公开(公告)号：USRE42112E1

公开(公告)日：2011-02-08

申请号：US11652468

申请日：2007-01-11

Applicant: Kwan-Young Han ,  Do-Hyung Kim ,  Seung-Man Yang ,  Chung-Hoon Lee ,  Hong-San Kim ,  Kwang-Il Park

Inventor： Kwan-Young Han ,  Do-Hyung Kim ,  Seung-Man Yang ,  Chung-Hoon Lee ,  Hong-San Kim ,  Kwang-Il Park

IPC: H01L29/22

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.

Abstract translation: 具有宽视角的芯片发光二极管及其制造方法。 芯片发光二极管具有密封具有至少一个弯曲突出部分的发光芯片的树脂封装。 弯曲的突出部分具有基本上是半圆形的或基本上或部分是椭圆形或抛物线形的横截面。 弯曲的突出部分优选地具有由多条直线组成的横截面，在相邻线之间形成一角度。 横截面是细长的以形成树脂封装的圆柱形外表面。

公开(公告)号：US20100330714A1

公开(公告)日：2010-12-30

申请号：US12881657

申请日：2010-09-14

Applicant: Jung Hwa JUNG ,  Chung Hoon LEE

Inventor： Jung Hwa JUNG ,  Chung Hoon LEE

IPC: H01L21/56 ,  B29C45/14 ,  H01L33/52

CPC classification number: H01L21/565 ,  B29C33/10 ,  B29C39/006 ,  B29C39/10 ,  B29C39/26 ,  B29C45/14655 ,  B29C45/34 ,  B29L2011/00 ,  H01L23/49861 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.

Abstract translation: 提供了用于形成模制构件的模具和使用其形成模制构件的方法。 模具包括上表面和具有外周表面和由外周围包围的凹面的下表面。 注射和排出孔从上表面延伸到下表面。 因此，在模具和包装件联接成使得排出孔向上指向之后，可以通过从注射孔注入成型材料而在包装上形成成型构件，由此可以防止气泡被捕获 模制构件。

公开(公告)号：US07842959B2

公开(公告)日：2010-11-30

申请号：US12819154

申请日：2010-06-18

Applicant: Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L29/18 ,  H01L23/48 ,  H01L33/00

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

公开(公告)号：US20100244060A1

公开(公告)日：2010-09-30

申请号：US12819154

申请日：2010-06-18

Applicant: Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L33/62

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光器件包括形成在衬底上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US07804098B2

公开(公告)日：2010-09-28

申请号：US11571499

申请日：2005-06-29

Applicant: Chung-Hoon Lee ,  Keon-Young Lee ,  Lacroix Yves

Inventor： Chung-Hoon Lee ,  Keon-Young Lee ,  Lacroix Yves

IPC: H01L29/18

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/08 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.

Abstract translation: 本发明涉及具有排列单元的发光元件，其制造方法和使用其的发光器件。 本发明提供一种发光元件及其制造方法，所述发光元件包括发光单元块，所述发光单元块具有串联或并联连接在单个基板上的多个发光单元，其中，所述多个发光单元中的每一个包括 N型半导体层和P型半导体层，并且一个发光单元的N型半导体层电连接到另一相邻发光单元的P型半导体层。 此外，本发明提供一种发光装置，其包括具有串联连接的多个发光单元的发光元件。 因此，能够简化能够与家用AC电源一起使用的照明用发光元件的制造工序，能够减少在制造照明用发光元件时发生的不合格率，并大量生产光 用于照明的发光装置。 此外，通过在发光元件外部设置预定的整流电路，可以提高交流动作的直流驱动效率。

公开(公告)号：US20100224904A1

公开(公告)日：2010-09-09

申请号：US12782287

申请日：2010-05-18

Applicant: Chung Hoon LEE ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

Inventor： Chung Hoon LEE ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

IPC: H01L33/62 ,  H01L33/64 ,  H01L33/52

CPC classification number: H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Abstract translation: 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

公开(公告)号：US07748873B2

公开(公告)日：2010-07-06

申请号：US11576882

申请日：2005-10-07

Applicant: Do-Hyung Kim ,  Chung-Hoon Lee ,  Keon-Young Lee ,  Kwang-Il Park

Inventor： Do-Hyung Kim ,  Chung-Hoon Lee ,  Keon-Young Lee ,  Kwang-Il Park

IPC: F21V5/00

CPC classification number: G02B19/0071 ,  G02B19/0028 ,  G02B19/0061 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.

