in a parallel combination. The embedded inductor receives an output voltage generated by a voltage regulator, and conveys this output voltage to a power supply input pin of the integrated circuit. Each of the two negatively coupled inductors utilizes a ferrite core. During a transient voltage condition of the output voltage generated by the voltage regulator, the embedded inductor provides an inductance that is less than an inductance it provides for a steady-state voltage condition of the output voltage generated by the voltage regulator.
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公开(公告)号:US20240273040A1
公开(公告)日:2024-08-15
申请号:US18390893
申请日:2023-12-20
Applicant: Advanced Micro Devices, Inc.
Inventor: Michael Ignatowski , Michael J. Schulte , Gabriel Hsiuwei Loh
IPC: G06F13/16 , G06F1/3234 , G06F3/06
CPC classification number: G06F13/1684 , G06F1/3275 , G06F3/0604 , G06F13/1694
Abstract: Multi-stack compute chip and memory architecture is described. In accordance with the described techniques, a package includes a plurality of computing stacks, and each computing stack includes at least one compute chip and a memory. The package also includes one or more interconnects that couple the computing stacks to at least one other computing stack for sharing the memory in a coherent fashion across the plurality of computing stacks.
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公开(公告)号:US12062126B2
公开(公告)日:2024-08-13
申请号:US17489008
申请日:2021-09-29
Applicant: Advanced Micro Devices, Inc.
Inventor: Todd Martin , Tad Robert Litwiller , Nishank Pathak , Randy Wayne Ramsey
IPC: G06T15/00
CPC classification number: G06T15/005
Abstract: Systems, apparatuses, and methods for loading multiple primitives per thread in a graphics pipeline are disclosed. A system includes a graphics pipeline frontend with a geometry engine, shader processor input (SPI), and a plurality of compute units. The geometry engine generates primitives which are accumulated by the SPI into primitive groups. While accumulating primitives, the SPI tracks the number of vertices and primitives per group. The SPI determines wavefront boundaries based on mapping a single vertex to each thread of the wavefront while allowing more than one primitive per thread. The SPI launches wavefronts with one vertex per thread and potentially multiple primitives per thread. The compute units execute a vertex phase and a multi-cycle primitive phase for wavefronts with multiple primitives per thread.
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公开(公告)号:US12056352B2
公开(公告)日:2024-08-06
申请号:US17955286
申请日:2022-09-28
Applicant: Advanced Micro Devices, Inc.
Inventor: Harris Eleftherios Gasparakis
IPC: G06F3/06
CPC classification number: G06F3/0604 , G06F3/0655 , G06F3/0679
Abstract: Generating optimization instructions for data processing pipelines is described. A pipeline optimization system computes resource usage information that describes memory and compute usage metrics during execution of each stage of the data processing pipeline. The system additionally generates data storage information that describes how data output by each pipeline stage is utilized by other stages of the pipeline. The pipeline optimization system then generates the optimization instructions to control how memory operations are performed for a specific data processing pipeline during execution. In implementations, the optimization instructions cause a memory system to discard data (e.g., invalidate cache entries) without copying the discarded data to another storage location after the data is no longer needed by the pipeline. The optimization instructions alternatively or additionally control at least one of evicting, writing-back, or prefetching data to minimize latency during pipeline execution.
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公开(公告)号:US20240259194A1
公开(公告)日:2024-08-01
申请号:US18212739
申请日:2023-06-22
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Donald Matthews, JR.
CPC classification number: H04L9/0861 , H04L63/0428 , H04L9/3242
Abstract: A computing node in a computing cluster includes at least a key generator and an encryption engine. The key generator implements a key derivation function and generates a first data encryption key based on a key derivation key. The key derivation key is a global security association encryption key shared by a plurality of nodes in the computing cluster. The first data encryption key is unique to a node pair comprising the first node and a second node of the plurality of nodes. The encryption engine encrypts a data packet using the first data encryption key.
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公开(公告)号:US20240258322A1
公开(公告)日:2024-08-01
申请号:US18401038
申请日:2023-12-29
Applicant: Advanced Micro Devices, Inc.
Inventor: Richard T. Schultz
IPC: H01L27/12 , H01L21/84 , H01L27/092 , H01L29/06
CPC classification number: H01L27/1203 , H01L21/84 , H01L27/092 , H01L29/0673
Abstract: A system and method for efficiently creating layout for memory bit cells are described. In various implementations, cells of a library use Cross field effect transistors (FETs) that include vertically stacked gate all around (GAA) transistors with conducting channels oriented in an orthogonal direction between them. The channels of the vertically stacked transistors use opposite doping polarities. A first category of cells includes devices where each of the two devices in a particular vertical stack receive a same input signal. The second category of cells includes devices where the two devices in a particular vertical stack receive different input signals. The cells of the second category have a larger height dimension than the cells of the first category.
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公开(公告)号:US12051154B2
公开(公告)日:2024-07-30
申请号:US17562751
申请日:2021-12-27
Applicant: Advanced Micro Devices, Inc.
Inventor: Anirudh R. Acharya , Ruijin Wu
CPC classification number: G06T17/10 , G06T1/20 , G06T15/005 , G06T15/40
Abstract: Systems and methods for distributed rendering using two-level binning include processing primitives of a frame to be rendered at a first graphics processing unit (GPU) chiplet in a set of GPU chiplets to generate visibility information of primitives for each coarse bin and providing the visibility information to the other GPU chiplets in the set of GPU chiplets. Each coarse bin is then assigned to one of the GPU chiplets of the set of GPU chiplets and rendered at the assigned GPU chiplet based on the corresponding visibility information.
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公开(公告)号:US20240249996A1
公开(公告)日:2024-07-25
申请号:US18099949
申请日:2023-01-22
Applicant: Advanced Micro Devices, Inc.
Inventor: Michael FLYNN , Otto JOE
IPC: H01L23/42 , H01L21/48 , H01L23/00 , H01L23/367 , H01L25/065
CPC classification number: H01L23/42 , H01L21/4817 , H01L23/3675 , H01L24/16 , H01L24/73 , H01L25/0655 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311
Abstract: A method and apparatus are provided which manages the movement of thermal interface material (TIM) squeezed out from between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes an IC die mounted on a substrate and covered by a lid. A bottom surface of the lid has a die overlapped region facing a top surface of the IC die. The bottom surface of the lid has a first gutter formed therein. An outer sidewall of the first gutter is formed outward of the first die overlapped region as to receive TIM squeezed out from between a lid and an IC die.
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公开(公告)号:US12045182B1
公开(公告)日:2024-07-23
申请号:US18298587
申请日:2023-04-11
Applicant: Advanced Micro Devices, Inc.
Inventor: Eric Christopher Morton , Pravesh Gupta , Bryan P Broussard , Li Ou
CPC classification number: G06F13/24 , G06F9/30101 , G06F9/4812 , G06F9/4818 , G06F9/4831 , G06F13/26 , G06F13/4221
Abstract: A computing system may implement a low priority arbitration interrupt method that includes receiving a message signaled interrupt (MSI) message from an input output hub (I/O hub) transmitted over an interconnect fabric, selecting a processor to interrupt from a cluster of processors based on arbitration parameters, and communicating an interrupt service routine to the selected processor, wherein the I/O hub and the cluster of processors are located within a common domain.
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