Abstract translation: 本发明涉及一种侧面照明透镜及其使用该发光装置的发光装置，其特征在于，具有相对于所述主体的中心轴线具有全反射斜率的全身反射面以及直线和/或弯曲的折射面 形成为从全反射表面的周边延伸; 以及包括该透镜的发光装置。 根据本发明，具有具有不同斜率的全内反射表面以及线性和/或弯曲折射表面的透镜允许从发光芯片向前发射的光被引导到透镜的一侧。 此外，在透镜的边缘上形成在垂直于或平行于透镜的中心轴线的方向上形成的线性表面，从而便于制造透镜的工艺，从而降低了缺陷率 和镜头的制造成本。

公开(公告)号：US20100102337A1

公开(公告)日：2010-04-29

申请号：US12607644

申请日：2009-10-28

Applicant: Chung-Hoon Lee ,  Dae Won Kim ,  Dae Sung Kal ,  Won Cheol Seo ,  Kyung Hee Ye ,  Yeo Jin Yoon

Inventor： Chung-Hoon Lee ,  Dae Won Kim ,  Dae Sung Kal ,  Won Cheol Seo ,  Kyung Hee Ye ,  Yeo Jin Yoon

IPC: H01L33/00

CPC classification number: H01L27/153 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/48 ,  H05B33/0821

Abstract: The present invention discloses a light emitting diode (LED) including a plurality of light emitting cells arranged on a substrate. The LED includes half-wave light emitting units each including at least one light emitting cell, each half-wave light emitting unit including first and second terminals respectively arranged at both ends thereof; and full-wave light emitting units each including at least one light emitting cell, each full-wave light emitting units including third and fourth terminals respectively formed at both ends thereof. The third terminal of each full-wave light emitting unit is electrically connected to the second terminals of two half-wave light emitting units, and the fourth terminal of each full-wave light emitting unit is electrically connected to the first terminals of other two half-wave light emitting units. Also, a first half-wave light emitting unit is connected in series between the third terminal of a first full-wave light emitting unit and the fourth terminal of a second full-wave light emitting units, and a second half-wave light emitting units is connected in series between the fourth terminal of the first full-wave light emitting unit and the third terminal of the second full-wave light emitting unit.

公开(公告)号：US20100096977A1

公开(公告)日：2010-04-22

申请号：US12581507

申请日：2009-10-19

Applicant: Chung Hoon LEE ,  Yeo Jin Yoon ,  Dae Won Kim ,  Dae Sung Kal ,  Kyung Hee Ye

Inventor： Chung Hoon LEE ,  Yeo Jin Yoon ,  Dae Won Kim ,  Dae Sung Kal ,  Kyung Hee Ye

IPC: H01J1/62

CPC classification number: H01L33/504 ,  F21K9/00 ,  F21K9/62 ,  F21K9/64 ,  F21V23/06 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48137 ,  H01L2224/49107 ,  H05B33/0821

Abstract: Disclosed are an AC light emitting device with a long-persistent phosphor and an AC light emitting device module having the same. According to an exemplary embodiment of the present invention, the light emitting device includes a first light emitting diode chip and a second light emitting diode chip, each of which has a plurality of light emitting cells on a single substrate. Further, a first long-persistent phosphor is positioned on the first light emitting diode chip to perform wavelength conversion for a portion of light emitted from the first light emitting diode chip; and a second long-persistent phosphor is positioned on the second light emitting diode chip to perform wavelength conversion for a portion of light emitted from the second light emitting diode chip. The afterglow luminescence resulted from the second long-persistent phosphor is allowed to be different from that resulted from the first long-persistent phosphor, whereby a flicker effect of the AC light emitting device can be more alleviated.

Abstract translation: 公开了具有长持久性荧光体和具有该荧光体的AC发光器件模块的交流发光器件。 根据本发明的示例性实施例，发光器件包括第一发光二极管芯片和第二发光二极管芯片，每个芯片在单个基板上具有多个发光单元。 此外，第一长持续荧光体位于第一发光二极管芯片上，以对从第一发光二极管芯片发射的光的一部分进行波长转换; 并且第二长持续荧光体位于第二发光二极管芯片上，以对从第二发光二极管芯片发射的光的一部分进行波长转换。 使得由第二长持续荧光体产生的余辉发光与第一长持续荧光体不同，从而可以进一步减轻AC发光器件的闪烁效应。

公开(公告)号：US20090267085A1

公开(公告)日：2009-10-29

申请号：US11908112

申请日：2005-10-26

Applicant: Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

Inventor： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

IPC: H01L33/00

CPC classification number: H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Abstract translation: 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。